公开(公告)号：US20120122309A1

公开(公告)日：2012-05-17

申请号：US13241871

申请日：2011-09-23

申请人： Hong-Bae PARK ,  Sang-Jin Hyun ,  Hu-Yong Lee ,  Hoon-Joo Na ,  Jeong-Hee Han ,  Hye-Lan Lee ,  Hyung-Seok Hong

发明人： Hong-Bae PARK ,  Sang-Jin Hyun ,  Hu-Yong Lee ,  Hoon-Joo Na ,  Jeong-Hee Han ,  Hye-Lan Lee ,  Hyung-Seok Hong

IPC分类号： H01L21/28

CPC分类号： H01L21/823842 ,  H01L21/28185 ,  H01L21/28202 ,  H01L29/495 ,  H01L29/513 ,  H01L29/518 ,  H01L29/66545

摘要： A method of fabricating a semiconductor device may include: preparing a substrate in which first and second regions are defined; forming an interlayer insulating film, which includes first and second trenches, on the substrate; forming a work function control film, which contains Al and N, along a top surface of the interlayer insulating film, side and bottom surfaces of the first trench, and side and bottom surfaces of the second trench; forming a mask pattern on the work function control film formed in the second region; injecting a work function control material into the work function control film formed in the first region to control a work function of the work function control film formed in the first region; removing the mask pattern; and forming a first metal gate electrode to fill the first trench and forming a second metal gate electrode to fill the second trench.

摘要翻译： 制造半导体器件的方法可以包括：制备其中限定了第一和第二区域的衬底; 在衬底上形成包括第一和第二沟槽的层间绝缘膜; 沿着层间绝缘膜的上表面，第一沟槽的侧表面和底表面以及第二沟槽的侧表面和底表面形成包含Al和N的功函数控制膜; 在形成在第二区域中的功函数控制膜上形成掩模图案; 将工作功能控制材料注入到形成在第一区域中的功函数控制膜中，以控制形成在第一区域中的功函数控制膜的功函数; 去除掩模图案; 以及形成第一金属栅电极以填充所述第一沟槽并形成第二金属栅电极以填充所述第二沟槽。

公开(公告)号：US20160315165A1

公开(公告)日：2016-10-27

申请号：US14955205

申请日：2015-12-01

申请人： Dong-soo LEE ,  Hu-yong LEE ,  Won-keun CHUNG ,  Hoon-joo NA ,  Taek-soo JEON ,  Sang-jin HYUN

发明人： Dong-soo LEE ,  Hu-yong LEE ,  Won-keun CHUNG ,  Hoon-joo NA ,  Taek-soo JEON ,  Sang-jin HYUN

IPC分类号： H01L29/51 ,  H01L29/78 ,  H01L27/092

CPC分类号： H01L29/512 ,  B82Y10/00 ,  H01L21/28185 ,  H01L21/823456 ,  H01L21/823842 ,  H01L27/088 ,  H01L27/0886 ,  H01L27/092 ,  H01L27/0924 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/42364 ,  H01L29/42392 ,  H01L29/513 ,  H01L29/517 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/775 ,  H01L29/785

摘要： An integrated circuit device includes a substrate including an active region, an interfacial layer including a lower insulating layer on the active region, the lower insulating layer doped with a chalcogen element having an atomic weight equal to or greater than 16, a gate insulation layer on the interfacial layer, and a gate electrode on the gate insulation layer.

摘要翻译： 一种集成电路器件包括：衬底，其包括有源区，界面层包括有源区上的下绝缘层，所述下绝缘层掺杂有原子量等于或大于16的硫属元素;栅绝缘层， 界面层和栅极绝缘层上的栅电极。

公开(公告)号：US08580629B2

公开(公告)日：2013-11-12

申请号：US13241871

申请日：2011-09-23

申请人： Hong-Bae Park ,  Sang-Jin Hyun ,  Hu-Yong Lee ,  Hoon-Joo Na ,  Jeong-Hee Han ,  Hye-Lan Lee ,  Hyung-Seok Hong

发明人： Hong-Bae Park ,  Sang-Jin Hyun ,  Hu-Yong Lee ,  Hoon-Joo Na ,  Jeong-Hee Han ,  Hye-Lan Lee ,  Hyung-Seok Hong

IPC分类号： H01L21/8238

CPC分类号： H01L21/823842 ,  H01L21/28185 ,  H01L21/28202 ,  H01L29/495 ,  H01L29/513 ,  H01L29/518 ,  H01L29/66545

摘要： A method of fabricating a semiconductor device may include: preparing a substrate in which first and second regions are defined; forming an interlayer insulating film, which includes first and second trenches, on the substrate; forming a work function control film, which contains Al and N, along a top surface of the interlayer insulating film, side and bottom surfaces of the first trench, and side and bottom surfaces of the second trench; forming a mask pattern on the work function control film formed in the second region; injecting a work function control material into the work function control film formed in the first region to control a work function of the work function control film formed in the first region; removing the mask pattern; and forming a first metal gate electrode to fill the first trench and forming a second metal gate electrode to fill the second trench.

摘要翻译： 制造半导体器件的方法可以包括：制备其中限定了第一和第二区域的衬底; 在衬底上形成包括第一和第二沟槽的层间绝缘膜; 沿着层间绝缘膜的上表面，第一沟槽的侧表面和底表面以及第二沟槽的侧表面和底表面形成包含Al和N的功函数控制膜; 在形成在第二区域中的功函数控制膜上形成掩模图案; 将工作功能控制材料注入到形成在第一区域中的功函数控制膜中，以控制形成在第一区域中的功函数控制膜的功函数; 去除掩模图案; 以及形成第一金属栅电极以填充所述第一沟槽并形成第二金属栅电极以填充所述第二沟槽。

公开(公告)号：US09786761B2

公开(公告)日：2017-10-10

申请号：US14955205

申请日：2015-12-01

申请人： Dong-soo Lee ,  Hu-yong Lee ,  Won-keun Chung ,  Hoon-joo Na ,  Taek-soo Jeon ,  Sang-jin Hyun

发明人： Dong-soo Lee ,  Hu-yong Lee ,  Won-keun Chung ,  Hoon-joo Na ,  Taek-soo Jeon ,  Sang-jin Hyun

IPC分类号： B82Y10/00 ,  H01L29/51 ,  H01L27/092 ,  H01L29/78 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775 ,  H01L29/06

CPC分类号： H01L29/512 ,  B82Y10/00 ,  H01L21/28185 ,  H01L21/823456 ,  H01L21/823842 ,  H01L27/088 ,  H01L27/0886 ,  H01L27/092 ,  H01L27/0924 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/42364 ,  H01L29/42392 ,  H01L29/513 ,  H01L29/517 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/775 ,  H01L29/785

摘要： An integrated circuit device includes a substrate including an active region, an interfacial layer including a lower insulating layer on the active region, the lower insulating layer doped with a chalcogen element having an atomic weight equal to or greater than 16, a gate insulation layer on the interfacial layer, and a gate electrode on the gate insulation layer.