公开(公告)号：US09303848B2

公开(公告)日：2016-04-05

申请号：US14468799

申请日：2014-08-26

Applicant: GRT Tech Co., Ltd. ,  Hsuan-Chih Lin ,  Chun-Cheng Lee

Inventor： Hsuan-Chih Lin ,  Chun-Cheng Lee

IPC: F21S4/00 ,  F21V21/00 ,  F21V19/00 ,  F21K99/00 ,  F21V23/02 ,  F21V23/00 ,  F21W111/02

CPC classification number: F21V23/008 ,  F21K9/20 ,  F21V17/14 ,  F21V23/023 ,  F21W2111/02 ,  F21W2131/103

Abstract: A light emitting diode (LED) lamp structure (100) of the present invention includes a housing body (102), a LED lamp module (500), and an electronic module (700, 700′). The housing body (102) includes a lamp base (200), a module base (400), a connecting ring (300) connecting the lamp base (200), and at least one clasping member (104) connecting the module base (400). The LED lamp module (500) connects the connecting ring (300) and is disposed on the lamp base (200). The electronic module (700, 700′) connects the clasping member (104) and is disposed on the module base (400). Thereby, assembling, disassembling and replacing can be achieved without any tools. Meanwhile, the entrance of moisture is also prevented, so that a life span of an electronic device is prolonged.

Abstract translation: 本发明的发光二极管（LED）灯结构（100）包括壳体（102），LED灯模块（500）和电子模块（700,700'）。 壳体（102）包括灯座（200），模块基座（400），连接灯座（200）的连接环（300）和连接模块基座（400）的至少一个夹紧构件（104） ）。 LED灯模块（500）连接连接环（300）并设置在灯座（200）上。 电子模块（700,700'）连接夹紧构件（104）并且设置在模块基座（400）上。 因此，可以在没有任何工具的情况下实现组装，拆卸和更换。 同时，还防止了水分的入口，从而延长了电子设备的使用寿命。

公开(公告)号：US09328910B2

公开(公告)日：2016-05-03

申请号：US14468967

申请日：2014-08-26

Applicant: GRT Tech Co., Ltd. ,  Hsuan-Chih Lin ,  Chun-Cheng Lee

Inventor： Hsuan-Chih Lin ,  Chun-Cheng Lee

IPC: F21V29/00 ,  F21V29/74 ,  H05K7/06 ,  F21Y101/02

CPC classification number: F21V29/74 ,  F21V19/0045 ,  F21V29/773 ,  F21W2131/103 ,  F21Y2115/10 ,  H05K7/06

Abstract: An electronic implement replacement structure includes a housing body (102) and an electronic module (300). The housing body (102) has a base (110) and a connecting ring (120) connected to the base (110). The connecting ring (120) includes press portions (124) and notches (122) spaced apart from one another and respectively disposed between each two adjacent press portion (124). A guiding groove (126) is formed on an outer surface of each of the press portions (124). The electronic module (300) is disposed on the base (110) and corresponding to the connecting ring (120). The electronic module (300) includes an electronic unit (310) and a rotatable ring (330) enclosing the electronic unit (310). An inner wall of the rotatable ring (330) has a sliding block (332) correspondingly and rotatably engaged with the guiding groove (126). Therefore, assembling and disassembling can be achieved without any tools.

Abstract translation: 电子工具更换结构包括壳体（102）和电子模块（300）。 壳体（102）具有连接到基座（110）的底座（110）和连接环（120）。 连接环（120）包括彼此间隔开并分别设置在每个相邻的两个按压部分（124）之间的按压部分（124）和凹口（122）。 在每个按压部分（124）的外表面上形成引导槽（126）。 电子模块（300）设置在基座（110）上并对应于连接环（120）。 电子模块（300）包括电子单元（310）和包围电子单元（310）的可旋转环（330）。 可旋转环（330）的内​​壁具有与引导槽（126）相对应并可旋转地接合的滑块（332）。 因此，无需任何工具即可实现组装和拆卸。

公开(公告)号：US09265168B1

公开(公告)日：2016-02-16

申请号：US14469040

申请日：2014-08-26

Applicant: GRT Tech Co., Ltd. ,  Hsuan-Chih Lin ,  Chun-Cheng Lee

Inventor： Hsuan-Chih Lin ,  Chun-Cheng Lee

IPC: H05K5/00 ,  H05K5/02 ,  H05K5/06

CPC classification number: F21V23/007 ,  F21S8/086 ,  F21W2131/103

Abstract: An electronic device replacement structure (100) includes a housing body (102) and an electronic module (200, 200′). The housing body (102) includes a base (110) and at least one clasping member (120) connected with one side of the base (110). The base (110) is disposed inside the housing body (102), and a first plate (130) is protrudingly disposed on the base (110). The electronic module (200, 200′) is disposed on the base (110) and corresponding to the clasping member (120). The electronic module (200, 200′) includes a casing (210) and a fastening implement (300) connected to the casing (210). The fastening implement (300) has at least one elastic locking element (310) and a second plate (320). The elastic locking element (310) is engaged with the clasping member (120). The second plate (320) protrudes toward the first plate (130) and contacts against the first plate (130).

Abstract translation: 电子设备更换结构（100）包括壳体（102）和电子模块（200,200'）。 壳体（102）包括基部（110）和与基部（110）的一侧连接的至少一个紧固构件（120）。 基部（110）设置在壳体（102）的内部，并且突出地设置在基部（110）上的第一板（130）。 电子模块（200,200'）设置在基座（110）上并对应于扣紧构件（120）。 电子模块（200,200'）包括壳体（210）和连接到壳体（210）的紧固器具（300）。 紧固工具（300）具有至少一个弹性锁定元件（310）和第二板（320）。 弹性锁定元件（310）与夹紧构件（120）接合。 第二板（320）向第一板（130）突出并与第一板（130）接触。

公开(公告)号：US11548588B2

公开(公告)日：2023-01-10

申请号：US17575229

申请日：2022-01-13

Applicant: Hsuan-Chih Lin ,  Chun-Cheng Lee

Inventor： Hsuan-Chih Lin ,  Chun-Cheng Lee

IPC: B62M1/36 ,  B62M3/00 ,  B62M11/02

Abstract: The present disclosure related to an effort-saving crank structure (1) of a bicycle (8), which includes: a crank mechanism (10) having a crank (11), a shaft end gear (12) and a treadle end gear (13) disposed on the crank (11); a transmission mechanism (20) disposed in the crank (11) and having a rotation shaft (21) and a first gear (22) and a second gear (23) connected to the rotation shaft (21), the first gear (22) and the shaft end gear (12) are engaged for transmission, and the second gear (23) and the treadle end gear (13) are engaged for transmission; a rotation arm unit (30) having a first rotation arm (31) and a second rotation arm (32), two ends of the second rotation arm (32) are respectively connected to the first rotation arm (31) and the treadle end gear (13).

公开(公告)号：US08342716B2

公开(公告)日：2013-01-01

申请号：US12761727

申请日：2010-04-16

Applicant: Hsuan-Chih Lin

Inventor： Hsuan-Chih Lin

IPC: H01K1/62 ,  H01J61/52 ,  F21V29/00 ,  H01K1/30

CPC classification number: F21V29/004 ,  F21K9/00 ,  F21V29/77 ,  F21V29/773 ,  F21V29/89 ,  F21V31/005 ,  F21Y2115/10

Abstract: A LED head sink module includes a LED module, which comprises a circuit substrate, a LED chip installed in the circuit substrate, a packing cup molded on the circuit substrate around the LED chip and a lens molded on the packing cup over the LED chip, a heat sink, which has a base and a flat mounting block located on the bottom side of the base for stopping against the circuit substrate of the LED module for absorbing waste heat, a bracket, which has a center opening that receives the circuit substrate of the LED module, first retaining members for fastening to a retaining portion at the periphery of the packing cup and second retaining members for fastening to the flat mounting block of the heat sink, and a water seal sandwiched between the LED module and the bracket to seal off outside moisture and dust.

Abstract translation: LED头模块包括LED模块，其包括电路基板，安装在电路基板中的LED芯片，模制在LED芯片周围的电路基板上的封装杯和模制在LED芯片上的封装杯上的透镜， 散热器，其具有位于基座的底侧上的基部和平坦的安装块，用于阻挡用于吸收废热的LED模块的电路基板，支架具有接收电路基板的中心开口 LED模块，用于紧固到包装杯周边的保持部分的第一保持构件和用于紧固到散热器的平坦安装块的第二保持构件以及夹在LED模块和支架之间的水封以密封 外面的水分和灰尘。

公开(公告)号：US08342711B2

公开(公告)日：2013-01-01

申请号：US12785850

申请日：2010-05-24

Applicant: Hsuan-Chih Lin ,  Hong-Long Chen

Inventor： Hsuan-Chih Lin ,  Hong-Long Chen

IPC: F21S4/00 ,  B60Q1/00

CPC classification number: F21V31/005 ,  F21K9/00 ,  F21S2/005 ,  F21V17/12 ,  F21V29/70 ,  F21V29/713 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A light-emitting unit adapter module includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a light-emitting unit mountable in the mounting base, and a holding-down device fastenable to the mounting base to hold down the light-emitting unit, keeping the tubular electrodes of the light-emitting unit in positive contact with the electrode pins of the circuit board for power input and the heat sink of the light-emitting unit suspending outside the mounting base for quick dissipation of waste heat during operation of the light-emitting devices of the light-emitting unit.

Abstract translation: 一种发光单元适配器模块，包括用于安装的安装基座，容纳在安装基座中并具有可连接到外部电源的电极引脚的电路板，可安装在安装基座中的发光单元，以及压紧装置 可固定到安装基座上以按压发光单元，使发光单元的管状电极与用于电力输入的电路板的电极引脚正确接触，并将发光单元的散热片悬空 用于在发光单元的发光装置的操作期间快速消散废热的安装基座。

公开(公告)号：US20090040760A1

公开(公告)日：2009-02-12

申请号：US12187772

申请日：2008-08-07

Applicant: Kuo-Hsin CHEN ,  Hsuan-Chih Lin

Inventor： Kuo-Hsin CHEN ,  Hsuan-Chih Lin

IPC: F21V29/02 ,  F21V21/00

CPC classification number: F21V29/71 ,  F21V29/74 ,  F21V29/763 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: An illumination device having an unidirectional heat-dissipating route, includes a heat sink and a LED light module. The heat sink includes a heat plate, a heat pipe and a heat-dissipating body. The heat pipe has a heat absorbing portion and a heat dissipating portion with a horizontal position different to that of the heat absorbing portion. The heat absorbing portion is connected to the heat plate, and a plurality of grooves is formed in the heat pipe to be communicated with the heat absorbing portion and the heat dissipating portion. The heat absorbing portion is lower than the heat dissipating portion. The heat-dissipating body is connected to the heat dissipating portion. The LED light module is connected to the heat plate. Thus the LEDs are protected and prevented from being destroyed by the heat, and the working life thereof is increased greatly.

Abstract translation: 具有单向散热路径的照明装置包括散热器和LED灯模块。 散热器包括加热板，热管和散热体。 热管具有吸热部分和具有不同于吸热部分的水平位置的散热部分。 吸热部与加热板连接，在热管内形成有与吸热部和散热部连通的多个槽。 吸热部比散热部低。 散热体与散热部连接。 LED灯模块连接到加热板。 因此，LED被保护并防止被热量破坏，并且其使用寿命大大增加。

公开(公告)号：US20080028611A1

公开(公告)日：2008-02-07

申请号：US11843910

申请日：2007-08-23

Applicant: Kuo-Hsin Chen ,  Hsuan-Chih Lin

Inventor： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC: B21D53/08

CPC classification number: H01L23/467 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49368 ,  H01L2924/00

Abstract: A heat dissipating device includes thermal conductive pipes and a plurality of thermal fin modules. Each thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. A retainer is located between each two thermal fin modules to compress the thermal fin module, so that a distance between two fins of the thermal fin module is reduced. Finally, a fixing plate is set above the last thermal fin module on the thermal conductive pipes to fix the thermal fin modules securely engaged with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.

Abstract translation: 散热装置包括导热管和多个散热片模块。 通过压制和堆叠制成的每个散热片模块安装在导热管上。 保持器位于每个两个散热片模块之间，以压缩散热片模块，从而减小散热片模块的两个散热片之间的距离。 最后，将固定板设置在导热管上的最后一个散热片模块上方，以将散热片模块固定在导热管上。 因此，组装的散热模块在输送期间不能松动和变形，并且翅片和导热管之间的接合接触增强，从而增加散热模块的散热效果。

公开(公告)号：US08193012B2

公开(公告)日：2012-06-05

申请号：US12779589

申请日：2010-05-13

Applicant: Hsuan-Chih Lin

Inventor： Hsuan-Chih Lin

IPC: H01L33/00

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A method of fabricating a LED module by: bonding one or multiple LED chips and multiple conducting terminals to a circuit substrate, and then molding a packing cup on the circuit substrate over by over molding for enabling the LED chip(s) and the conducting terminals to be exposed to the outside of the packing cup, and then molding a lens on the packing cup and the LED chip(s) by over-molding. By means of directly molding the lens on the packing cup and the LED chip(s), no any gap is left in the lens, avoiding deflection, total reflection or light attenuation and enhancing luminous brightness and assuring uniform distribution of output light.

Abstract translation: 一种通过以下方式制造LED模块：将一个或多个LED芯片和多个导电端子连接到电路基板上，然后通过过模塑将电路基板上的填料杯模制成可使LED芯片和导电端子 暴露于包装杯的外部，然后通过过度成型将透镜模制在包装杯和LED芯片上。 通过将透镜直接模制在包装杯和LED芯片上，透镜中没有留下任何间隙，避免了偏转，全反射或光衰减，并提高了发光亮度，并保证了输出光的均匀分布。

公开(公告)号：US08038328B2

公开(公告)日：2011-10-18

申请号：US12785782

申请日：2010-05-24

Applicant: Hsuan-Chih Lin ,  Hong-Long Chen

Inventor： Hsuan-Chih Lin ,  Hong-Long Chen

IPC: B60Q1/00

CPC classification number: F21V29/004 ,  F21S45/47 ,  F21S45/48 ,  F21S45/50 ,  F21V19/0035 ,  F21V23/06 ,  F21V29/70 ,  F21Y2115/10 ,  Y10S362/80

Abstract: A light-emitting device pressure ring structure includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a holder member insertable in the mounting base, a light-emitting unit fixedly mounted in the holder member with a bottom heat sink thereof suspending outside the holder member and tubular electrodes thereof connectable to the electrode pins of the circuit board for power input, and a pressure ring cap detachably threaded onto the mounting base to hold down the holder member and to keep the heat sink of the light-emitting unit outside the mounting base for quick dissipation of waste heat from the light-emitting devices of the light-emitting unit.

Abstract translation: 一种发光装置压环结构，包括安装用安装基座，容纳在安装基座中的电路板，具有可连接到外部电源的电极引脚，可插入安装基座的保持器构件，固定安装的发光单元 在保持器构件中，其底部散热器悬挂在保持器构件的外部，并且可连接到用于电力输入的电路板的电极引脚的管状电极，以及可拆卸地旋拧到安装基座上以压住保持构件的压力环帽， 以将发光单元的散热片保持在安装基座外部，以便从发光单元的发光装置快速散发废热。