Diamond broad band mirror system and method

    公开(公告)号:US10725214B2

    公开(公告)日:2020-07-28

    申请号:US15891419

    申请日:2018-02-08

    IPC分类号: G02B5/08 G21K1/06 G02B1/14

    摘要: A broad band mirror system and method, wherein the system includes a mechanical substrate layer, a reflective metal layer on the mechanical substrate level, and a diamond layer, and the method includes the steps of selecting a sacrificial substrate layer, depositing a diamond layer on the substrate layer, smoothing a first surface of the diamond layer, depositing a reflective metal layer on the diamond layer, bonding a mechanical substrate to the diamond layer, removing the sacrificial substrate level, and smoothing a second diamond surface.

    Advanced RF enhancement-mode FETs with improved gate properties
    2.
    发明授权
    Advanced RF enhancement-mode FETs with improved gate properties 有权
    先进的RF增强型FET,具有改进的栅极性能

    公开(公告)号:US06893947B2

    公开(公告)日:2005-05-17

    申请号:US10179769

    申请日:2002-06-25

    摘要: A method for fabricating an RF enhancement mode FET (30) having improved gate properties is provided. The method comprises the steps of providing (131) a substrate (31) having a stack of semiconductor layers (32-35) formed thereon, the stack including a cap layer (35) and a central layer (33) defining a device channel, forming (103) a photoresist pattern (58) over the cap layer, thereby defining a masked region and an unmasked region, and, in any order, (a) creating (105) an implant region (36, 37) in the unmasked region, and (b) removing (107) the cap layer from the unmasked region. By forming the implant region and cap region with no overlap, a device with low current leakage may be achieved.

    摘要翻译: 提供了一种制造具有改进的栅极特性的RF增强型FET(30)的方法。 该方法包括以下步骤:提供(131)具有形成在其上的半导体层(32-35)的堆叠的衬底(31),所述堆叠包括限定器件沟道的覆盖层(35)和中心层(33) 在所述盖层上形成(103)光致抗蚀剂图案(58),由此限定掩蔽区域和未掩蔽区域,并且以任何顺序,(a)在所述未掩蔽区域中产生(105)植入区域(36,37) ,和(b)从未掩蔽区域移除(107)盖层。 通过不重叠地形成注入区域和盖子区域,可以实现具有低电流泄漏的装置。

    GRAPHENE BASED PHOBIC COATING ON CARBON

    公开(公告)号:US20210039988A1

    公开(公告)日:2021-02-11

    申请号:US16932620

    申请日:2020-07-17

    IPC分类号: C03C17/36

    摘要: Disclosed herein is method for fabricating a graphene layer on a non-graphene carbon layer including steps of cleaning and seeding a substrate, depositing a crystalline diamond on the substrate, sputtering an aluminum layer on the crystalline diamond, where the aluminum layer is greater than 5 nanometers and less than 50 nanometers; and treating a surface of the aluminum layer with an ion beam resulting in a graphene layer on the crystalline diamond.

    Signal configuration based transmitter adjustment in wireless communication devices
    4.
    发明申请
    Signal configuration based transmitter adjustment in wireless communication devices 有权
    基于信号配置的无线通信设备中的发射机调整

    公开(公告)号:US20060068830A1

    公开(公告)日:2006-03-30

    申请号:US10954583

    申请日:2004-09-30

    IPC分类号: H04Q7/20

    摘要: A method in a wireless communication transmitter including a baseband processor (310) that dynamically configures the transmitter for a particular signal configuration, and a headroom controller (350) for adjusting transmitter headroom based on the particular signal configuration. In one embodiment, the PA headroom is controlled based on a power metric, for example, a 3rd order polynomial or peak to average ratio (PAR) metric, that is a function of the signal configuration. In another embodiment the PA headroom is adjusted using information in a look up table.

    摘要翻译: 一种无线通信发射机中的方法,包括基于特定信号配置动态配置发射机的基带处理器(310)和用于基于特定信号配置来调整发射机余量的裕量控制器(350)。 在一个实施例中,基于诸如信号配置的函数的功率度量,例如3阶多项式或峰值平均比(PAR)度量来控制PA余量。 在另一个实施例中,使用查找表中的信息来调整PA净空。

    Low power consumption adaptive power amplifier
    5.
    发明申请
    Low power consumption adaptive power amplifier 有权
    低功耗自适应功率放大器

    公开(公告)号:US20050030094A1

    公开(公告)日:2005-02-10

    申请号:US10634610

    申请日:2003-08-05

    摘要: A power amplification circuit (10) includes a scalable power amplifier (20) to produce an RF output signal (50) at an output of the power amplification circuit (10), and a variable impedance circuit (30) coupled to the output of the power amplification circuit (10). The scalable power amplifier (20) includes a plurality of selectively activated amplifier elements (22), (24), (26) to produce the RF output signal (50) in accordance with a desired RF output signal power level. The power amplification circuit (10) selectively activates individual amplifier elements by, for example reducing power or increasing power to at least one amplifier element. The variable impedance circuit (30) varies an impedance of the variable impedance circuit (30) to dynamically load the output of the scalable power amplifier(20).

    摘要翻译: 功率放大电路(10)包括可扩展功率放大器(20),以在功率放大电路(10)的输出处产生RF输出信号(50),以及可变阻抗电路(30),耦合到所述功率放大电路 功率放大电路(10)。 可扩展功率放大器(20)包括多个选择性激活的放大器元件(22),(24),(26),以根据期望的RF输出信号功率电平产生RF输出信号(50)。 功率放大电路(10)通过例如降低功率或增加至少一个放大器元件的功率来选择性地激活各个放大器元件。 可变阻抗电路(30)改变可变阻抗电路(30)的阻抗,以动态地加载可伸缩功率放大器(20)的输出。

    Semiconductor device using a barrier layer between the gate electrode and substrate and method therefor
    6.
    发明授权
    Semiconductor device using a barrier layer between the gate electrode and substrate and method therefor 有权
    在栅电极和衬底之间使用阻挡层的半导体器件及其方法

    公开(公告)号:US06521961B1

    公开(公告)日:2003-02-18

    申请号:US09560737

    申请日:2000-04-28

    IPC分类号: H01L3106

    摘要: An enhancement mode semiconductor device has a barrier layer disposed between the gate electrode of the device and the semiconductor substrate underlying the gate electrode. The barrier layer increases the Schottky barrier height of the gate electrode-barrier layer-substrate interface so that the portion of the substrate underlying the gate electrode operates in an enhancement mode. The barrier layer is particularly useful ill compound semiconductor field effect transistors, and preferred materials for the barrier layer include aluminum gallium arsenide and indium gallium arsenide.

    摘要翻译: 增强型半导体器件具有设置在器件的栅极电极和栅极电极下方的半导体衬底之间的势垒层。 阻挡层增加了栅电极 - 阻挡层 - 衬底界面的肖特基势垒高度,使得栅电极下面的衬底的部分以增强模式工作。 阻挡层是特别有用的化合物半导体场效应晶体管,并且阻挡层的优选材料包括砷化铝镓和砷化铟镓。

    Method for forming a metal pattern on a substrate
    8.
    发明授权
    Method for forming a metal pattern on a substrate 失效
    在基板上形成金属图案的方法

    公开(公告)号:US5830774A

    公开(公告)日:1998-11-03

    申请号:US667013

    申请日:1996-06-24

    CPC分类号: H01L21/0331

    摘要: A method for forming a metal pattern on a substrate (11) includes forming a dielectric stack (14) on a major surface (12) of the substrate (11) and forming a mask (22) on the dielectric stack (14). The dielectric stack (14) includes an aluminum nitride layer (16) serving as an etch stop layer between two dielectric layers (15, 17). An opening is formed in the dielectric stack (14) via successive etching. The etching of the dielectric layer (15) between the aluminum nitride layer (16) and the substrate (11) undercuts the aluminum nitride layer (16). A metal layer (30) is deposited on the major surface through the opening via sputtering. The metal layer (30) on the major surface is distinctively separated from a metal layer (34) on the edge of the opening. The mask (22) is dissolved in a solvent, thereby lifting-off a metal layer (34) deposited on the mask (22).

    摘要翻译: 在基板(11)上形成金属图案的方法包括在基板(11)的主表面(12)上形成介质叠层(14),并在介质叠层(14)上形成掩模(22)。 电介质堆叠(14)包括用作两个电介质层(15,17)之间的蚀刻停止层的氮化铝层(16)。 通过连续蚀刻在电介质堆叠(14)中形成开口。 在氮化铝层(16)和衬底(11)之间的介电层(15)的蚀刻使氮化铝层(16)下切。 通过溅射通过开口沉积在主表面上的金属层(30)。 主表面上的金属层(30)与开口边缘上的金属层(34)有明显的分离。 将掩模(22)溶解在溶剂中,从而剥离沉积在掩模(22)上的金属层(34)。