-
公开(公告)号：US07615479B1
公开(公告)日：2009-11-10
申请号：US11159526
申请日：2005-06-22
申请人： Gordon S. W. Craig , Mark A. Hadley , Susan Swindlehurst , Ali A. Tootoonchi , Eric Kanemoto , Eric Jonathan Snyder , Scott Herrmann , Glenn Gengel , Lily Liong
发明人： Gordon S. W. Craig , Mark A. Hadley , Susan Swindlehurst , Ali A. Tootoonchi , Eric Kanemoto , Eric Jonathan Snyder , Scott Herrmann , Glenn Gengel , Lily Liong
IPC分类号： H01L21/4763 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/31
CPC分类号： G06K19/07718 , G06K19/07749 , G06K19/07752 , G06K19/07756 , H01L23/66 , H01L24/19 , H01L24/24 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/50 , H01L29/0657 , H01L2223/6677 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/76155 , H01L2224/82102 , H01L2224/83136 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/10158 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , Y10T29/53178 , H01L2224/82 , H01L2224/83851 , H01L2924/00
摘要： An electronic assembly. The assembly includes a substrate, a plurality of recessed regions, and a plurality of functional blocks. Each functional block is deposited in one of the recessed regions. A substantial amount of the plurality of functional blocks is recessed below a top surface of the substrate. Substantial amount is defined by any one of less than 10% of said functional blocks protrudes above the top surface of the substrate; less than 1% of the functional blocks protrudes above the top surface of the substrate; more than 90% of the functional blocks are recessed below the top surface of the substrate; or more than 99% of the functional blocks are recessed below the top surface of the substrate.
摘要翻译： 电子组装。 组件包括衬底，多个凹陷区域和多个功能块。 每个功能块沉积在一个凹陷区域中。 大量的多个功能块被凹入到衬底的顶表面之下。 基本上限是由少于10％的所述功能块中的任何一个突出于衬底的顶表面之上; 少于1％的功能块突出于衬底的顶表面之上; 超过90％的功能块凹陷在基板的顶表面下方; 或超过99％的功能块凹陷在基板的顶表面下方。
-
2.发明授权Apparatus incorporating small-feature-size and large-feature-size components and method for making same 有权具有小特征尺寸和大特征尺寸部件的装置及其制造方法公开(公告)号：US07214569B2
公开(公告)日：2007-05-08
申请号：US10769572
申请日：2004-01-30
申请人： Susan Swindlehurst , Mark A. Hadley , Paul S. Drzaic , Gordon S. W. Craig , Glenn Gengel , Scott Hermann , Aly Tootoochi , Randolph W. Eisenhardt
发明人： Susan Swindlehurst , Mark A. Hadley , Paul S. Drzaic , Gordon S. W. Craig , Glenn Gengel , Scott Hermann , Aly Tootoochi , Randolph W. Eisenhardt
CPC分类号： G06K19/07752 , G06K19/077 , H01L23/49855 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/24 , H01L24/29 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/90 , H01L24/95 , H01L24/97 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/13019 , H01L2224/13099 , H01L2224/1319 , H01L2224/13499 , H01L2224/16225 , H01L2224/16227 , H01L2224/24011 , H01L2224/2402 , H01L2224/24137 , H01L2224/24225 , H01L2224/24227 , H01L2224/29101 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/73104 , H01L2224/73204 , H01L2224/76155 , H01L2224/81201 , H01L2224/81205 , H01L2224/81207 , H01L2224/81224 , H01L2224/81801 , H01L2224/81898 , H01L2224/81903 , H01L2224/82102 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/83865 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/95085 , H01L2224/95136 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/10158 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/3011 , H01L2224/82 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/05599
摘要： An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.
摘要翻译： 包含小特征尺寸和大特征尺寸组件的装置。 该装置包括带状物，其带有包含集成电路的基板。 集成电路耦合到设置在基板上的第一导体。 第一导体由包括导电填料的热固性或热塑性材料制成。 具有第二导体的大规模部件电耦合到第一导体，以将大尺寸部件电耦合到集成电路。 大规模部件包括第二基板。
-
3.发明授权Strap assembly comprising functional block deposited therein and method of making same 有权包括其中沉积的功能块的带组件及其制造方法公开(公告)号：US07452748B1
公开(公告)日：2008-11-18
申请号：US11159550
申请日：2005-06-22
IPC分类号： H01L21/44
CPC分类号： G06K19/07718 , G06K19/07749 , G06K19/07752 , G06K19/07756 , H01L23/66 , H01L24/19 , H01L24/24 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/50 , H01L29/0657 , H01L2223/6677 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/76155 , H01L2224/82102 , H01L2224/83136 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/10158 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , Y10T29/53178 , H01L2224/82 , H01L2224/83851 , H01L2924/00
摘要： Methods and apparatuses for an electronic assembly. The method comprises depositing a functional block into a recessed region, forming dielectric layer selectively over at least one of a selected portion of the functional block and a selected portion of the first substrate; and forming one or more electrical interconnections to the functional block. The recessed region is formed on a first substrate. The depositing of the functional block occurs on a continuous web line and using a Fluidic Self Assembly process. The functional block has a width-depth aspect ratio that substantially matches a width-depth aspect ratio of said recessed region which is one of equal to or less than 10.5:1, and equal to or less than 7.5:1.
摘要翻译： 电子组件的方法和装置。 该方法包括将功能块沉积到凹陷区域中，选择性地在功能块的选定部分和第一基底的选定部分中的至少一个上形成介电层; 以及形成一个或多个电互连到所述功能块。 凹部区域形成在第一基板上。 功能块的沉积发生在连续的纤维网线上并使用流体自组装过程。 功能块具有与所述凹陷区域的宽度 - 深度纵横比基本上一致的宽度 - 深度纵横比，其宽度比等于或小于10.5:1，等于或小于7.5:1。
-
4.发明申请STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND METHOD OF MAKING SAME 审中-公开包含功能块的带状组件及其制造方法公开(公告)号：US20090056113A1
公开(公告)日：2009-03-05
申请号：US12268413
申请日：2008-11-10
CPC分类号： G06K19/07718 , G06K19/07749 , G06K19/07752 , G06K19/07756 , H01L23/66 , H01L24/19 , H01L24/24 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/50 , H01L29/0657 , H01L2223/6677 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/76155 , H01L2224/82102 , H01L2224/83136 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/10158 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , Y10T29/53178 , H01L2224/82 , H01L2224/83851 , H01L2924/00
摘要： Methods and apparatuses for an electronic assembly. The method comprises depositing a functional block into a recessed region, forming dielectric layer selectively over at least one of a selected portion of the functional block and a selected portion of the first substrate; and forming one or more electrical interconnections to the functional block. The recessed region is formed on a first substrate. The depositing of the functional block occurs on a continuous web line and using a Fluidic Self Assembly process. The functional block has a width-depth aspect ratio that substantially matches a width-depth aspect ratio of said recessed region which is one of equal to or less than 10.5:1, and equal to or less than 7.5:1.
摘要翻译： 电子组件的方法和装置。 该方法包括将功能块沉积到凹陷区域中，选择性地在功能块的选定部分和第一基底的选定部分中的至少一个上形成介电层; 以及形成一个或多个电互连到所述功能块。 凹部区域形成在第一基板上。 功能块的沉积发生在连续的纤维网线上并使用流体自组装过程。 功能块具有与所述凹陷区域的宽度 - 深度纵横比基本上一致的宽度 - 深度纵横比，其宽度比等于或小于10.5:1，等于或小于7.5:1。
-
5.发明申请公开(公告)号：US20070117274A1
公开(公告)日：2007-05-24
申请号：US11654312
申请日：2007-01-16
申请人： Susan Swindlehurst , Mark Hadley , Paul Drzaic , Gordon Craig , Glenn Gengel , Scott Herrmann , Aly Tootoochi , Randolph Eisenhardt
发明人： Susan Swindlehurst , Mark Hadley , Paul Drzaic , Gordon Craig , Glenn Gengel , Scott Herrmann , Aly Tootoochi , Randolph Eisenhardt
IPC分类号： H01L21/00
CPC分类号： G06K19/07752 , G06K19/077 , H01L23/49855 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/24 , H01L24/29 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/90 , H01L24/95 , H01L24/97 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/13019 , H01L2224/13099 , H01L2224/1319 , H01L2224/13499 , H01L2224/16225 , H01L2224/16227 , H01L2224/24011 , H01L2224/2402 , H01L2224/24137 , H01L2224/24225 , H01L2224/24227 , H01L2224/29101 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/73104 , H01L2224/73204 , H01L2224/76155 , H01L2224/81201 , H01L2224/81205 , H01L2224/81207 , H01L2224/81224 , H01L2224/81801 , H01L2224/81898 , H01L2224/81903 , H01L2224/82102 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/83865 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/95085 , H01L2224/95136 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/10158 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/3011 , H01L2224/82 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/05599
摘要： An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.
-
公开(公告)号：US20050181641A1
公开(公告)日：2005-08-18
申请号：US11054037
申请日：2005-02-08
申请人： Anno Hermanns , Randolph Eisenhardt , Glenn Gengel
发明人： Anno Hermanns , Randolph Eisenhardt , Glenn Gengel
CPC分类号： H01L23/5387 , H01L27/3241 , H01L27/3276 , H01L2924/0002 , H01L2924/12044 , H01L2924/3011 , H05K3/0035 , H05K3/4038 , H01L2924/00
摘要： A flexible electronic, Radio Frequency Identification (RF ID) or display device and methods of making the same. The flexible electronic, Radio Frequency Identification (RF ID) or display device comprises a flexible substrate having a top surface and a bottom surface. The top surface comprises electrical components. The flexible substrate comprises openings cutting therethrough from the top surface to the bottom surface. A conductive layer is coupled to the flexible substrate wherein the openings expose at least a portion of the conductive layer. The openings are filled with conductive elements to make first electrical contacts to at least a portion of the conductive layer and second electrical contacts to the electrical components on the flexible substrate.
-
公开(公告)号：US20050270757A1
公开(公告)日：2005-12-08
申请号：US11188149
申请日：2005-07-22
申请人： Thomas Credelle , Glenn Gengel , Roger Stewart , William Joseph
发明人： Thomas Credelle , Glenn Gengel , Roger Stewart , William Joseph
IPC分类号： G06K19/07 , G06K19/077 , H01L29/06 , H05K1/11 , H05K1/14 , H05K1/18 , H05K3/22 , H05K3/32 , H05K7/02
CPC分类号： H01L24/96 , G06K19/07749 , G06K19/0775 , G06K19/07752 , G06K19/07779 , G06K19/07783 , H01L24/24 , H01L24/82 , H01L24/95 , H01L29/0657 , H01L2224/24137 , H01L2224/24227 , H01L2224/95085 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10158 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01Q1/2208 , H01Q7/00 , H05K1/141 , H05K1/183 , H05K3/222 , H05K3/321 , H05K2201/10477 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/4913 , Y10T29/49204 , H01L2924/00
摘要： Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.
摘要翻译： 电子组件的方法和装置。 电子组件具有从主体衬底产生并分离的第一对象。 第一个对象在其中具有第一电路。 载体基板耦合到第一物体，其中第一物体正在凹陷在载体基底的表面下方。 载体基板还包括第一载体连接焊盘和使用金属连接器与第一对象互连的第二载体连接焊盘。 接收基板，其基本上是平面的，包括第二电路，第一接收连接焊盘和与使用金属连接器与第二电路互连的第二接收连接焊盘。 使用所述连接焊盘将载体衬底耦合到接收衬底。
-
公开(公告)号：US08516683B2
公开(公告)日：2013-08-27
申请号：US12502888
申请日：2009-07-14
CPC分类号： H01L24/96 , G06K19/07749 , G06K19/0775 , G06K19/07752 , G06K19/07779 , G06K19/07783 , H01L24/24 , H01L24/82 , H01L24/95 , H01L29/0657 , H01L2224/24137 , H01L2224/24227 , H01L2224/95085 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10158 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01Q1/2208 , H01Q7/00 , H05K1/141 , H05K1/183 , H05K3/222 , H05K3/321 , H05K2201/10477 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/4913 , Y10T29/49204 , H01L2924/00
摘要： Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.
摘要翻译： 电子组件的方法和装置。 电子组件具有从主体衬底产生并分离的第一对象。 第一个对象在其中具有第一电路。 载体基板耦合到第一物体，其中第一物体正在凹陷在载体基底的表面下方。 载体基板还包括第一载体连接焊盘和使用金属连接器与第一对象互连的第二载体连接焊盘。 接收基板，其基本上是平面的，包括第二电路，第一接收连接焊盘和与使用金属连接器与第二电路互连的第二接收连接焊盘。 使用所述连接焊盘将载体衬底耦合到接收衬底。
-
公开(公告)号：US07559131B2
公开(公告)日：2009-07-14
申请号：US11824959
申请日：2007-07-02
CPC分类号： H01L24/96 , G06K19/07749 , G06K19/0775 , G06K19/07752 , G06K19/07779 , G06K19/07783 , H01L24/24 , H01L24/82 , H01L24/95 , H01L29/0657 , H01L2224/24137 , H01L2224/24227 , H01L2224/95085 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10158 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01Q1/2208 , H01Q7/00 , H05K1/141 , H05K1/183 , H05K3/222 , H05K3/321 , H05K2201/10477 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/4913 , Y10T29/49204 , H01L2924/00
摘要： Methods of making a radio frequency identification (RFID) tag. A flexible strap is provided by disposing a plurality of RFID chips on a first web of flexible material and removing the flexible strap from the first web and attaching the flexible strap to an antenna on a flexible substrate.
摘要翻译： 制作射频识别（RFID）标签的方法。 通过将多个RFID芯片设置在第一柔性材料纤维网上并从第一纤维网移除柔性带并将柔性带连接到柔性基底上的天线来提供柔性带。
-
10.发明授权公开(公告)号：US06985361B2
公开(公告)日：2006-01-10
申请号：US10952201
申请日：2004-09-27
CPC分类号： H01L24/96 , G06K19/07749 , G06K19/0775 , G06K19/07752 , G06K19/07779 , G06K19/07783 , H01L24/24 , H01L24/82 , H01L24/95 , H01L29/0657 , H01L2224/24137 , H01L2224/24227 , H01L2224/95085 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10158 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01Q1/2208 , H01Q7/00 , H05K1/141 , H05K1/183 , H05K3/222 , H05K3/321 , H05K2201/10477 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/4913 , Y10T29/49204 , H01L2924/00
摘要： Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.
摘要翻译： 电子组件的方法和装置。 电子组件具有从主体衬底产生并分离的第一对象。 第一个对象在其中具有第一电路。 载体基板耦合到第一物体，其中第一物体正在凹陷在载体基底的表面下方。 载体基板还包括第一载体连接焊盘和使用金属连接器与第一对象互连的第二载体连接焊盘。 接收基板，其基本上是平面的，包括第二电路，第一接收连接焊盘和与使用金属连接器与第二电路互连的第二接收连接焊盘。 使用所述连接焊盘将载体衬底耦合到接收衬底。
-
-
-
-
-
-
-
-
-
搜索结果
17 条记录 (耗时 0.037 秒)
