Peg-board mounted, bin support bracket apparatus
    2.
    发明申请
    Peg-board mounted, bin support bracket apparatus 失效
    挂板安装,支架支架装置

    公开(公告)号:US20050189308A1

    公开(公告)日:2005-09-01

    申请号:US11065506

    申请日:2005-02-24

    CPC classification number: A47F5/0823

    Abstract: A bin support bracket apparatus is provided for mounting in holes in a peg board and includes a pair of support rods, wherein each support rod includes top hole-engaging means and a bracket-supporting portion which extends downward from the top hole-engaging means. In addition, a bin-support bracket is connected between the support rods. Preferably, the bin-support bracket also includes a forwardly and upwardly projecting bin-support flange portion. One or more storage bins are supported by the bin-support bracket. Each storage bin includes a lip which engages the bin-support flange portion for supporting the storage bin on the bin-support bracket. In addition, the bin-support bracket includes a forwardly and downwardly projecting bin-levelling flange portion which keeps a supported storage bin in a vertical orientation.

    Abstract translation: 提供了一种用于安装在钉板中的孔中的托架托架装置,并且包括一对支撑杆,其中每个支撑杆包括顶孔接合装置和从顶孔接合装置向下延伸的支架支撑部分。 另外,在支撑杆之间连接有箱支撑支架。 优选地,料仓支撑托架还包括向前和向上突出的料仓支撑凸缘部分。 一个或多个存储箱由支架支架支撑。 每个存储箱包括唇缘,该唇缘接合箱支撑凸缘部分,用于支撑箱支撑托架上的存储箱。 此外,货箱支撑支架包括向前和向下突出的料斗平整法兰部分,其将支撑的仓库保持在垂直取向。

    Low noise method for interconnecting analog and digital integrated
circuits
    6.
    发明授权
    Low noise method for interconnecting analog and digital integrated circuits 失效
    用于互连模拟和数字集成电路的低噪声方法

    公开(公告)号:US6163197A

    公开(公告)日:2000-12-19

    申请号:US370886

    申请日:1999-08-10

    CPC classification number: H03K19/018528

    Abstract: An apparatus and method for interconnecting digital and analog circuitry on separate substrates within a single integrated chip package attenuates logic level signals on one substrate, transmits the attenuated signals to another substrate, and amplifies the attenuated signals back to logic level signals.

    Abstract translation: 用于将单个集成芯片封装内的单独衬底上的数字和模拟电路互连的装置和方法衰减一个衬底上的逻辑电平信号,将衰减的信号传输到另一个衬底,并将衰减的信号放大回逻辑电平信号。

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