摘要:
A method of constructing a standard cell library for double patterning lithography (DPL) includes dividing a standard cell into a first region determined not to have an interaction with an adjacent outer cell and a second region that is likely to have such an interaction, generating data representative of DPL patterns corresponding to the first and second regions, and generating a standard cell library made up of the data. The library is then accessed and used to form a DPL mask. The DPL mask can be used to form a pattern on a substrate made up of a layout of cells in which the pattern of the standard cell is duplicated at several locations in the layout.
摘要:
A power control process in which an inner region optimum power control (“OPC”) value of an inner region of an optical disc is measured at a base speed is selectively performed. A predicted outer region OPC value is calculated based upon the inner region OPC value, a reference laser power associated with the base speed and a desired maximum speed. The predicted outer region OPC value is compared with a laser power limit, and whether to measure an outer region OPC value on an outer region of the optical disc at a desired maximum speed is determined.
摘要:
A power control circuit is connected between a power supply voltage and a logic circuit to switch power supplied to the logic circuit. The power control circuit includes a plurality of first power gating cells (PGCs) receiving an external mode change signal in parallel, at least one second PGC connected with one first PGC, at least one third PGC connected with the at least one second PGC, and at least one fourth PGC connected with the at least one third PGC. The second power gating cell, the third PGC, and/or the fourth PGC may include a plurality of gating cells. At least one of the second, third, and fourth pluralities has power gating cells connected in series. Each of the first through fourth PGCs switches power supplied in response to the mode change signal.
摘要:
In a method of designing a system-on-chip including a tapless standard cell to which body biasing is applied, a slow corner timing parameter is adjusted to increase a slow corner of an operating speed distribution for the system-on-chip by reflecting forward body biasing, and a fast corner timing parameter is adjusted to decrease a fast corner of the operating speed distribution for the system-on-chip by reflecting reverse body biasing. The system-on-chip including the tapless standard cell is implemented based on the adjusted slow corner timing parameter corresponding to the increased slow corner and the adjusted fast corner timing parameter corresponding to the decreased fast corner. The slow corner timing parameter corresponds to a lowest value of an operating speed design window of the system-on-chip, and, the fast corner timing parameter corresponds to a highest value of the operating speed design window of the system-on-chip.
摘要:
A circuit having an active clock shielding structure includes a logic circuit that receives a clock signal and performs a logic operation based on the clock signal, a power gating circuit that switches a mode of the logic circuit between an active mode and an sleep mode based on a power gating signal, a clock signal transmission line that transmits the clock signal to the logic circuit, and at least one power gating signal transmission line that transmits the power gating signal to the power gating circuit and functions as a shielding line pair with the clock signal transmission line.
摘要:
A semiconductor integrated circuit device includes a semiconductor substrate; a dummy pattern extending in one direction on the semiconductor substrate; a junction region electrically connecting the dummy pattern to the semiconductor substrate; and a voltage applying unit that is configured to apply a bias voltage to the dummy pattern.
摘要:
In a method of designing a semiconductor device, a transistor included in a layout of the semiconductor device may be selected. A biasing data may be set for changing a characteristic of the selected transistor. A design rule check (DRC) process for the layout of the semiconductor device may be performed after ignoring the biasing data. An optical proximity correction (OPC) process for the layout of the semiconductor device may be performed based on the biasing data.
摘要:
A power control circuit is connected between a power supply voltage and a logic circuit to switch power supplied to the logic circuit. The power control circuit includes a plurality of first power gating cells (PGCs) receiving an external mode change signal in parallel, at least one second PGC connected with one first PGC, at least one third PGC connected with the at least one second PGC, and at least one fourth PGC connected with the at least one third PGC. The second power gating cell, the third PGC, and/or the fourth PGC may include a plurality of gating cells. At least one of the second, third, and fourth pluralities has power gating cells connected in series. Each of the first through fourth PGCs switches power supplied in response to the mode change signal.
摘要:
A method of controlling the provision of a body bias voltage to a logic gate region of a semiconductor device includes; gating application of a clock signal applied to a synchronization element in the logic gate region in accordance with an enable signal, and providing the body bias voltage to each body terminal of a plurality of logic gates arranged in the logic gate region in accordance with the enable signal.
摘要:
In a method of estimating a leakage current in a semiconductor device, a chip including a plurality of cells is divided into segments by a grid model. Spatial correlation is determined as spatial correlation between process parameters concerned with the leakage currents in each of the cells. A virtual cell leakage characteristic function of a cell is generated by arithmetically operating actual leakage characteristic functions. A segment leakage characteristic function of a segment is generated by arithmetically operating the virtual cell leakage characteristic functions of all cells in the segment. Then, a full chip leakage characteristic function of the chip is generated by statistically operating the segment leakage characteristic functions of all segments in the chip. Accordingly, computational loads of Wilkinson's method for generating the full chip leakage characteristic function can remarkably be reduced.