公开(公告)号：US08742990B2

公开(公告)日：2014-06-03

申请号：US13339738

申请日：2011-12-29

申请人： Kuo-Fong Hung ,  Shih-Wei Hsieh ,  Ho-Chung Chen ,  Mao-Lin Wu

发明人： Kuo-Fong Hung ,  Shih-Wei Hsieh ,  Ho-Chung Chen ,  Mao-Lin Wu

IPC分类号： H01Q1/24

CPC分类号： H01Q13/18 ,  H01Q21/061 ,  H01Q21/24

摘要： A circular polarization antenna includes a substrate, a ground plane, a tuning stub, a feeding element, and a cavity structure. The substrate has a first surface and a second surface. The feeding element is disposed on the first surface of the substrate. The ground plane is disposed on the second surface of the substrate and has a hole. The tuning stub is disposed on the second surface of the substrate and connected to the edge of the hole. The cavity structure is connected to the ground plane and configured to reflect an electromagnetic wave.

摘要翻译： 圆极化天线包括衬底，接地平面，调谐短截线，馈电元件和空腔结构。 基板具有第一表面和第二表面。 供给元件设置在基板的第一表面上。 接地平面设置在基板的第二表面上并具有孔。 调谐短截线设置在基板的第二表面上并连接到孔的边缘。 空腔结构连接到接地平面并构造成反射电磁波。

公开(公告)号：US20120281734A1

公开(公告)日：2012-11-08

申请号：US13549406

申请日：2012-07-13

申请人： Qinfang Sun ,  Wen-Chang Yeh ,  Ho-Chung Chen

发明人： Qinfang Sun ,  Wen-Chang Yeh ,  Ho-Chung Chen

IPC分类号： H04B1/7075 ,  G01S19/24 ,  H04B1/709

CPC分类号： H04L7/0016 ,  G01S19/24 ,  G01S19/30 ,  G01S19/36 ,  G01S19/37

摘要： A high sensitivity GPS receiver includes an acquisition engine and a tracking engine. The acquisition engine processes GPS satellite data at data rate that is substantially equal to twice the coarse acquisition (CA) code chip rate. This data rate advantageously enables the acquisition engine to process GPS satellite data with relatively less hardware area than traditional GPS acquisition approaches. In one embodiment, the high efficiency acquisition engine may be over-clocked, thereby allowing different phases of a CA code to be correlated quickly. The tracking engine can advantageously process GPS satellite data at a data rate that does not have an integer relationship to the CA code chip rate.

摘要翻译： 高灵敏度GPS接收机包括采集引擎和跟踪引擎。 采集引擎以基本上等于粗略采集（CA）码片速率的两倍的数据速率处理GPS卫星数据。 该数据速率有利地使得采集引擎能够以比传统的GPS采集方法更少的硬件面积来处理GPS卫星数据。 在一个实施例中，高效率采集引擎可以被超频，从而允许CA代码的不同阶段快速相关。 跟踪引擎可以以不与CA码片速率的整数关系的数据速率有利地处理GPS卫星数据。

公开(公告)号：US08270457B2

公开(公告)日：2012-09-18

申请号：US12145918

申请日：2008-06-25

申请人： Qinfang Sun ,  Wen-Chang Yeh ,  Ho-Chung Chen

发明人： Qinfang Sun ,  Wen-Chang Yeh ,  Ho-Chung Chen

IPC分类号： H04B1/00

CPC分类号： H04L7/0016 ,  G01S19/24 ,  G01S19/30 ,  G01S19/36 ,  G01S19/37

摘要： A high sensitivity GPS receiver includes an acquisition engine and a tracking engine. The acquisition engine processes GPS satellite data at data rate that is substantially equal to twice the coarse acquisition (CA) code chip rate. This data rate advantageously enables the acquisition engine to process GPS satellite data with relatively less hardware area than traditional GPS acquisition approaches. In one embodiment, the high efficiency acquisition engine may be over-clocked, thereby allowing different phases of a CA code to be correlated quickly. The tracking engine can advantageously processes GPS satellite data at a data rate that does not have an integer relationship to the CA code chip rate.

摘要翻译： 高灵敏度GPS接收机包括采集引擎和跟踪引擎。 采集引擎以基本上等于粗略采集（CA）码片速率的两倍的数据速率处理GPS卫星数据。 该数据速率有利地使得采集引擎能够以比传统的GPS采集方法更少的硬件面积来处理GPS卫星数据。 在一个实施例中，高效率采集引擎可以被超频，从而允许CA代码的不同阶段快速相关。 跟踪引擎可以以不与CA码片速率的整数关系的数据速率有利地处理GPS卫星数据。

公开(公告)号：US20100190464A1

公开(公告)日：2010-07-29

申请号：US12360538

申请日：2009-01-27

申请人： Ho Chung Chen ,  Brian A. Floyd ,  Duxian Liu

发明人： Ho Chung Chen ,  Brian A. Floyd ,  Duxian Liu

IPC分类号： H04B1/16 ,  H01L21/50

CPC分类号： H01Q9/0407 ,  H01L23/04 ,  H01L23/66 ,  H01L24/16 ,  H01L24/48 ,  H01L2223/6616 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16235 ,  H01L2224/48235 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19039 ,  H01Q1/2283 ,  H01Q21/065 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and parallel thereto, and spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors. Fabrication techniques are also described.

摘要翻译： 射频集成电路芯片封装具有N个集成贴片天线，N为至少一个。 该包装包括具有N个大体上平坦的贴片的盖部分和联接到盖部分的主要部分。 主要部分又包括至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并与其平行。 接地平面形成在其中没有任何耦合孔。 主要部分还包括从N个大体上平坦的贴片向内间隔开并与之平行的N个馈送线，并且与大致平面的接地平面向外间隔开并与其平行。 此外，主要部分包括耦合到馈线和接地平面的至少一个射频芯片。 盖部分和主要部分协同地限定天线腔，并且N个大致平面的贴片和芯片位于天线腔中。 包装形成无反光镜。 还描述了制造技术。

公开(公告)号：US08269671B2

公开(公告)日：2012-09-18

申请号：US12360538

申请日：2009-01-27

申请人： Ho Chung Chen ,  Brian A. Floyd ,  Duixian Liu

发明人： Ho Chung Chen ,  Brian A. Floyd ,  Duixian Liu

IPC分类号： H01Q1/24

CPC分类号： H01Q9/0407 ,  H01L23/04 ,  H01L23/66 ,  H01L24/16 ,  H01L24/48 ,  H01L2223/6616 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16235 ,  H01L2224/48235 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19039 ,  H01Q1/2283 ,  H01Q21/065 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and parallel thereto, and spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors. Fabrication techniques are also described.

摘要翻译： 射频集成电路芯片封装具有N个集成贴片天线，N为至少一个。 该包装包括具有N个大体上平坦的贴片的盖部分和联接到盖部分的主要部分。 主要部分又包括至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并与其平行。 接地平面形成在其中没有任何耦合孔。 主要部分还包括从N个大体上平坦的贴片向内间隔开并与之平行的N个馈送线，并且与大致平面的接地平面向外间隔开并与其平行。 此外，主要部分包括耦合到馈线和接地平面的至少一个射频芯片。 盖部分和主要部分协同地限定天线腔，并且N个大致平面的贴片和芯片位于天线腔中。 包装形成无反光镜。 还描述了制造技术。

公开(公告)号：US20110279190A1

公开(公告)日：2011-11-17

申请号：US12778130

申请日：2010-05-12

申请人： Duixian Liu ,  Ho-Chung Chen ,  Brian Allan Floyd

发明人： Duixian Liu ,  Ho-Chung Chen ,  Brian Allan Floyd

IPC分类号： H03H7/38

CPC分类号： H01P5/028 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/15323

摘要： A circuit device includes a multilayer circuit carrier, a first signal transmission line, a second signal transmission line, a signal line transition element, a first impedance transformer, and a second impedance transformer. The multilayer circuit carrier includes a first layer and a second layer. The first signal transmission line is on the surface of the first layer. The second signal transmission line is on the surface of the second layer. The signal line transition element passes through the first layer and the second layer, and has a first signal terminal and a second signal terminal. The first impedance transformer is on the surface of the first layer and electrically connected between the first signal transmission line and the first signal terminal. The second impedance transformer is on the surface of the second layer and electrically connected between the second signal transmission line and the second signal terminal.

摘要翻译： 电路装置包括多层电路载体，第一信号传输线，第二信号传输线，信号线过渡元件，第一阻抗变压器和第二阻抗变压器。 多层电路载体包括第一层和第二层。 第一信号传输线在第一层的表面上。 第二信号传输线在第二层的表面上。 信号线过渡元件通过第一层和第二层，并具有第一信号端和第二信号端。 第一阻抗变换器位于第一层的表面上并电连接在第一信号传输线和第一信号端之间。 第二阻抗变换器位于第二层的表面上并电连接在第二信号传输线和第二信号端之间。

公开(公告)号：US20100327068A1

公开(公告)日：2010-12-30

申请号：US12494671

申请日：2009-06-30

申请人： Ho Chung Chen ,  Brian A. Floyd ,  Duixian Liu

发明人： Ho Chung Chen ,  Brian A. Floyd ,  Duixian Liu

IPC分类号： G06K19/06 ,  H01Q1/38 ,  H01L21/00

CPC分类号： G06K19/07749 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/1903 ,  H01Q1/2283 ,  H01L2924/00014

摘要： A radio-frequency integrated circuit chip package has at least one integrated antenna. The package includes at least one generally planar ground plane formed with at least one slot therein. A first substrate structure has an outer surface and an inner surface. The at least one generally planar ground plane is formed on the outer surface of the first substrate structure. At least one feed line is spaced inwardly from the ground plane and parallel thereto. The at least one feed line has an inner surface and an outer surface and is a transmission line formed on the inner surface of the first substrate structure with the outer surface of the at least one feed line adjacent the inner surface of the first substrate structure. At least one radio frequency chip is coupled to the feed line and the ground plane. A second substrate structure, spaced inwardly from the feed line, defines a chip-receiving cavity. The chip is located in the chip-receiving cavity. The inner surface of the at least one feed line borders the chip-receiving cavity. An antenna patch may be provided. Planar phased array embodiments, assemblies with motherboards and heat sinks, and fabrication techniques are also disclosed.

摘要翻译： 射频集成电路芯片封装具有至少一个集成天线。 该封装包括至少一个在其中形成有至少一个槽的大致平面的接地平面。 第一衬底结构具有外表面和内表面。 至少一个大致平面的接地平面形成在第一基板结构的外表面上。 至少一个进料管线从接地平面向内隔开并与其平行。 所述至少一个进料管线具有内表面和外表面，并且是形成在所述第一基材结构的内表面上的传输线，所述至少一个进料管线的外表面邻近所述第一基材结构的内表面。 至少一个射频芯片被耦合到馈线和接地平面。 从馈电线向内隔开的第二衬底结构限定了芯片接收腔。 芯片位于芯片接收腔中。 所述至少一个馈送线的内表面与所述芯片接收腔相接。 可以提供天线贴片。 还公开了平面相控阵实施例，具有主板和散热器的组件以及制造技术。

公开(公告)号：US09515387B2

公开(公告)日：2016-12-06

申请号：US13588496

申请日：2012-08-17

申请人： Kuo-Fong Hung ,  Ho-Chung Chen ,  Mao-Lin Wu ,  Chien-Chih Lee

发明人： Kuo-Fong Hung ,  Ho-Chung Chen ,  Mao-Lin Wu ,  Chien-Chih Lee

IPC分类号： H01Q21/28 ,  H01Q15/00 ,  H01Q1/52

CPC分类号： H01Q15/006 ,  H01Q1/521 ,  H01Q21/28

摘要： A MIMO (Multi-Input Multi-Output) antenna includes a system ground plane, an antenna ground plane, an EBG (Electromagnetic Band-Gap) structure, a first antenna element, and a second antenna element. The antenna ground plane overlaps a first portion of the system ground plane. The EBG structure is formed on a second portion of the system ground plane. The first antenna element and the second antenna element are both disposed in proximity to the EBG structure, but substantially extend in different directions.

摘要翻译： MIMO（多输入多输出）天线包括系统接地平面，天线接地平面，EBG（电磁带隙）结构，第一天线元件和第二天线元件。 天线接地平面与系统接地层的第一部分重叠。 EBG结构形成在系统接地层的第二部分上。 第一天线元件和第二天线元件均设置在EBG结构附近，但基本上在不同的方向上延伸。

公开(公告)号：US20140049437A1

公开(公告)日：2014-02-20

申请号：US13588496

申请日：2012-08-17

申请人： Kuo-Fong HUNG ,  Ho-Chung CHEN ,  Mao-Lin WU ,  Chien-Chih LEE

发明人： Kuo-Fong HUNG ,  Ho-Chung CHEN ,  Mao-Lin WU ,  Chien-Chih LEE

IPC分类号： H01Q21/28

CPC分类号： H01Q15/006 ,  H01Q1/521 ,  H01Q21/28

摘要： A MIMO (Multi-Input Multi-Output) antenna includes a system ground plane, an antenna ground plane, an EBG (Electromagnetic Band-Gap) structure, a first antenna element, and a second antenna element. The antenna ground plane overlaps a first portion of the system ground plane. The EBG structure is formed on a second portion of the system ground plane. The first antenna element and the second antenna element are both disposed in proximity to the EBG structure, but substantially extend in different directions.

摘要翻译： MIMO（多输入多输出）天线包括系统接地平面，天线接地平面，EBG（电磁带隙）结构，第一天线元件和第二天线元件。 天线接地平面与系统接地层的第一部分重叠。 EBG结构形成在系统接地层的第二部分上。 第一天线元件和第二天线元件均设置在EBG结构附近，但基本上在不同的方向上延伸。

公开(公告)号：US08542151B2

公开(公告)日：2013-09-24

申请号：US12909279

申请日：2010-10-21

申请人： Yi-Cheng Lin ,  Ho-Chung Chen ,  Kuo-Fong Hung

发明人： Yi-Cheng Lin ,  Ho-Chung Chen ,  Kuo-Fong Hung

IPC分类号： H01Q1/38

CPC分类号： H01Q9/045 ,  H01Q21/065

摘要： An antenna unit is provided. The antenna unit includes a first substrate, a first conductive layer, a second conductive layer, a plurality of conductive vias, a feed conductor and a patch. The first substrate includes a first surface and a second surface, wherein the first surface is opposite to the second surface. The first conductive layer is disposed on the first surface. The second conductive layer is disposed on the second surface, wherein an opening is formed on the second conductive layer, and the opening has an opening edge. The conductive vias are formed in the first substrate and connect the first conductive layer to the second conductive layer, wherein the conductive vias surround the opening to define a cavity. The feed conductor extends above the opening to feed a wireless signal to the antenna unit. The patch is disposed above the opening and is separated from the feed conductor.

摘要翻译： 提供天线单元。 天线单元包括第一基板，第一导电层，第二导电层，多个导电通孔，馈电导体和贴片。 第一基板包括第一表面和第二表面，其中第一表面与第二表面相对。 第一导电层设置在第一表面上。 第二导电层设置在第二表面上，其中在第二导电层上形成开口，并且开口具有开口边缘。 导电通孔形成在第一基板中，并将第一导电层连接到第二导电层，其中导电通孔围绕开口以限定空腔。 馈电导体延伸到开口上方，以将无线信号馈送到天线单元。 贴片设置在开口上方并与进给导体分离。