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13 条记录 (耗时 0.033 秒)

    Exposure method and exposure apparatus
    1.
    发明授权
    Exposure method and exposure apparatus 失效
    曝光方法和曝光装置

    公开(公告)号：US5025284A

    公开(公告)日：1991-06-18

    申请号：US577632

    申请日：1990-09-05

    申请人： Susumu Komoriya ,  Hiroshi Nishizuka ,  Shinya Nakagawa ,  Hisashi Maejima

    发明人： Susumu Komoriya ,  Hiroshi Nishizuka ,  Shinya Nakagawa ,  Hisashi Maejima

    IPC分类号： H01L21/30 ,  G03F7/20 ,  G03F7/207 ,  H01L21/027

    CPC分类号： G03F7/70933 ,  G03F7/70241 ,  G03F7/70258 ,  G03F7/70883

    摘要： The invention deals with an exposure apparatus which detects environmental conditions such as atmospheric pressure, temperature and humidity in which the exposure apparatus is placed, and which maintains the projected magnification constant at all times based upon the detected values, so that the pattern can be reproduced precisely. Concretely, the apparatus comprises a detector to detect at least one of the tube temperature of the optical projecting system, humidity or atmospheric pressure near the optical system, and a control unit which controls optical characteristics based upon the signals detected by the detector. Namely, the control unit adjusts the optical characteristics depending upon the environmental conditions thereby to adjust variation in the projecting magnification and/or variation in the focal position. Thus, variation in the optical characteristics is adjusted to transfer the pattern maintaining high precision.

    Method of and apparatus for aligning photomask
    3.
    发明授权
    Method of and apparatus for aligning photomask 失效
    光掩模对准方法和设备

    公开(公告)号：US4218136A

    公开(公告)日：1980-08-19

    申请号：US943651

    申请日：1978-09-19

    申请人： Susumu Komoriya ,  Koyo Morita ,  Hiroshi Nishizuka ,  Hisashi Maejima

    发明人： Susumu Komoriya ,  Koyo Morita ,  Hiroshi Nishizuka ,  Hisashi Maejima

    IPC分类号： H01L21/027 ,  G03F7/20 ,  G03B27/20

    CPC分类号： G03F7/70691

    摘要： A method of making a mask and a wafer intimately contact each other by means of such a mask aligning apparatus comprising a base having a chamber, a piston apparatus movable up and down in the chamber, a wafer chuck provided at one end of the piston apparatus and adapted to fix the wafer, means for fixing the mask to the upper surface of the wafer in a superposed relationship, drive means adapted to impart a driving force to the piston, so as to move the wafer toward the mask, and means for biasing the piston apparatus in the direction to move the wafer away from the mask. The method comprises the steps of bringing the wafer by the drive means into positive contact with the mask fixed by the fixing means, sealing the wafer in an airtight manner in cooperation with the mask, lowering the pressure of the atmosphere around the wafer below atmospheric pressure, so as to cause a bending of the mask from the fixed position, to thereby cause the wafer to contact pressingly the central area of the mask, and expelling gas from the wafer chuck so as to make the entire region of the wafer intimately contact the mask.By adopting the method and apparatus of the invention, it is possible to smoothly bring the mask and wafer into intimate contact with each other, without adversely affecting the previously obtained mutual alignment of these two members. At the same time, the separation of the mask and the wafer from each other, after the contact and exposure, can be made in a shorter time. As a result, damaging of the mask pattern in the course of the mask alignment is avoided, and the yield of the wafer product is much improved.

    摘要翻译： 通过这样的掩模对准装置制造掩模和晶片的方法彼此紧密接触，该掩模对准装置包括具有室的基座，在腔室中上下移动的活塞装置，设置在活塞装置的一端的晶片卡盘 并且适于固定所述晶片，用于以叠加关系将所述掩模固定到所述晶片的上表面的装置，适于向所述活塞施加驱动力的驱动装置，以使所述晶片朝向所述掩模移动;以及用于偏置的装置 所述活塞装置沿使所述晶片远离所述掩模的方向移动。 该方法包括以下步骤：通过驱动装置使晶片与由固定装置固定的掩模正接触，与掩模协作密封晶片，气密的方式将晶片的压力降低到低于大气压 ，从而使掩模从固定位置弯曲，从而使晶片按压接触掩模的中心区域，并从晶片卡盘排出气体，以使晶片的整个区域紧密接触 面具。 通过采用本发明的方法和装置，可以平滑地使掩模和晶片彼此紧密接触，而不会不利地影响先前获得的这两个部件的相互对准。 同时，在接触和曝光之后，掩模和晶片彼此分离可以在更短的时间内进行。 结果，避免了在掩模对准过程中损害掩模图案，并且晶片产品的产量大大提高。

    Semiconductor integrated circuit device fabrication method and its fabrication apparatus
    4.
    发明授权
    Semiconductor integrated circuit device fabrication method and its fabrication apparatus 失效
    半导体集成电路器件制造方法及其制造装置

    公开(公告)号：US5497331A

    公开(公告)日：1996-03-05

    申请号：US257262

    申请日：1994-06-08

    申请人： Nobuyuki Iriki ,  Tsutomu Okabe ,  Kenji Watanabe ,  Hisashi Maejima ,  Shinji Kuniyoshi

    发明人： Nobuyuki Iriki ,  Tsutomu Okabe ,  Kenji Watanabe ,  Hisashi Maejima ,  Shinji Kuniyoshi

    IPC分类号： H01L21/677 ,  G05B13/02 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30 ,  H01L21/66 ,  G06F19/00 ,  G06F17/60

    CPC分类号： H01L22/20 ,  Y10S706/90 ,  Y10S706/904

    摘要： A semiconductor integrated circuit device fabrication technique improves the accuracy of element qualities by considering the influence of interaction of element quality parameters in the quality control of semiconductor fabrication processes and also by improving the product yield estimation accuracy so that the production efficiency can be improved. An initial value of a membership function is first set and then a plurality of element quality parameters and a combined quality parameter are expressed by membership functions in fuzzy control in a semiconductor fabrication apparatus for automating a fabrication method by connecting a computer with various measuring instruments and various processors by communication devices. Moreover, the combined quality parameters are fuzzy-inferred from the element quality parameters using these membership functions, inference rules are adjusted by data of the actual processes, the membership functions of the obtained element quality parameters are converted into an element quality control standard, and the semiconductor integrated circuit device fabrication processes are controlled in accordance with the standard.

    摘要翻译： 半导体集成电路器件制造技术通过考虑元件质量参数在半导体制造工艺的质量控制中的相互作用的影响以及通过提高产品产量估算精度来提高元件质量的精度，从而可以提高生产效率。 首先设置隶属度函数的初始值，然后在半导体制造装置中通过模糊控制中的隶属函数表示多个元素质量参数和组合质量参数，用于通过将计算机与各种测量仪器连接来自动化制造方法，以及 各种处理器由通信设备。 此外，使用这些隶属函数从元素质量参数中模糊组合的质量参数，推理规则由实际过程的数据进行调整，所获得的元素质量参数的隶属函数被转换为元素质量控制标准， 根据标准控制半导体集成电路器件制造工艺。

    Exposure method and exposure apparatus
    5.
    发明授权
    Exposure method and exposure apparatus 失效
    曝光方法和曝光装置

    公开(公告)号：US4699505A

    公开(公告)日：1987-10-13

    申请号：US742786

    申请日：1985-06-10

    申请人： Susumu Komoriya ,  Hiroshi Nishizuka ,  Shinya Nakagawa ,  Hisashi Maejima

    发明人： Susumu Komoriya ,  Hiroshi Nishizuka ,  Shinya Nakagawa ,  Hisashi Maejima

    IPC分类号： H01L21/30 ,  G03F7/20 ,  G03F7/207 ,  H01L21/027 ,  G03B27/42

    CPC分类号： G03F7/70933 ,  G03F7/70241 ,  G03F7/70258 ,  G03F7/70883

    摘要： The invention deals with an exposure apparatus which detects environmental conditions such as atmospheric pressure, temperature and humidity in which the exposure apparatus is placed, and which maintains the projected magnification constant at all times based upon the detected values, so that the pattern can be reproduced precisely. Concretely, the apparatus comprises a detector to detect at least one of the tube temperature of the optical projecting system, humidity or atmospheric pressure near the optical system, and a control unit which controls optical characteristics based upon the signals detected by the detector. Namely, the control unit adjusts the optical characteristics depending upon the environmental conditions thereby to adjust variation in the projecting magnification and/or variation in the focal position. Thus, variation in the optical characteristics is adjusted to transfer the pattern maintaining high precision.

    摘要翻译： 本发明涉及一种检测放置曝光装置的大气压，温度和湿度等环境条件的曝光装置，并且基于检测值一直保持投影倍率恒定，从而可以再现图案 恰恰。 具体地，该装置包括检测光学投影系统的管温度，光学系统附近的湿度或大气压的至少一个的检测器，以及基于由检测器检测到的信号来控制光学特性的控制单元。 也就是说，控制单元根据环境条件调节光学特性，从而调整投影倍率的变化和/或焦点位置的变化。 因此，调整光学特性的变化以转印图案保持高精度。

    Manufacturing system
    6.
    发明授权
    Manufacturing system 失效
    制造系统

    公开(公告)号：US4544318A

    公开(公告)日：1985-10-01

    申请号：US477895

    申请日：1983-03-23

    申请人： Hiroto Nagatomo ,  Hisashi Maejima ,  Jun Suzuki ,  Keishin Fujikawa

    发明人： Hiroto Nagatomo ,  Hisashi Maejima ,  Jun Suzuki ,  Keishin Fujikawa

    IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/02 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  B65G1/06

    CPC分类号： H01L21/67276 ,  H01L21/67724 ,  H01L21/67727 ,  H01L21/67736 ,  H01L21/67769 ,  Y10T29/5196

    摘要： A manufacturing system in which the automatic control of the system and the automatic control of a process management are organically coupled, thereby to sharply reduce the number of workers to be engaged in the manufacture. In order to establish both the versatility necessary for multiple type of treatment and the high efficiency necessary for large-quantity treatments, the arrangement of respective treatment sections is made the job-shop-type, and the construction of treating devices themselves included in the treatment sections is made the flow-shop-type, to achieve the consecutive automation. In order to also automate the management of the process, a stocker in which unfinished products are put is situated in a specified place of the system such as the central part thereof, while the process is put forward in such a manner that a conveyor machine controlled by a control unit having a computer reciprocates between the stocker and the groups of treatment sections. The manufacturing system is suitable for the fabrication of semiconductor devices which have many kinds of articles where each kind of article needs to be mass-produced.

    摘要翻译： 其中系统的自动控制和过程管理的自动控制的制造系统被有机地耦合，从而大大减少了从事制造的工人的数量。 为了确定多种类型的治疗所需的通用性和大量治疗所需的高效率，各处理部的布置成为工作车间型，并且包括在处理中的处理装置本身的构造 部分采用流动车间式，实现连续自动化。 为了使过程的管理自动化，将未完成产品放置的储料器位于诸如其中央部分的系统的指定位置，同时以使输送机控制的方式提出该过程 通过具有计算机的控制单元在储盘器和处理区组之间往复运动。 该制造系统适合制造具有多种制品的半导体器件，每种制品需要大量生产。