公开(公告)号：US08338317B2

公开(公告)日：2012-12-25

申请号：US13080813

申请日：2011-04-06

Applicant: Manfred Engelhardt ,  Hans-Joerg Timme ,  Ivan Nikitn ,  Manfred Frank ,  Thomas Kunstmann ,  Werner Robl ,  Guenther Ruhl

Inventor： Manfred Engelhardt ,  Hans-Joerg Timme ,  Ivan Nikitn ,  Manfred Frank ,  Thomas Kunstmann ,  Werner Robl ,  Guenther Ruhl

IPC: H01L21/00

CPC classification number: H01L33/405 ,  C23C4/08 ,  C23C4/134 ,  H01L21/02115 ,  H01L21/02118 ,  H01L21/02203 ,  H01L21/02263 ,  H01L21/0331 ,  H01L21/2855 ,  H01L21/6835 ,  H01L21/76877 ,  H01L21/76885 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/074 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/04026 ,  H01L2224/04105 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/27418 ,  H01L2224/27622 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/8381 ,  H01L2224/8382 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/181 ,  H05H1/42 ,  H05K2203/1344 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2924/0105

Abstract: According to various embodiments, a method for processing a semiconductor wafer or die is provided including supplying particles to a plasma such that the particles are activated by the plasma and spraying the activated particles on the semiconductor wafer or die to generate a particle layer on the semiconductor wafer or die.

Abstract translation: 根据各种实施例，提供了一种用于处理半导体晶片或裸片的方法，包括向等离子体供应颗粒，使得颗粒被等离子体激活并将活化的颗粒喷射在半导体晶片或裸片上，以在半导体上产生颗粒层 晶片或模具。

公开(公告)号：US20120256323A1

公开(公告)日：2012-10-11

申请号：US13080813

申请日：2011-04-06

Applicant: Manfred Engelhardt ,  Hans-Joerg Timme ,  Ivan Nikitn ,  Manfred Frank ,  Thomas Kunstmann ,  Werner Robl ,  Guenther Ruhl

Inventor： Manfred Engelhardt ,  Hans-Joerg Timme ,  Ivan Nikitn ,  Manfred Frank ,  Thomas Kunstmann ,  Werner Robl ,  Guenther Ruhl

IPC: H01L23/485 ,  H01L21/768 ,  B05B5/03

CPC classification number: H01L33/405 ,  C23C4/08 ,  C23C4/134 ,  H01L21/02115 ,  H01L21/02118 ,  H01L21/02203 ,  H01L21/02263 ,  H01L21/0331 ,  H01L21/2855 ,  H01L21/6835 ,  H01L21/76877 ,  H01L21/76885 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/074 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/04026 ,  H01L2224/04105 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/27418 ,  H01L2224/27622 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/8381 ,  H01L2224/8382 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/181 ,  H05H1/42 ,  H05K2203/1344 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2924/0105

Abstract: According to various embodiments, a method for processing a semiconductor wafer or die is provided including supplying particles to a plasma such that the particles are activated by the plasma and spraying the activated particles on the semiconductor wafer or die to generate a particle layer on the semiconductor wafer or die.

Abstract translation: 根据各种实施例，提供了一种用于处理半导体晶片或裸片的方法，包括向等离子体供应颗粒，使得颗粒被等离子体激活并将活化的颗粒喷射在半导体晶片或裸片上，以在半导体上产生颗粒层 晶片或模具。