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    PCB PRODUCTION BY LASER SYSTEMS
    1.
    发明公开
    PCB PRODUCTION BY LASER SYSTEMS 审中-公开

    公开(公告)号：US20240324101A1

    公开(公告)日：2024-09-26

    申请号：US18678263

    申请日：2024-05-30

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Guy Nesher

    IPC: H05K1/11 ,  H05K3/34 ,  H05K13/04

    CPC classification number: H05K1/111 ,  H05K3/341 ,  H05K13/046 ,  H05K2201/10666

    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

    PCB production by laser systems
    2.
    发明授权
    PCB production by laser systems 有权

    公开(公告)号：US11877398B2

    公开(公告)日：2024-01-16

    申请号：US17249217

    申请日：2021-02-24

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Guy Nesher

    IPC: H05K1/11 ,  H05K13/04 ,  H05K3/34

    CPC classification number: H05K1/111 ,  H05K3/341 ,  H05K13/046 ,  H05K2201/10666

    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

    Accurate volume and temperature dispensing head
    6.
    发明授权
    Accurate volume and temperature dispensing head 有权

    公开(公告)号：US11629987B2

    公开(公告)日：2023-04-18

    申请号：US17449722

    申请日：2021-10-01

    Applicant: IO Tech Group Ltd.

    Inventor： Ziv Gilan

    IPC: G01F11/38 ,  B67D3/00

    Abstract: Systems and methods for the injection/dispensing of fluid material in a volumetrically accurate and repeatable manner via an injection cell that interconnects two reservoirs of the fluid material. The injection cell has a normally closed dispensing valve that is opened for dispensing of the fluid material during a compression cycle, and closed during a return cycle. Opening and closing of the dispensing valve is effected using either or both of pressurized air and/or a motorized linkage. During the compression cycle, independent longitudinal displacements of a piston cylinder and a piston within the injection cell act to first open the dispensing valve and subsequently eject fluid material within the piston cylinder via the opened dispensing valve. The piston cylinder and piston are returned to an initial state that facilitates reloading of the injection cell from the reservoirs and closes the dispensing valve during a return cycle.

    METHOD FOR OPERATING A WIRE-LESS VARIABLE GAP COATER DEVICE
    8.
    发明申请
    METHOD FOR OPERATING A WIRE-LESS VARIABLE GAP COATER DEVICE 有权

    公开(公告)号：US20230012396A1

    公开(公告)日：2023-01-12

    申请号：US17933299

    申请日：2022-09-19

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan

    IPC: B05C11/02

    Abstract: Systems and methods for coating a thin film with a viscous material, such as a liquid, a paste, or an adhesive, at a desired thickness. In such a system, two films move adjacent to one another, optionally in opposite directions, atop two rollers separated by a known gap that defines a coating thickness, with the material being transferred from one film to the other. The rollers may be maintained in their relative positions by springs and/or linear actuators and positioned using linear encoders. In alternative arrangements, the material to be coated could be low viscosity material such as a polymeric solution. Air knives may be provided near the gap to create an air flow that aids in preventing the free flow of low viscosity materials outside the bounds of the film during coating.

    METHODS FOR PRINTING SOLDER PASTE AND OTHER VISCOUS MATERIALS AT HIGH RESOLUTION
    9.
    发明申请
    METHODS FOR PRINTING SOLDER PASTE AND OTHER VISCOUS MATERIALS AT HIGH RESOLUTION 有权

    公开(公告)号：US20220379396A1

    公开(公告)日：2022-12-01

    申请号：US17818308

    申请日：2022-08-08

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan ,  Guy Nesher

    IPC: B23K1/00 ,  H05K3/34 ,  B41M3/00 ,  B41F16/00 ,  B05D3/06 ,  B05D1/26 ,  B05D1/28 ,  B05C5/02 ,  B05C1/08 ,  B05C9/14

    Abstract: Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

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