公开(公告)号：US20100219854A1

公开(公告)日：2010-09-02

申请号：US12064620

申请日：2007-04-26

申请人： Shinji Kuniyoshi ,  Yuji Miyagi

发明人： Shinji Kuniyoshi ,  Yuji Miyagi

IPC分类号： G01R31/02

CPC分类号： G01R1/06733 ,  G01R31/2891

摘要： A probe having an alignment mark that is hardly influenced by scraps of an electrode scraped by a probe tip is provided. A probe according to the present invention comprises a base portion having an attaching end and extending in a direction distanced from the attaching end, an arm portion extending from the base portion laterally with a space in the extending direction of the base portion from the attaching end, a probe tip portion protruded from the arm portion and having a probe tip formed on its protruding end, and an alignment mark for alignment of the probe tip. The arm portion has a flat surface area on the opposite side of a side where the attaching end of the base portion is located when seen along the extending direction of the arm portion. The probe tip portion is formed to be protruded from the flat surface area, and the alignment mark is constituted by at least a part of the flat surface area.

摘要翻译： 提供具有难以受到由探针尖刮掉的电极的废料的影响的对准标记的探针。 根据本发明的探针包括具有附接端并沿远离安装端的方向延伸的基部，臂部从基部横向延伸，从基部的延伸方向的空间从附接端 从臂部突出并具有形成在其突出端上的探针尖端的探针尖端部分和用于对准探针尖端的对准标记。 臂部在沿着臂部的延伸方向观察时，在基部的安装端位于的一侧的相对侧上具有平坦的表面区域。 探针尖端部形成为从平坦表面区域突出，并且对准标记由平坦表面积的至少一部分构成。

公开(公告)号：US07667472B2

公开(公告)日：2010-02-23

申请号：US11912872

申请日：2005-05-23

申请人： Kiyotoshi Miura ,  Hidehiro Kiyofuji ,  Yuji Miyagi ,  Shinji Kuniyoshi ,  Hitoshi Sato

发明人： Kiyotoshi Miura ,  Hidehiro Kiyofuji ,  Yuji Miyagi ,  Shinji Kuniyoshi ,  Hitoshi Sato

IPC分类号： G01R31/02 ,  G01R31/26

CPC分类号： G01R31/2889 ,  G01R1/07314 ,  Y10T29/49204

摘要： A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate.

摘要翻译： 用于被测设备的电测量的探针组件。 探针组件包括在空载状态下产生的具有弯曲变形的板状探针基板，以及形成在探针基板的一个面上的多个探针，以从面部突出。 探针的所有尖端位于平行于探针基板的虚拟参考平面的同一平面上。

公开(公告)号：US07586321B2

公开(公告)日：2009-09-08

申请号：US11847082

申请日：2007-08-29

申请人： Hideki Hirakawa ,  Akira Soma ,  Takayuki Hayashizaki ,  Shinji Kuniyoshi

发明人： Hideki Hirakawa ,  Akira Soma ,  Takayuki Hayashizaki ,  Shinji Kuniyoshi

IPC分类号： G01R31/02

CPC分类号： G01R1/06755 ,  G01R1/06727 ,  G01R1/06733

摘要： An electrical test probe comprises a probe tip portion and a probe main body portion having a pedestal portion on which the probe tip portion is formed to be protruded. The probe main body portion is made of a conductive material that is greater in toughness than the probe tip portion, and the probe tip portion is made of a conductive material that is higher in hardness than the material of the probe main body portion. On the pedestal portion is provided a probe tip reinforcement portion that contacts at least one side surface of the probe tip portion, extends toward a tip of the probe tip portion, and permits the tip of the probe tip portion to be protruded from its extending end in the extending direction. Also, the probe tip portion may be in a multi-layer structure having a first metal material layer that is higher in hardness than the tough metal material forming the probe main body portion and a second metal material layer that is greater in toughness than the first metal material layer.

摘要翻译： 电测试探头包括探针尖端部分和探针主体部分，其具有其上形成有探针尖端部分突出的基座部分。 探针主体部分由导电材料制成，其韧性比探针尖端部分大，并且探针尖端部分由比探针主体部分的材料硬度高的导电材料制成。 在基座部上设置有与探针前端部的至少一个侧面接触的探针末端加强部，朝向探针前端部的前端延伸，并且能够使探头前端部的前端从其延伸端突出 在延伸方向。 此外，探针尖端部分可以是多层结构，其具有比形成探针主体部分的韧性金属材料硬度高的第一金属材料层和韧性大于第一金属材料层的第二金属材料层 金属材料层。

公开(公告)号：US4964146A

公开(公告)日：1990-10-16

申请号：US324977

申请日：1989-03-15

申请人： Shinji Kuniyoshi ,  Takeshi Kumura

发明人： Shinji Kuniyoshi ,  Takeshi Kumura

IPC分类号： G03F9/00 ,  G21K1/10

CPC分类号： G03F9/70 ,  G21K1/10

摘要： Alignment in X-ray lithography is generally effected in such a manner that the surface of a target mark for alignment formed on a wafer is illuminated with light for alignment through an X-ray mask, and the position of the wafer is detected from the reflected light. On the basis of the finding that the reflected light from the mask, particularly from an absorber formed thereon, greatly degrades the precision and reliability in measurement, the present invention provides a pattern transfer mask provided with a thin film which lowers the reflection factor of the mask the thin film having a thickness set a .lambda./4n (.lambda.:the wavelength of the light for alignment; n: an integer) or an odd-number multiple thereof. Thus, it is advantageously possible to overcome the above-described lowering of precision and reliablity.

摘要翻译： 通常以这样的方式实现X射线光刻中的对准，即通过X射线掩模用光照射用于在晶片上形成的用于对准的对准标记的表面，并且从反射的位置检测晶片的位置 光。 基于来自掩模，特别是来自形成在其上的吸收体的反射光的发现，大大降低了测量的精度和可靠性，本发明提供了一种设置有薄膜的图案转印掩模，其降低了反射率 掩蔽具有设置为λ/ 4n（λ：用于取向的光的波长; n：整数）或其奇数倍的厚度的薄膜。 因此，有利地可以克服上述精度和可靠性的降低。

公开(公告)号：US4597669A

公开(公告)日：1986-07-01

申请号：US539760

申请日：1983-10-07

申请人： Tsuneo Terasawa ,  Shinji Kuniyoshi ,  Akihiro Takanashi ,  Toshiei Kurosaki ,  Yoshio Kawamura ,  Sumio Hosaka

发明人： Tsuneo Terasawa ,  Shinji Kuniyoshi ,  Akihiro Takanashi ,  Toshiei Kurosaki ,  Yoshio Kawamura ,  Sumio Hosaka

IPC分类号： G01B11/00 ,  G03F9/00 ,  G05D3/12 ,  H01L21/027 ,  H01L21/30 ,  G01N21/86

CPC分类号： G03F9/70 ,  H01L21/30

摘要： A pattern detector according to the present invention adopts a processing method wherein means is provided anew with which the intensity distribution of light reflected from or transmitted through an illuminated specimen is photoelectrically converted, and a pattern position is detected at high speed from the ratio between the primary moment and integral value of a detection signal thus derived, whereupon a symmetry calculation is executed within a narrow range around the detected value, whereby the pattern position is found fast and precisely.

摘要翻译： 根据本发明的图案检测器采用一种处理方法，其中重新提供装置，其中从被照射的样品反射或透射的光的光强分布被光电转换，并且以高速的比例检测图案位置 这样得到的检测信号的初始矩和积分值，由此在检测值附近的窄范围内执行对称计算，从而快速且精确地找到图案位置。

公开(公告)号：US20090058441A1

公开(公告)日：2009-03-05

申请号：US11995279

申请日：2005-08-09

申请人： Hideki Hirakawa ,  Akira Soma ,  Takayuki Hayashizaki ,  Shinji Kuniyoshi ,  Masahisa Tazawa

发明人： Hideki Hirakawa ,  Akira Soma ,  Takayuki Hayashizaki ,  Shinji Kuniyoshi ,  Masahisa Tazawa

IPC分类号： G01R31/02

CPC分类号： G01R1/06727 ,  G01R1/06733 ,  G01R1/06755

摘要： A probe for electrical test comprises a plate-shaped main portion having a base end to be attached to a support board and a tip end opposite the base end, and a probe tip portion arranged at the tip end of the main portion and having a probe tip to contact an electrode of a device under test, the main portion being made of a tenacity material. The main portion includes a conductive material extending from the base end to the tip end and at least part of which is buried within the tenacity material, and the tenacity material has higher resiliency than that of the conductive material while the conductive material has higher conductivity than that of the tenacity material. As a result, disorder of a signal provided via the probe is decreased without losing elastic deformation.

摘要翻译： 用于电测试的探针包括板形主要部分，其具有要附接到支撑板的基端和与基端相对的尖端，以及设置在主要部分的尖端处并具有探针的探针尖端部分 尖端接触被测器件的电极，主要部分由韧性材料制成。 主要部分包括从基端延伸到末端的导电材料，其至少一部分被埋在韧性材料内，并且韧性材料具有比导电材料更高的弹性，而导电材料具有比 坚韧的材料。 结果，通过探针提供的信号的紊乱减小而不损失弹性变形。

公开(公告)号：US20080143368A1

公开(公告)日：2008-06-19

申请号：US11935378

申请日：2007-11-05

申请人： Takayuki HAYASHIZAKI ,  Hideki HIRAKAWA ,  Akira SOMA ,  Shinji KUNIYOSHI

发明人： Takayuki HAYASHIZAKI ,  Hideki HIRAKAWA ,  Akira SOMA ,  Shinji KUNIYOSHI

IPC分类号： G01R31/02 ,  H01B13/00

CPC分类号： G01R3/00 ,  G01R1/07342 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/49139 ,  Y10T29/49153 ,  Y10T29/49224

摘要： The present invention provides a probe manufacturing method in which, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily without giving damage on the probe. A recess corresponding to a flat surface shape of a probe is formed by a resist mask on a sacrificial layer on a base table. By depositing a probe material in the recess, a probe made of the probe material is formed over the base table via the sacrificial layer. Thereafter, the resist mask is removed, and further the sacrificial layer is removed by an etching process with a part of the sacrificial layer remaining. For the purpose of forming an opening for control of the remaining part of the sacrificial layer in the etching process in the probe so as to let the opening pass through the probe in its plate thickness direction, a hole-forming portion for the opening is formed in the resist mask. Etching of the sacrificial layer in the etching process is promoted from an edge of the opening formed in the probe by this hole-forming portion.

摘要翻译： 本发明提供了一种探针制造方法，其中在用于探针的金属材料沉积在基台上之后，可以相对容易地将探针从基座上分离，而不会对探针造成损害。 通过基台上的牺牲层上的抗蚀剂掩模形成与探针的平坦表面形状对应的凹部。 通过将探针材料沉积在凹部中，由探针材料制成的探针通过牺牲层形成在基台上。 此后，去除抗蚀剂掩模，并且通过蚀刻工艺去除牺牲层，同时牺牲层的一部分残留。 为了在探针中的蚀刻工艺中形成用于控制牺牲层的剩余部分的开口以使开口在其厚度方向上穿过探针，形成用于开口的孔形成部分 在抗蚀剂掩模。 通过该孔形成部分从形成在探针中的开口的边缘促进蚀刻工艺中的牺牲层的蚀刻。

公开(公告)号：US5497331A

公开(公告)日：1996-03-05

申请号：US257262

申请日：1994-06-08

申请人： Nobuyuki Iriki ,  Tsutomu Okabe ,  Kenji Watanabe ,  Hisashi Maejima ,  Shinji Kuniyoshi

发明人： Nobuyuki Iriki ,  Tsutomu Okabe ,  Kenji Watanabe ,  Hisashi Maejima ,  Shinji Kuniyoshi

IPC分类号： H01L21/677 ,  G05B13/02 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30 ,  H01L21/66 ,  G06F19/00 ,  G06F17/60

CPC分类号： H01L22/20 ,  Y10S706/90 ,  Y10S706/904

摘要： A semiconductor integrated circuit device fabrication technique improves the accuracy of element qualities by considering the influence of interaction of element quality parameters in the quality control of semiconductor fabrication processes and also by improving the product yield estimation accuracy so that the production efficiency can be improved. An initial value of a membership function is first set and then a plurality of element quality parameters and a combined quality parameter are expressed by membership functions in fuzzy control in a semiconductor fabrication apparatus for automating a fabrication method by connecting a computer with various measuring instruments and various processors by communication devices. Moreover, the combined quality parameters are fuzzy-inferred from the element quality parameters using these membership functions, inference rules are adjusted by data of the actual processes, the membership functions of the obtained element quality parameters are converted into an element quality control standard, and the semiconductor integrated circuit device fabrication processes are controlled in accordance with the standard.

摘要翻译： 半导体集成电路器件制造技术通过考虑元件质量参数在半导体制造工艺的质量控制中的相互作用的影响以及通过提高产品产量估算精度来提高元件质量的精度，从而可以提高生产效率。 首先设置隶属度函数的初始值，然后在半导体制造装置中通过模糊控制中的隶属函数表示多个元素质量参数和组合质量参数，用于通过将计算机与各种测量仪器连接来自动化制造方法，以及 各种处理器由通信设备。 此外，使用这些隶属函数从元素质量参数中模糊组合的质量参数，推理规则由实际过程的数据进行调整，所获得的元素质量参数的隶属函数被转换为元素质量控制标准， 根据标准控制半导体集成电路器件制造工艺。

公开(公告)号：US5115456A

公开(公告)日：1992-05-19

申请号：US447865

申请日：1989-12-08

申请人： Takeshi Kimura ,  Shinji Kuniyoshi ,  Akihiko Kishimoto ,  Takashi Soga

发明人： Takeshi Kimura ,  Shinji Kuniyoshi ,  Akihiko Kishimoto ,  Takashi Soga

IPC分类号： H01L21/30 ,  G03F7/20 ,  H01L21/027

CPC分类号： G03F1/22 ,  G03F7/70475

摘要： A mask for exposing a wafer with radiation and its exposition method in which the radiation exposure mask is provided with at least two radiation exposure windows which each include a mask pattern of a smaller pattern area obtained by dividing a pattern area constituting an integrating circuit chip into a plurality of the areas, and a semiconductor wafer is exposed with radiation while the radiation exposure mask is intermittently moved by a distance of the size of the small pattern area.

公开(公告)号：US4504726A

公开(公告)日：1985-03-12

申请号：US327627

申请日：1981-12-04

申请人： Sumio Hosaka ,  Akihiro Takanashi ,  Toshiei Kurosaki ,  Shinji Kuniyoshi ,  Yoshio Kawamura ,  Tsuneo Terasawa

发明人： Sumio Hosaka ,  Akihiro Takanashi ,  Toshiei Kurosaki ,  Shinji Kuniyoshi ,  Yoshio Kawamura ,  Tsuneo Terasawa

IPC分类号： B23K26/08 ,  B23K26/12 ,  B41M5/24 ,  G03F7/20 ,  H01L21/027 ,  H01L21/30 ,  H01L21/428

CPC分类号： B23K26/0861 ,  B23K26/12 ,  B23K26/1224 ,  B23K26/123 ,  B41M5/24 ,  G03F1/76 ,  G03F7/704 ,  G03F7/70875 ,  H01L21/30

摘要： A pattern generator in which a workpiece to be machined into a desired pattern shape is held in vacuum and is irradiated with a laser beam condensed to be fine, while scanning the laser beam so as to depict the desired pattern shape, whereby the workpiece is directly machined in conformity with the desired pattern shape. As the workpiece, one in which a shading film (for example, chromium film) is deposited on a transparent glass substrate is employed, and it is irradiated with the laser beam in the vacuum, whereby the irradiated parts of the shading film are vaporized to fabricate a shading mask pattern of good quality.

摘要翻译： 一种图案发生器，其中待加工成所需图案形状的工件被保持在真空中并且被激光束照射以被精细地聚焦，同时扫描激光束以便描绘所需的图案形状，由此工件直接 根据所需的图案形状加工。 作为工件，使用在透明玻璃基板上沉积遮光膜（例如，铬膜）的工件，并在真空中照射激光束，使遮光膜的照射部分蒸发至 制作质量好的遮光罩图案。