公开(公告)号：US08937483B2

公开(公告)日：2015-01-20

申请号：US13193527

申请日：2011-07-28

申请人： Hyeck-Jin Jeong ,  Yong-Ki Park ,  Yong-Jin Jung ,  Heul-Seog Kim

发明人： Hyeck-Jin Jeong ,  Yong-Ki Park ,  Yong-Jin Jung ,  Heul-Seog Kim

IPC分类号： G01R31/00 ,  G01R31/10 ,  G01R31/02 ,  F27D5/00 ,  H01L21/673

CPC分类号： H01L21/67333

摘要： A semiconductor package transferring apparatus is disclosed. The apparatus includes a tray that includes a front side and a rear side opposite the front side, the rear side including a plurality of package covering portions that each correspond to the shape of a semiconductor package and that are arranged to align with corresponding package loading portions on a front side of another tray. Each package covering portion has a surface configured to cover a semiconductor chip disposed below the surface. The apparatus further includes an anti-attachment portion disposed on the surface of one or more of the package covering portions. For each package covering portion on which an anti-attachment portion is disposed, the anti-attachment portion protrudes beyond the surface of the package covering portion.

摘要翻译： 公开了半导体封装传送装置。 该装置包括一个托盘，该托盘包括前侧和与前侧相对的后侧，后侧包括多个封装覆盖部分，每个封装覆盖部分对应于半导体封装的形状，并且被布置成与相应的封装装载部分 在另一个托盘的正面。 每个封装覆盖部分具有覆盖设置在表面下方的半导体芯片的表面。 该装置还包括设置在一个或多个包装覆盖部分的表面上的防附着部分。 对于其上设置防附着部分的每个包装覆盖部分，防附着部分突出超过包装覆盖部分的表面。

公开(公告)号：US20060119375A1

公开(公告)日：2006-06-08

申请号：US11274703

申请日：2005-11-14

申请人： Jun-Young Ko ,  Seok-Young Yoon ,  Hyeck-Jin Jeong

发明人： Jun-Young Ko ,  Seok-Young Yoon ,  Hyeck-Jin Jeong

IPC分类号： G01R31/02

CPC分类号： G01R31/2898 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06722 ,  G01R3/00

摘要： An apparatus includes a test board for testing electrical characteristics of the semiconductor chip; socket pins vertically disposed on the test board to electrically connect the test board, and external terminals of the semiconductor chip; socket springs interposed between the socket pins and the test board and making the socket pins vertically elastic; a plurality of laser beam transmitters vertically penetrating the socket pins, the socket springs, and the test board; and a laser beam source supplying laser beams to the laser beam transmitters.

摘要翻译： 一种装置包括用于测试半导体芯片的电气特性的测试板; 垂直设置在测试板上的插座引脚用于电连接测试板和半导体芯片的外部端子; 插座弹簧介于插座销和测试板之间，并使插座销垂直弹性; 垂直穿过插座销，插座弹簧和测试板的多个激光束发射器; 以及向激光束发射器提供激光束的激光束源。

公开(公告)号：US20120043253A1

公开(公告)日：2012-02-23

申请号：US13193527

申请日：2011-07-28

申请人： Hyeck-Jin Jeong ,  Yong-Ki Park ,  Yong-Jin Jung ,  Heul-Seog Kim

发明人： Hyeck-Jin Jeong ,  Yong-Ki Park ,  Yong-Jin Jung ,  Heul-Seog Kim

IPC分类号： B65D85/00

CPC分类号： H01L21/67333

摘要： A semiconductor package transferring apparatus is disclosed. The apparatus includes a tray that includes a front side and a rear side opposite the front side, the rear side including a plurality of package covering portions that each correspond to the shape of a semiconductor package and that are arranged to align with corresponding package loading portions on a front side of another tray. Each package covering portion has a surface configured to cover a semiconductor chip disposed below the surface. The apparatus further includes an anti-attachment portion disposed on the surface of one or more of the package covering portions. For each package covering portion on which an anti-attachment portion is disposed, the anti-attachment portion protrudes beyond the surface of the package covering portion.

摘要翻译： 公开了半导体封装传送装置。 该装置包括一个托盘，该托盘包括前侧和与前侧相对的后侧，后侧包括多个封装覆盖部分，每个封装覆盖部分对应于半导体封装的形状，并且被布置成与相应的封装装载部分 在另一个托盘的正面。 每个封装覆盖部分具有覆盖设置在表面下方的半导体芯片的表面。 该装置还包括设置在一个或多个包装覆盖部分的表面上的防附着部分。 对于其上设置防附着部分的每个包装覆盖部分，防附着部分突出超过包装覆盖部分的表面。

公开(公告)号：US07420382B2

公开(公告)日：2008-09-02

申请号：US11274703

申请日：2005-11-14

申请人： Jun-Young Ko ,  Seok-Young Yoon ,  Hyeck-Jin Jeong

发明人： Jun-Young Ko ,  Seok-Young Yoon ,  Hyeck-Jin Jeong

IPC分类号： G01R31/02

CPC分类号： G01R31/2898 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06722 ,  G01R3/00

摘要： An apparatus includes a test board for testing electrical characteristics of the semiconductor chip; socket pins vertically disposed on the test board to electrically connect the test board, and external terminals of the semiconductor chip; socket springs interposed between the socket pins and the test board and making the socket pins vertically elastic; a plurality of laser beam transmitters vertically penetrating the socket pins, the socket springs, and the test board; and a laser beam source supplying laser beams to the laser beam transmitters.

摘要翻译： 一种装置包括用于测试半导体芯片的电气特性的测试板; 垂直设置在测试板上的插座引脚用于电连接测试板和半导体芯片的外部端子; 插座弹簧介于插座销和测试板之间，并使插座销垂直弹性; 垂直穿过插座销，插座弹簧和测试板的多个激光束发射器; 以及向激光束发射器提供激光束的激光束源。

公开(公告)号：US20060145719A1

公开(公告)日：2006-07-06

申请号：US11325145

申请日：2006-01-03

申请人： Hyeck-Jin Jeong ,  Jung-Hyun Park ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Seok-Young Yoon

发明人： Hyeck-Jin Jeong ,  Jung-Hyun Park ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Seok-Young Yoon

IPC分类号： G01R31/02

CPC分类号： G01R1/0466 ,  G01R1/0483 ,  G01R1/06722

摘要： A POGO pin that can measure low frequency products as well as RF products and also have a long life span, and a test socket including the POGO pin are provided. The POGO pin includes a metal plunger formed of a conductive metal so as to electrically contact the semiconductor package, and a rubber contact pin connected with the metal plunger and formed of a conductive rubber so as to electrically contact the test board.

摘要翻译： 一个POGO引脚，可以测量低频产品以及RF产品，并且具有较长的使用寿命，并提供包含POGO引脚的测试插座。 POGO针包括由导电金属形成的金属柱塞，以与半导体封装件电接触;以及橡胶触针，与金属柱塞连接并由导电橡胶形成，以便电接触测试板。

公开(公告)号：US20070182432A1

公开(公告)日：2007-08-09

申请号：US11488597

申请日：2006-07-19

申请人： Hyeck-Jin Jeong ,  Seon-Ju Oh ,  Seok-Young Yoon

发明人： Hyeck-Jin Jeong ,  Seon-Ju Oh ,  Seok-Young Yoon

IPC分类号： G01R31/02

CPC分类号： G01R1/0466 ,  H01L2224/16225

摘要： An insert for loading a semiconductor package having external connection terminals may have a support plate. The support plate may have an upper surface with first contact pads and a lower surface with second contact pads. The first contact pads may be electrically connected to the external connection terminals of the semiconductor package and the second contact pads may be electrically connected to test connection terminals of a test socket.

摘要翻译： 用于加载具有外部连接端子的半导体封装的插入件可以具有支撑板。 支撑板可以具有带有第一接触垫的上表面和具有第二接触垫的下表面。 第一接触焊盘可以电连接到半导体封装的外部连接端子，并且第二接触焊盘可以电连接到测试插座的测试连接端子。

公开(公告)号：US07245138B2

公开(公告)日：2007-07-17

申请号：US11325145

申请日：2006-01-03

申请人： Hyeck-Jin Jeong ,  Jung-Hyun Park ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Seok-Young Yoon

发明人： Hyeck-Jin Jeong ,  Jung-Hyun Park ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Seok-Young Yoon

IPC分类号： G01R31/02

CPC分类号： G01R1/0466 ,  G01R1/0483 ,  G01R1/06722

摘要： A POGO pin that can measure low frequency products as well as RF products and also have a long life span, and a test socket including the POGO pin are provided. The POGO pin includes a metal plunger formed of a conductive metal so as to electrically contact the semiconductor package, and a rubber contact pin connected with the metal plunger and formed of a conductive rubber so as to electrically contact the test board.

摘要翻译： 一个POGO引脚，可以测量低频产品以及RF产品，并且具有较长的使用寿命，并提供包含POGO引脚的测试插座。 POGO针包括由导电金属形成的金属柱塞，以与半导体封装件电接触;以及橡胶触针，与金属柱塞连接并由导电橡胶形成，以便电接触测试板。

公开(公告)号：US20090174078A1

公开(公告)日：2009-07-09

申请号：US12318635

申请日：2009-01-05

申请人： Hyeck-Jin Jeong ,  Seon-Ju Oh ,  Yong-Ki Park ,  Heui-Seog Kim

发明人： Hyeck-Jin Jeong ,  Seon-Ju Oh ,  Yong-Ki Park ,  Heui-Seog Kim

IPC分类号： H01L23/522

CPC分类号： G01R31/2884 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2924/00014

摘要： Provided is a semiconductor device and method of manufacturing the same. The semiconductor device may include a base material and a compound layer on the base material including a mixture of a non-adhesive organic material and a non-oxidizing metal material.

摘要翻译： 提供一种半导体器件及其制造方法。 半导体器件可以包括基材和基材上的化合物层，包括非粘性有机材料和非氧化金属材料的混合物。

公开(公告)号：US07235991B2

公开(公告)日：2007-06-26

申请号：US11391381

申请日：2006-03-29

申请人： Jin-Woog Kim ,  Seok-Ho Jin ,  Seok-Young Yoon ,  Se-Un Lee ,  Hyeck-Jin Jeong

发明人： Jin-Woog Kim ,  Seok-Ho Jin ,  Seok-Young Yoon ,  Se-Un Lee ,  Hyeck-Jin Jeong

IPC分类号： G01R31/02 ,  G01R31/28

CPC分类号： G01R31/2893

摘要： In an example embodiment, an insert having an independently movable latch mechanism for loading a semiconductor package may include an insert body having a pocket, latch units installed at opposite sides of the pocket, and a press plate elastically installed above the insert body. The latch units prevent a loaded semiconductor package from escaping out of the pocket. The press plate may operate the latch unit by movement relative to an upper surface of the insert body. Each latch may be movably connected to the insert body such that a first end of the latch is rotatable around a fixed shaft pin. A second end of the latch may be movable into and out of the pocket. The latch may have a front surface slanted downwards towards the center of the pocket and have a guide hole near the back surface, opposite the front surface. A button connected to the latch by a moving shaft pin may be elastically coupled between the latch and the press plate, the button projecting upwards from the insert body and converting the movement of the press plate into rotational movement of the latch by causing the moving shaft pin to move along the guide hole. The movement of the shaft pin rotates the latch about the fixed shaft pin. The guide hole includes a guide hole correction space that permits movement of the moving shaft pin into the guide hole correction space such that the latch rotates about the fixed shaft pin independent of the movement of the press plate. An elastic body may be located between a back of the latch having the guide hole and the insert body near to the side of the latch, such that the elastic body applies an elastic force to a latch so as to cause the latch to protrude into the pocket.

摘要翻译： 在一个示例性实施例中，具有用于加载半导体封装的独立可移动的闩锁机构的插入件可以包括具有口袋的插入本体，安装在口袋的相对侧的闩锁单元以及弹性地安装在插入体上方的压板。 闩锁单元防止加载的半导体封装从口袋中逸出。 压板可以通过相对于插入体的上表面的运动来操作闩锁单元。 每个闩锁可以可移动地连接到插入体，使得闩锁的第一端可围绕固定的轴销旋转。 闩锁的第二端可以移动进入和离开口袋。 闩锁可以具有朝向凹部的中心向下倾斜的前表面，并且在后表面附近具有与前表面相对的引导孔。 通过移动的轴销连接到闩锁的按钮可以弹性地联接在闩锁和压板之间，按钮从插入体向上突出并且通过使移动轴线将压板的移动转换成闩锁的旋转运动 销沿导向孔移动。 轴销的运动使闩锁围绕固定轴销旋转。 引导孔包括引导孔校正空间，该引导孔修正空间允许移动轴销移动到引导孔校正空间中，使得闩锁围绕固定轴销旋转，而与压板的运动无关。 弹性体可以位于具有引导孔的闩锁的后部和插入物体靠近闩锁侧面之间，使得弹性体向闩锁施加弹性力，以使闩锁突出到 口袋。

公开(公告)号：US20070075702A1

公开(公告)日：2007-04-05

申请号：US11391381

申请日：2006-03-29

申请人： Jin-Woog Kim ,  Seok-Ho Jin ,  Seok-Young Yoon ,  Se-Un Lee ,  Hyeck-Jin Jeong

发明人： Jin-Woog Kim ,  Seok-Ho Jin ,  Seok-Young Yoon ,  Se-Un Lee ,  Hyeck-Jin Jeong

IPC分类号： G01R31/28

CPC分类号： G01R31/2893

摘要： In an example embodiment, an insert having an independently movable latch mechanism for loading a semiconductor package may include an insert body having a pocket, latch units installed at opposite sides of the pocket, and a press plate elastically installed above the insert body. The latch units prevent a loaded semiconductor package from escaping out of the pocket. The press plate may operate the latch unit by movement relative to an upper surface of the insert body. Each latch may be movably connected to the insert body such that a first end of the latch is rotatable around a fixed shaft pin. A second end of the latch may be movable into and out of the pocket. The latch may have a front surface slanted downwards towards the center of the pocket and have a guide hole near the back surface, opposite the front surface. A button connected to the latch by a moving shaft pin may be elastically coupled between the latch and the press plate, the button projecting upwards from the insert body and converting the movement of the press plate into rotational movement of the latch by causing the moving shaft pin to move along the guide hole. The movement of the shaft pin rotates the latch about the fixed shaft pin. The guide hole includes a guide hole correction space that permits movement of the moving shaft pin into the guide hole correction space such that the latch rotates about the fixed shaft pin independent of the movement of the press plate. An elastic body may be located between a back of the latch having the guide hole and the insert body near to the side of the latch, such that the elastic body applies an elastic force to a latch so as to cause the latch to protrude into the pocket.