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公开(公告)号：US09263221B2
公开(公告)日：2016-02-16
申请号：US13518813
申请日：2010-11-24
申请人： Tim Fiedler , Frank Jermann , Jörg Strauss
发明人： Tim Fiedler , Frank Jermann , Jörg Strauss
CPC分类号： H01J1/63 , C09K11/0883 , C09K11/7734 , C09K11/7774 , C09K11/7792 , H01L33/502 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A luminophore from the class of nitridic or oxynitridic luminophores with at least one cation M and an activator D, wherein a proportion x of the cation is replaced with Cu and D is at least one element from the series Eu, Ce, Sm, Yb and Tb
摘要翻译： 来自具有至少一个阳离子M和活化剂D的氮或氧氮发光体类的发光体，其中阳离子的比例x被Cu代替，D是Eu，Ce，Sm，Yb系列中的至少一种元素， Tb
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公开(公告)号：US20090212307A1
公开(公告)日：2009-08-27
申请号：US11921530
申请日：2006-06-02
申请人： Johannes Baur , Volker Hárle , Berthold Hahn , Andreas Weimar , Raimund Oberschmid , Ewald Karl Michael Guenther , Franz Eberhard , Markus Richter , Jörg Strauss
发明人： Johannes Baur , Volker Hárle , Berthold Hahn , Andreas Weimar , Raimund Oberschmid , Ewald Karl Michael Guenther , Franz Eberhard , Markus Richter , Jörg Strauss
IPC分类号： H01L33/00
CPC分类号： H01L33/38 , H01L2924/0002 , H01L2924/00
摘要： In a luminescence diode chip having a radiation exit area (1) and a contact structure (2, 3, 4) which is arranged on the radiation exit area (1) and comprises a bonding pad (4) and a plurality of contact webs (2, 3) which are provided for current expansion and are electrically conductively connected to the bonding pad (4), the bonding pad (4) is arranged in an edge region of the radiation exit area (1). The luminescence diode chip has reduced absorption of the emitted radiation (23) in the contact structure (2, 3, 4).
摘要翻译： 在具有辐射出射区域（1）的发光二极管芯片和设置在辐射出口区域（1）上的接触结构（2,3,4），并且包括接合焊盘（4）和多个接触腹板 2，3），其被设置用于电流膨胀并且导电连接到焊盘（4），焊盘（4）布置在辐射出口区域（1）的边缘区域中。 发光二极管芯片减少了接触结构（2,3,4）中发射的辐射（23）的吸收。
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公开(公告)号：US07208769B2
公开(公告)日：2007-04-24
申请号：US11119403
申请日：2005-04-29
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The invention concerns an LED arrangement with at least one LED chip (11) comprising a radiation decoupling surface (12) through which the bulk of the electromagnetic radiation generated in the LED chip (11) is decoupled. Arranged on the radiation decoupling surface (12) is at least one phosphor layer (13) for converting the electromagnetic radiation generated in the LED chip. A housing (17) envelops portions of the LED chip (11) and the phosphor layer (13).
摘要翻译： 本发明涉及一种具有至少一个LED芯片（11）的LED装置，该LED芯片（11）包括辐射去耦表面（12），在LED芯片（11）中产生的大部分电磁辐射通过该去耦合表面被去耦合。 布置在辐射去耦表面（12）上的是用于转换在LED芯片中产生的电磁辐射的至少一个磷光体层（13）。 壳体（17）包围LED芯片（11）的部分和荧光体层（13）。
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公开(公告)号：US08581279B2
公开(公告)日：2013-11-12
申请号：US11921530
申请日：2006-06-02
申请人： Johannes Baur , Volker Härle , Berthold Hahn , Andreas Weimar , Raimund Oberschmid , Ewald Karl Michael Guenther , Franz Eberhard , Markus Richter , Jörg Strauss
发明人： Johannes Baur , Volker Härle , Berthold Hahn , Andreas Weimar , Raimund Oberschmid , Ewald Karl Michael Guenther , Franz Eberhard , Markus Richter , Jörg Strauss
IPC分类号： H01L33/00
CPC分类号： H01L33/38 , H01L2924/0002 , H01L2924/00
摘要： In a luminescence diode chip having a radiation exit area (1) and a contact structure (2, 3, 4) which is arranged on the radiation exit area (1) and comprises a bonding pad (4) and a plurality of contact webs (2, 3) which are provided for current expansion and are electrically conductively connected to the bonding pad (4), the bonding pad (4) is arranged in an edge region of the radiation exit area (1). The luminescence diode chip has reduced absorption of the emitted radiation (23) in the contact structure (2, 3, 4).
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公开(公告)号：US20130113364A1
公开(公告)日：2013-05-09
申请号：US13518813
申请日：2010-11-24
申请人： Tim Fiedler , Frank Jermann , Jörg Strauss
发明人： Tim Fiedler , Frank Jermann , Jörg Strauss
IPC分类号： H01J1/63
CPC分类号： H01J1/63 , C09K11/0883 , C09K11/7734 , C09K11/7774 , C09K11/7792 , H01L33/502 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A luminophore from the class of nitridic or oxynitridic luminophores with at least one cation M and an activator D, wherein a proportion x of the cation is replaced with Cu and D is at least one element from the series Eu, Ce, Sm, Yb and Tb
摘要翻译： 来自具有至少一个阳离子M和活化剂D的氮或氧氮发光体类的发光体，其中阳离子的比例x被Cu代替，D是Eu，Ce，Sm，Yb系列中的至少一种元素， Tb
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公开(公告)号：US20090278441A1
公开(公告)日：2009-11-12
申请号：US11919296
申请日：2006-04-11
申请人： Bert Braune , Frank Jermann , Jörg Strauss
发明人： Bert Braune , Frank Jermann , Jörg Strauss
IPC分类号： H01L33/00
CPC分类号： H01L33/504 , H01L2224/48091 , H01L2924/00014
摘要： A luminescence conversion of LED, which uses a blue emitting chip and two illuminating substances, whereby one emits a red and the other a yellow to green. Both illuminating substances are separated upstream from the chip.
摘要翻译： LED的发光转换，其使用蓝色发光芯片和两种照明物质，由此发出红色而另一种发出黄色至绿色。 两个照明物质都从芯片的上游分离。
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公开(公告)号：US20090206352A1
公开(公告)日：2009-08-20
申请号：US11920757
申请日：2006-05-11
申请人： Daniel Becker , Herbert Brunner , Tim Fiedler , Jörg Strauss , Martin Zachau
发明人： Daniel Becker , Herbert Brunner , Tim Fiedler , Jörg Strauss , Martin Zachau
CPC分类号： H01L33/505 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A luminescence conversion LED having a radiation emitting chip that is connected to electrical connections and is surrounded by a housing that comprises at least a basic body and a cap, the chip being seated on the basic body, in particular in a cutout of the basic body, and the primary radiation of the chip being converted at least partially into longer wave radiation by a conversion element, wherein the cap is formed by a vitreous body, the conversion means being contained in the vitreous body, the refractive index of the vitreous body being higher than 1.6, preferably at least n=1.7.
摘要翻译： 一种发光转换LED，其具有连接到电连接的辐射发射芯片，并且被包括至少包括基体和盖的壳体包围，所述芯片位于基体上，特别是在基体的切口中 并且所述芯片的主要辐射通过转换元件至少部分地转换成更长的波长辐射，其中所述盖由玻璃体形成，所述转换装置包含在所述玻璃体中，所述玻璃体的折射率为 高于1.6，优选至少n = 1.7。
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公开(公告)号：US07510888B2
公开(公告)日：2009-03-31
申请号：US11686525
申请日：2007-03-15
IPC分类号： H01L21/00
CPC分类号： H01L33/56 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.
摘要翻译： 本发明涉及一种具有至少一个LED芯片的LED装置，其包括辐射去耦表面，通过该辐射去耦表面在LED芯片中产生的大部分电磁辐射被去耦合。 布置在辐射去耦表面上的是用于转换在LED芯片中产生的电磁辐射的至少一个磷光体层。 壳体包围LED芯片和荧光体层的部分。
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