公开(公告)号：US07615479B1

公开(公告)日：2009-11-10

申请号：US11159526

申请日：2005-06-22

申请人： Gordon S. W. Craig ,  Mark A. Hadley ,  Susan Swindlehurst ,  Ali A. Tootoonchi ,  Eric Kanemoto ,  Eric Jonathan Snyder ,  Scott Herrmann ,  Glenn Gengel ,  Lily Liong

发明人： Gordon S. W. Craig ,  Mark A. Hadley ,  Susan Swindlehurst ,  Ali A. Tootoonchi ,  Eric Kanemoto ,  Eric Jonathan Snyder ,  Scott Herrmann ,  Glenn Gengel ,  Lily Liong

IPC分类号： H01L21/4763 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/31

CPC分类号： G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07756 ,  H01L23/66 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/53178 ,  H01L2224/82 ,  H01L2224/83851 ,  H01L2924/00

摘要： An electronic assembly. The assembly includes a substrate, a plurality of recessed regions, and a plurality of functional blocks. Each functional block is deposited in one of the recessed regions. A substantial amount of the plurality of functional blocks is recessed below a top surface of the substrate. Substantial amount is defined by any one of less than 10% of said functional blocks protrudes above the top surface of the substrate; less than 1% of the functional blocks protrudes above the top surface of the substrate; more than 90% of the functional blocks are recessed below the top surface of the substrate; or more than 99% of the functional blocks are recessed below the top surface of the substrate.

摘要翻译： 电子组装。 组件包括衬底，多个凹陷区域和多个功能块。 每个功能块沉积在一个凹陷区域中。 大量的多个功能块被凹入到衬底的顶表面之下。 基本上限是由少于10％的所述功能块中的任何一个突出于衬底的顶表面之上; 少于1％的功能块突出于衬底的顶表面之上; 超过90％的功能块凹陷在基板的顶表面下方; 或超过99％的功能块凹陷在基板的顶表面下方。

公开(公告)号：US07452748B1

公开(公告)日：2008-11-18

申请号：US11159550

申请日：2005-06-22

申请人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Scott Herrmann ,  Glenn Gengel ,  Randy Eisenhardt

发明人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Scott Herrmann ,  Glenn Gengel ,  Randy Eisenhardt

IPC分类号： H01L21/44

CPC分类号： G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07756 ,  H01L23/66 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/53178 ,  H01L2224/82 ,  H01L2224/83851 ,  H01L2924/00

摘要： Methods and apparatuses for an electronic assembly. The method comprises depositing a functional block into a recessed region, forming dielectric layer selectively over at least one of a selected portion of the functional block and a selected portion of the first substrate; and forming one or more electrical interconnections to the functional block. The recessed region is formed on a first substrate. The depositing of the functional block occurs on a continuous web line and using a Fluidic Self Assembly process. The functional block has a width-depth aspect ratio that substantially matches a width-depth aspect ratio of said recessed region which is one of equal to or less than 10.5:1, and equal to or less than 7.5:1.

摘要翻译： 电子组件的方法和装置。 该方法包括将功能块沉积到凹陷区域中，选择性地在功能块的选定部分和第一基底的选定部分中的至少一个上形成介电层; 以及形成一个或多个电互连到所述功能块。 凹部区域形成在第一基板上。 功能块的沉积发生在连续的纤维网线上并使用流体自组装过程。 功能块具有与所述凹陷区域的宽度 - 深度纵横比基本上一致的宽度 - 深度纵横比，其宽度比等于或小于10.5:1，等于或小于7.5:1。

公开(公告)号：US07353598B2

公开(公告)日：2008-04-08

申请号：US11268837

申请日：2005-11-07

申请人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Randolph W. Eisenhardt ,  Scott Herrmann ,  Mark A. Hadley ,  Paul S. Drzaic

发明人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Randolph W. Eisenhardt ,  Scott Herrmann ,  Mark A. Hadley ,  Paul S. Drzaic

IPC分类号： H05K3/32

CPC分类号： G06K19/07752 ,  G06K19/07749 ,  H01L23/49855 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82

摘要： Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.

摘要翻译： 电子组件的方法和装置。 在一个或多个选定区域上将材料选择性地印刷在网状基材上。 网状基板包括具有集成电路的多个功能部件。 使用配备有分配所选材料的打印头的本地打印系统进行打印。 打印头连接到能够在纸幅基材上记录对准特征的引导系统。

公开(公告)号：US20090056113A1

公开(公告)日：2009-03-05

申请号：US12268413

申请日：2008-11-10

申请人： Gordon S.W. Craig ,  Ali A. Tootoonchi ,  Scott Herrmann ,  Glenn Gengel ,  Randy Eisenhardt

发明人： Gordon S.W. Craig ,  Ali A. Tootoonchi ,  Scott Herrmann ,  Glenn Gengel ,  Randy Eisenhardt

IPC分类号： B23P19/00 ,  H01L21/00

CPC分类号： G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07756 ,  H01L23/66 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/53178 ,  H01L2224/82 ,  H01L2224/83851 ,  H01L2924/00

摘要： Methods and apparatuses for an electronic assembly. The method comprises depositing a functional block into a recessed region, forming dielectric layer selectively over at least one of a selected portion of the functional block and a selected portion of the first substrate; and forming one or more electrical interconnections to the functional block. The recessed region is formed on a first substrate. The depositing of the functional block occurs on a continuous web line and using a Fluidic Self Assembly process. The functional block has a width-depth aspect ratio that substantially matches a width-depth aspect ratio of said recessed region which is one of equal to or less than 10.5:1, and equal to or less than 7.5:1.

摘要翻译： 电子组件的方法和装置。 该方法包括将功能块沉积到凹陷区域中，选择性地在功能块的选定部分和第一基底的选定部分中的至少一个上形成介电层; 以及形成一个或多个电互连到所述功能块。 凹部区域形成在第一基板上。 功能块的沉积发生在连续的纤维网线上并使用流体自组装过程。 功能块具有与所述凹陷区域的宽度 - 深度纵横比基本上一致的宽度 - 深度纵横比，其宽度比等于或小于10.5:1，等于或小于7.5:1。

公开(公告)号：US20070117274A1

公开(公告)日：2007-05-24

申请号：US11654312

申请日：2007-01-16

申请人： Susan Swindlehurst ,  Mark Hadley ,  Paul Drzaic ,  Gordon Craig ,  Glenn Gengel ,  Scott Herrmann ,  Aly Tootoochi ,  Randolph Eisenhardt

发明人： Susan Swindlehurst ,  Mark Hadley ,  Paul Drzaic ,  Gordon Craig ,  Glenn Gengel ,  Scott Herrmann ,  Aly Tootoochi ,  Randolph Eisenhardt

IPC分类号： H01L21/00

CPC分类号： G06K19/07752 ,  G06K19/077 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/24 ,  H01L24/29 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L24/95 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13499 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/76155 ,  H01L2224/81201 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2224/81903 ,  H01L2224/82102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83865 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/3011 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.

公开(公告)号：US20060117554A1

公开(公告)日：2006-06-08

申请号：US10997608

申请日：2004-11-23

申请人： Scott Herrmann ,  Mark Hadley ,  Gordon Craig ,  John Hattick ,  Paul Drzaic ,  Eric Kanemoto

发明人： Scott Herrmann ,  Mark Hadley ,  Gordon Craig ,  John Hattick ,  Paul Drzaic ,  Eric Kanemoto

IPC分类号： H01Q17/00 ,  G08B13/14 ,  H01R43/00

CPC分类号： G06K19/07735 ,  G06K19/077 ,  G08B13/244 ,  H01Q17/004 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49124

摘要： Methods and apparatuses for the protection of radio frequency identification (RFID) devices are described. In one aspect, a static dissipative material is applied to a web of antenna structures. A coating of the static dissipative material is applied continuously across a plurality of antenna structures of a roll of the web material. An RFID integrated circuit (IC) is attached to the web of antenna structures with the dissipative coating, then subsequently tested on the roll. Additional processing is performed to the RFID tag to produce an RFID label.

摘要翻译： 描述了用于保护射频识别（RFID）设备的方法和设备。 在一个方面，静电消散材料被应用于天线结构的腹板。 静电消散材料的涂层连续地施加在卷筒材料卷的多个天线结构上。 将RFID集成电路（IC）连接到具有耗散涂层的天线结构网上，随后在辊上进行测试。 执行对RFID标签的附加处理以产生RFID标签。

公开(公告)号：US20060148166A1

公开(公告)日：2006-07-06

申请号：US11268837

申请日：2005-11-07

申请人： Gordon Craig ,  Ali Tootoonchi ,  Randolph Eisenhardt ,  Scott Herrmann ,  Mark Hadley ,  Paul Drzaic

发明人： Gordon Craig ,  Ali Tootoonchi ,  Randolph Eisenhardt ,  Scott Herrmann ,  Mark Hadley ,  Paul Drzaic

IPC分类号： H01L21/8238

CPC分类号： G06K19/07752 ,  G06K19/07749 ,  H01L23/49855 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82

摘要： Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.

摘要翻译： 电子组件的方法和装置。 在一个或多个选定区域上将材料选择性地印刷在网状基材上。 网状基板包括具有集成电路的多个功能部件。 使用配备有分配所选材料的打印头的本地打印系统进行打印。 打印头连接到能够在纸幅基材上记录对准特征的引导系统。