-
公开(公告)号：US08822841B2
公开(公告)日：2014-09-02
申请号：US13411168
申请日：2012-03-02
申请人： Dong Gyu Lee , Jin Won Choi , Sung Won Jeong , Dae Young Lee , Gi Sub Lee , Jin Ho Kim
发明人： Dong Gyu Lee , Jin Won Choi , Sung Won Jeong , Dae Young Lee , Gi Sub Lee , Jin Ho Kim
CPC分类号： H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0346 , H01L2224/0347 , H01L2224/0401 , H01L2224/05572 , H01L2224/05647 , H01L2224/10145 , H01L2224/1146 , H01L2224/11849 , H01L2224/13022 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/014 , Y10T29/49165 , H01L2924/00012 , H01L2924/01028 , H01L2924/01046 , H01L2924/01083 , H01L2224/05552
摘要： Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.
摘要翻译： 这里公开了一种封装基板及其制造方法。 封装衬底包括：衬底，其包括至少一个导电焊盘，形成在衬底上的绝缘层，并且包括导电焊盘暴露的开口，沿着通过开口暴露的导电焊盘的顶表面形成的防泡层， 绝缘层的侧壁，由至少一种合金材料制成并形成在防泡层上的金属柱以及形成在金属柱上的热扩散防止膜。
-
公开(公告)号：US08766450B2
公开(公告)日：2014-07-01
申请号：US12805559
申请日：2010-08-05
申请人： Ki Taek Lee , Hueng Jae Oh , Sung Won Jeong , Gi Sub Lee , Jin Won Choi
发明人： Ki Taek Lee , Hueng Jae Oh , Sung Won Jeong , Gi Sub Lee , Jin Won Choi
IPC分类号： H01L23/28
CPC分类号： H01L23/49811 , H01L23/49805 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.
摘要翻译： 提供了一种用于封装基板的引脚，包括：连接销插入形成在外部基板中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。
-
公开(公告)号：US20120267285A1
公开(公告)日：2012-10-25
申请号：US13411168
申请日：2012-03-02
申请人： Dong Gyu LEE , Jin Won Choi , Sung Won Jeong , Dae Young Lee , Gi Sub Lee , Jin Ho Kim
发明人： Dong Gyu LEE , Jin Won Choi , Sung Won Jeong , Dae Young Lee , Gi Sub Lee , Jin Ho Kim
CPC分类号： H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0346 , H01L2224/0347 , H01L2224/0401 , H01L2224/05572 , H01L2224/05647 , H01L2224/10145 , H01L2224/1146 , H01L2224/11849 , H01L2224/13022 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/014 , Y10T29/49165 , H01L2924/00012 , H01L2924/01028 , H01L2924/01046 , H01L2924/01083 , H01L2224/05552
摘要： Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.
摘要翻译： 这里公开了一种封装基板及其制造方法。 封装衬底包括：衬底，其包括至少一个导电焊盘，形成在衬底上的绝缘层，并且包括导电焊盘暴露的开口，沿着通过开口暴露的导电焊盘的顶表面形成的防泡层， 绝缘层的侧壁，由至少一种合金材料制成并形成在防泡层上的金属柱以及形成在金属柱上的热扩散防止膜。
-
公开(公告)号：US20110068473A1
公开(公告)日：2011-03-24
申请号：US12805559
申请日：2010-08-05
申请人： Ki Taek Lee , Hueng Jae OH , Sung Won Jeong , Gi Sub Lee , Jin Won Choi
发明人： Ki Taek Lee , Hueng Jae OH , Sung Won Jeong , Gi Sub Lee , Jin Won Choi
IPC分类号： H01L23/498 , H01B5/00
CPC分类号： H01L23/49811 , H01L23/49805 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.
摘要翻译： 提供了一种用于封装基板的引脚，包括：连接销插入形成在外部基板中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。
-
-
-
搜索结果
4 条记录 (耗时 0.011 秒)
