公开(公告)号：US07615479B1

公开(公告)日：2009-11-10

申请号：US11159526

申请日：2005-06-22

申请人： Gordon S. W. Craig ,  Mark A. Hadley ,  Susan Swindlehurst ,  Ali A. Tootoonchi ,  Eric Kanemoto ,  Eric Jonathan Snyder ,  Scott Herrmann ,  Glenn Gengel ,  Lily Liong

发明人： Gordon S. W. Craig ,  Mark A. Hadley ,  Susan Swindlehurst ,  Ali A. Tootoonchi ,  Eric Kanemoto ,  Eric Jonathan Snyder ,  Scott Herrmann ,  Glenn Gengel ,  Lily Liong

IPC分类号： H01L21/4763 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/31

CPC分类号： G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07756 ,  H01L23/66 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/53178 ,  H01L2224/82 ,  H01L2224/83851 ,  H01L2924/00

摘要： An electronic assembly. The assembly includes a substrate, a plurality of recessed regions, and a plurality of functional blocks. Each functional block is deposited in one of the recessed regions. A substantial amount of the plurality of functional blocks is recessed below a top surface of the substrate. Substantial amount is defined by any one of less than 10% of said functional blocks protrudes above the top surface of the substrate; less than 1% of the functional blocks protrudes above the top surface of the substrate; more than 90% of the functional blocks are recessed below the top surface of the substrate; or more than 99% of the functional blocks are recessed below the top surface of the substrate.

摘要翻译： 电子组装。 组件包括衬底，多个凹陷区域和多个功能块。 每个功能块沉积在一个凹陷区域中。 大量的多个功能块被凹入到衬底的顶表面之下。 基本上限是由少于10％的所述功能块中的任何一个突出于衬底的顶表面之上; 少于1％的功能块突出于衬底的顶表面之上; 超过90％的功能块凹陷在基板的顶表面下方; 或超过99％的功能块凹陷在基板的顶表面下方。

公开(公告)号：US07214569B2

公开(公告)日：2007-05-08

申请号：US10769572

申请日：2004-01-30

申请人： Susan Swindlehurst ,  Mark A. Hadley ,  Paul S. Drzaic ,  Gordon S. W. Craig ,  Glenn Gengel ,  Scott Hermann ,  Aly Tootoochi ,  Randolph W. Eisenhardt

发明人： Susan Swindlehurst ,  Mark A. Hadley ,  Paul S. Drzaic ,  Gordon S. W. Craig ,  Glenn Gengel ,  Scott Hermann ,  Aly Tootoochi ,  Randolph W. Eisenhardt

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： G06K19/07752 ,  G06K19/077 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/24 ,  H01L24/29 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L24/95 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13499 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/76155 ,  H01L2224/81201 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2224/81903 ,  H01L2224/82102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83865 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/3011 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.

摘要翻译： 包含小特征尺寸和大特征尺寸组件的装置。 该装置包括带状物，其带有包含集成电路的基板。 集成电路耦合到设置在基板上的第一导体。 第一导体由包括导电填料的热固性或热塑性材料制成。 具有第二导体的大规模部件电耦合到第一导体，以将大尺寸部件电耦合到集成电路。 大规模部件包括第二基板。

公开(公告)号：US07353598B2

公开(公告)日：2008-04-08

申请号：US11268837

申请日：2005-11-07

申请人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Randolph W. Eisenhardt ,  Scott Herrmann ,  Mark A. Hadley ,  Paul S. Drzaic

发明人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Randolph W. Eisenhardt ,  Scott Herrmann ,  Mark A. Hadley ,  Paul S. Drzaic

IPC分类号： H05K3/32

CPC分类号： G06K19/07752 ,  G06K19/07749 ,  H01L23/49855 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82

摘要： Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.

摘要翻译： 电子组件的方法和装置。 在一个或多个选定区域上将材料选择性地印刷在网状基材上。 网状基板包括具有集成电路的多个功能部件。 使用配备有分配所选材料的打印头的本地打印系统进行打印。 打印头连接到能够在纸幅基材上记录对准特征的引导系统。

公开(公告)号：US07542301B1

公开(公告)日：2009-06-02

申请号：US11159574

申请日：2005-06-22

申请人： Lily Liong ,  Kenneth D. Schatz ,  Gordon Craig ,  Mark A. Hadley ,  Eric Kanemoto

发明人： Lily Liong ,  Kenneth D. Schatz ,  Gordon Craig ,  Mark A. Hadley ,  Eric Kanemoto

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/24 ,  H01L24/95 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/0014 ,  H05K3/321 ,  H05K3/368 ,  H05K2201/09036 ,  H05K2201/0949 ,  H05K2201/09827 ,  H05K2201/10674 ,  H05K2201/10727 ,  H05K2203/0108 ,  H05K2203/0143 ,  H05K2203/1545 ,  H01L2224/82 ,  H01L2924/00

摘要： An embossing die, the die comprises one or more protruding features configured to create one or more corresponding recessed regions in a substrate; and a left side edge and a right side edge. Either the left side edge or the right side edge is a gradually sloping edge. The embossing die can be used to form an assembly. The assembly comprises a substrate including a more than one defined frames. Each of the defined frames comprises a plurality of recessed regions and a plurality of functional blocks, each functional block being deposited in one of the recessed regions. Each of the defined frames is separated from another frame by a region. The region can be a flattened region, a sloped region, or a plateau shaped region having a plateau top and two sloped sides, wherein each sloped side forms about 10-15 degree angle to a surface of the substrate.

摘要翻译： 压模包括一个或多个突出特征，其被配置为在基底中产生一个或多个相应的凹陷区域; 以及左侧边缘和右侧边缘。 左侧边缘或右侧边缘都是逐渐倾斜的边缘。 压花模具可用于形成组件。 组件包括包括多于一个定义的框架的基板。 每个定义的框架包括多个凹陷区域和多个功能块，每个功能块被沉积在一个凹进区域中。 每个定义的帧与另一个帧分开一个区域。 该区域可以是具有平台顶部和两个倾斜侧面的扁平区域，倾斜区域或平台形区域，其中每个倾斜侧面与基底的表面形成约10-15度的角度。

公开(公告)号：US07967204B2

公开(公告)日：2011-06-28

申请号：US12248020

申请日：2008-10-08

申请人： Mark A. Hadley ,  Curt L. Carrender ,  John Stephen Smith ,  Gordon S. W. Craig

发明人： Mark A. Hadley ,  Curt L. Carrender ,  John Stephen Smith ,  Gordon S. W. Craig

IPC分类号： G06K7/08

CPC分类号： G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07756 ,  H01L23/66 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/53178 ,  H01L2224/82 ,  H01L2224/83851 ,  H01L2924/00

摘要： A Radio Frequency Identification (RFID) device. The RFID device comprises an antenna assembly and a resonator assembly. The antenna assembly comprises a first substrate and an antenna element. The resonator assembly comprises a second substrate having an integrated circuit connected to a resonator loop. The first substrate and the second substrate are attached to one another. The integrated circuit electrically couples to the antenna element without a direct mechanical contact.

摘要翻译： 射频识别（RFID）设备。 RFID设备包括天线组件和谐振器组件。 天线组件包括第一基板和天线元件。 谐振器组件包括具有连接到谐振器回路的集成电路的第二衬底。 第一基板和第二基板彼此附接。 集成电路电耦合到天线元件而不直接机械接触。

公开(公告)号：US07931063B2

公开(公告)日：2011-04-26

申请号：US11820603

申请日：2007-06-19

申请人： Gordon S. W. Craig ,  Kenneth D. Schatz ,  Mark A. Hadley ,  Paul S. Drzaic

发明人： Gordon S. W. Craig ,  Kenneth D. Schatz ,  Mark A. Hadley ,  Paul S. Drzaic

IPC分类号： B32B37/00

CPC分类号： G06K19/07718 ,  G06K19/07745 ,  H01L21/673 ,  H01L21/6835 ,  H01L23/49855 ,  H01L23/544 ,  H01L24/19 ,  H01L24/76 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2223/54473 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/7665 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/95085 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K3/303 ,  H05K2201/10636 ,  H05K2203/0173 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/17 ,  Y10T156/171 ,  Y10T156/1744 ,  Y10T156/1798 ,  H01L2924/00

摘要： A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.

摘要翻译： 一种组装装置的方法。 该方法包括将功能元件放置在形成于模板衬底中的第一开口中，并将功能元件转移到具有形成在其中的第二开口的器件衬底，其中功能元件保持在第二开口内并抵靠与该器件相连的粘合膜 基质。

公开(公告)号：US06623579B1

公开(公告)日：2003-09-23

申请号：US09432291

申请日：1999-11-02

申请人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

发明人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

IPC分类号： B05D312

CPC分类号： H01L24/32 ,  B82Y30/00 ,  H01L21/31122 ,  H01L21/32136 ,  H01L21/84 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/1214 ,  H01L28/55 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15788 ,  Y10S977/882 ,  Y10S977/883 ,  H01L2224/82 ,  H01L2924/00

摘要： Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element, and wherein the slurry also includes a second plurality of elements which are not designed to mate with receptor regions on the substrate. Typically, these second plurality of elements help movement of the first plurality of elements. A method according to another aspect of the invention includes dispensing in a flow having a first direction a slurry onto a substrate, wherein the slurry includes a fluid and a plurality of elements, each of which is designed to mate with a receptor region on the substrate and each of which includes a functional element, and vibrating substrate in a second direction which is substantially perpendicular to the first direction. A method according to another aspect of the invention includes creating a slurry comprising of fluid and a plurality of elements, each of which is designed to mate with a receptor region on the substrate and each of which comprises a functional element, and projecting the slurry through a nozzle toward the substrate. In one particular implementation of this aspect, additional nozzles may be used to provide suction or additional fluid or additional slurry. A method according to another aspect of the invention includes dissolving a bonding agent into a solvent to create a fluid, dispensing a slurry onto a substrate, wherein the slurry includes the fluid and a plurality of elements each of which is designed to mate with a receptor region on the substrate and each of which comprises a functional element, and evaporating the solvent after each of the plurality of elements has mated with a corresponding receptor, wherein the bonding agent bonds each of the plurality of elements to the corresponding receptor region.

公开(公告)号：US06281038B1

公开(公告)日：2001-08-28

申请号：US09270165

申请日：1999-03-16

申请人： Jeffrey Jay Jacobsen ,  Mark A. Hadley ,  Gordon S. W. Craig

发明人： Jeffrey Jay Jacobsen ,  Mark A. Hadley ,  Gordon S. W. Craig

IPC分类号： H01L2144

CPC分类号： H01L24/95 ,  H01L21/2007 ,  H01L24/97 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/3255 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/00

摘要： Methods and devices are claimed wherein blocks with integrated circuits thereon are rolled or pressed into recessed regions of a flexible or rigid substrate which is used in forming displays. Rolling the blocks into the substrate may take place in either a batch operation or in a continuous process.

摘要翻译： 所要求的方法和装置，其中具有集成电路的块被卷入或压入用于形成显示器的柔性或刚性基底的凹陷区域中。 将块滚动到基底中可以以批次操作或连续过程进行。

公开(公告)号：US07172910B2

公开(公告)日：2007-02-06

申请号：US11169534

申请日：2005-06-28

申请人： Mark A. Hadley ,  Ann Chiang ,  Gordon S. W. Craig ,  Jeffrey Jay Jacobsen ,  John Stephen Smith ,  Jay Tu ,  Roger Green Stewart

发明人： Mark A. Hadley ,  Ann Chiang ,  Gordon S. W. Craig ,  Jeffrey Jay Jacobsen ,  John Stephen Smith ,  Jay Tu ,  Roger Green Stewart

IPC分类号： H01L21/00

CPC分类号： H01L27/1214 ,  G02F1/133305 ,  G02F1/1362 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/7665 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95145 ,  H01L2224/97 ,  H01L2251/5338 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01S5/0201 ,  H01L2224/82 ,  H01L2924/00

摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming an assembly using different sized blocks in either a flexible or rigid substrate.

摘要翻译： 要求保护用于形成显示器的装置和方法。 本发明的一个实施例涉及使用不同尺寸的块在柔性或刚性基底中形成组件。

公开(公告)号：US07141176B1

公开(公告)日：2006-11-28

申请号：US10206686

申请日：2002-07-25

申请人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Paul F. Nealey

发明人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Paul F. Nealey

IPC分类号： H01L21/00 ,  B44C1/22

CPC分类号： H01L24/32 ,  B82Y30/00 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L27/1214 ,  H01L29/66772 ,  H01L29/78603 ,  H01L29/78654 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/15788 ,  H01L2224/82 ,  H01L2924/00

摘要： Methods and apparatuses for assembling elements onto a substrate. The surfaces of the elements and/or the substrate are treated and the elements are dispensed over the substrate in a slurry. In one example of the invention, the substrate is exposed to a surface treatment fluid to create a surface on the substrate which has a selected one of a hydrophilic or a hydrophobic nature, and a slurry is dispensed over the substrate. The slurry includes a fluid and a plurality of elements (each of which includes a functional component). Each of the plurality of elements is designed to be received by a receptor region on the substrate. The dispensing of the slurry with the fluid occurs after the substrate is exposed to the surface treatment fluid, and the fluid is the selected one of a hydrophilic or a hydrophobic nature. In another example of the invention, a plurality of elements is exposed to a surface treatment fluid to create surfaces on the elements having a selected one of a hydrophilic or a hydrophobic nature. A slurry is dispensed over a substrate, wherein the slurry contains a fluid and the plurality of elements which are designed to be received by a plurality of receptor regions. The fluid is the selected one of a hydrophilic or hydrophobic nature. In another example of an aspect of the invention, a surfactant is used with a slurry having elements which are deposited onto receptor regions in a fluidic self assembly process. Other examples of methods are also described.

摘要翻译： 将元件组装到基板上的方法和装置。 元件和/或基底的表面被处理并且元件以浆料分配在基底上。 在本发明的一个实例中，将衬底暴露于表面处理流体，以在衬底上形成具有亲水或疏水性质选择的表面，并且将浆料分配在衬底上。 浆料包括流体和多个元件（每个元件包括功能部件）。 多个元件中的每一个被设计成由衬底上的受体区域接收。 浆料与流体的分配发生在基材暴露于表面处理流体之后，并且流体是亲水或疏水性质中选择的一种。 在本发明的另一个实例中，多个元件暴露于表面处理流体，以在具有亲水或疏水性质的选定元件的元件上产生表面。 将浆料分配在基材上，其中浆料包含流体，并且多个元件被设计为被多个受体区域接收。 流体是亲水或疏水性质中选出的一种。 在本发明的一个方面的另一个实例中，使用具有在流体自组装方法中沉积到受体区上的元素的浆料的表面活性剂。 还描述了其它方法的实例。