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公开(公告)号：US20110092015A1
公开(公告)日：2011-04-21
申请号：US12996473
申请日：2009-05-29
CPC分类号： H01L51/0007 , H01L51/0005 , H01L51/0094 , H01L51/0545
摘要： Compositions that contain an organic semiconductor dissolved in a solvent mixture are described. More specifically, the solvent mixture includes an alkane having 9 to 16 carbon atoms in an amount equal to 1 to 20 weight percent and an aromatic compound in an amount equal to 80 to 99 weight percent. The semiconductor material is dissolved in the solvent mixture in an amount equal to at least 0.1 weight percent based on a total weight of the composition. Methods of making a semiconductor device using the compositions to form a semiconductor layer are also described.
摘要翻译： 描述了含有溶解在溶剂混合物中的有机半导体的组合物。 更具体地说，溶剂混合物包括等于1至20重量％的具有9至16个碳原子的烷烃和等于80至99重量％的芳族化合物。 半导体材料以等于组合物总重量的至少0.1重量％的量溶解在溶剂混合物中。 还描述了使用组合物制造半导体器件以形成半导体层的方法。
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公开(公告)号：US5658650A
公开(公告)日：1997-08-19
申请号：US454652
申请日：1995-05-31
CPC分类号： A61L15/12 , A61F13/04 , Y10T442/2861 , Y10T442/2893 , Y10T442/291 , Y10T442/2992
摘要： The present invention provides an article, comprising: a fabric sheet which has been compacted using a heat shrink yarn; and a curable or hardenable resin coated onto the fabric sheet. The present invention involves compacting a fabric sheet to impart stretchability and conformability to the fabric while minimizing undesirable recovery forces. Suitable fabrics for compacting are fabrics which comprise fiberglass fibers which are capable of first being compacted and then being heat set or annealed in the compacted state. The article may be in the form of an orthopedic bandage and may optionally contain a micro fiber filler associated with the resin.
摘要翻译： 本发明提供一种制品，其特征在于，包括：使用热收缩丝压实的织物片; 以及涂覆在织物片上的可固化或可硬化的树脂。 本发明包括压实织物片材以赋予织物拉伸性和适形性，同时最小化不希望的恢复力。 用于压实的合适的织物是包括玻璃纤维的织物，其能够首先被压实，然后在压实状态下进行热定型或退火。 制品可以是矫形绷带的形式，并且可以任选地包含与树脂相关联的微纤维填料。
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3.发明申请METHODS FOR MAKING ELECTRONIC DEVICES WITH A SOLUTION DEPOSITED GATE DIELECTRIC 有权用于制造具有溶液沉积栅电介质的电子器件的方法公开(公告)号：US20090004771A1
公开(公告)日：2009-01-01
申请号：US11771787
申请日：2007-06-29
IPC分类号： H01L21/336 , B05D3/06 , H01L51/40 , B05D5/12
CPC分类号： H01L51/0537 , H01L27/1292 , H01L29/78681 , H01L51/0005 , H01L51/0541 , H01L51/0545
摘要： A method of making an electronic device comprises solution depositing a dielectric composition onto a substrate and polymerizing the dielectric composition to form a gate dielectric. The dielectric composition comprises a polymerizable resin and zirconium oxide nanoparticles.
摘要翻译： 制造电子器件的方法包括将电介质组合物沉积在衬底上并聚合电介质组合物以形成栅极电介质。 电介质组合物包含可聚合树脂和氧化锆纳米颗粒。
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4.发明授权Incremental method of producing multiple UV-induced gratings on a single optical fiber 失效在单根光纤上产生多个UV感应光栅的增量方法公开(公告)号：US06272886B1
公开(公告)日：2001-08-14
申请号：US08735468
申请日：1996-10-23
申请人： James C. Novack , Bryon J. Cronk , Bruce A. Rabine , Gary A. Ball , Harmeet Singh , Paul E. Sanders
发明人： James C. Novack , Bryon J. Cronk , Bruce A. Rabine , Gary A. Ball , Harmeet Singh , Paul E. Sanders
IPC分类号： C03B3710
CPC分类号： G02B6/245 , G02B6/02123
摘要： The present invention is a process for manufacturing an optical fiber Bragg grating, which in a preferred embodiment includes the steps of: (a) removing at least a portion of a removable coating on an optical fiber element in at least one predetermined section to sufficiently expose the optical fiber in the section for a subsequent treatment by a source of optical radiation; (b) fixing the at least one section with respect to the source of optical radiation; (c) directing optical radiation from the source into the optical fiber to produce at least one Bragg grating in the at least one section; and (d) covering the at least one section. The present invention also extends to an apparatus for carrying out the process steps described above, which includes means for coating removal, means for fiber immobilization, means for writing a Bragg grating, and means for packaging.
摘要翻译： 本发明是一种用于制造光纤布拉格光栅的方法，其在优选的实施方案中包括以下步骤：（a）在至少一个预定部分中去除光纤元件上至少一部分可移除涂层，以充分曝光 该光纤在该部分用于随后由光辐射源处理; （b）相对于光辐射源固定该至少一个部分; （c）将来自所述源的光辐射引导到所述光纤中以在所述至少一个部分中产生至少一个布拉格光栅; 和（d）覆盖至少一个部分。 本发明还延伸到用于执行上述工艺步骤的装置，其包括用于涂层去除的装置，用于固定纤维的装置，用于写入布拉格光栅的装置和用于包装的装置。
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5.发明授权Process for preparation of optical fiber devices using optical fibers with thermally removable coatings 失效使用具有热可除去涂层的光纤制备光纤器件的方法
公开(公告)号：US5939136A
公开(公告)日：1999-08-17
申请号：US631491
申请日：1996-04-12
CPC分类号： G02B6/245 , G02B6/02123 , G02B6/02104
摘要： A method of making an optical fiber device, which comprises the steps of providing an optical fiber element comprising an optical fiber having at least one thermally removable coating thereon, and thermally removing all or a predetermined portion of the thermally removable coating(s) to sufficiently expose said optical fiber for a subsequent processing step. Following removal of the thermally removable coating, the optical fiber has a predetermined median fracture stress, as measured according to FOTP-28. The optical fiber may then be processed into an optical fiber device and optionally recoated.
摘要翻译： 一种制造光纤器件的方法，包括以下步骤：提供光纤元件，该光纤元件包括在其上具有至少一个可热除去的涂层的光纤，并将所有或预定部分的热可除去涂层除热至足够 暴露所述光纤用于随后的处理步骤。 在除去热可除去涂层之后，根据FOTP-28测量，光纤具有预定的中值断裂应力。 然后可以将光纤加工成光纤装置并且可选地重新涂覆。
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公开(公告)号：US5455060A
公开(公告)日：1995-10-03
申请号：US141830
申请日：1993-10-25
CPC分类号： A61L15/12 , A61F13/04 , Y10T442/2861 , Y10T442/2893 , Y10T442/291 , Y10T442/2992
摘要： The present invention provides an article, comprising: a fabric sheet which has been compacted using a heat shrink yarn; and a curable or hardenable resin coated onto the fabric sheet. The present invention involves compacting a fabric sheet to impart stretchability and conformability to the fabric while minimizing undesirable recovery forces. Suitable fabrics for compacting are fabrics which comprise fiberglass fibers which are capable of first being compacted and then being heat set or annealed in the compacted state. The article may be in the form of an orthopedic bandage and may optionally contain a microfiber filler associated with the resin.
摘要翻译： 本发明提供一种制品，其特征在于，包括：使用热收缩丝压实的织物片; 以及涂覆在织物片上的可固化或可硬化的树脂。 本发明包括压实织物片材以赋予织物拉伸性和适形性，同时最小化不希望的恢复力。 用于压实的合适的织物是包括玻璃纤维的织物，其能够首先被压实，然后在压实状态下进行热定型或退火。 制品可以是矫形绷带的形式，并且可以任选地包含与树脂相关联的超细纤维填料。
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公开(公告)号：US20130313339A1
公开(公告)日：2013-11-28
申请号：US13982866
申请日：2012-02-02
CPC分类号： F02M61/168 , B29C33/424 , C25D1/10 , F02M43/04 , F02M61/1833 , F02M61/184 , F02M61/1846 , F02M61/1853 , F02M2200/8046 , F02M2200/8069 , F02M2200/9092 , Y10T29/49405 , Y10T29/4998 , Y10T428/24273
摘要： Nozzle and a method of making the same are disclosed. The method includes (a) providing a microstructured mold pattern defining at least a portion of a mold and comprising a plurality of replica nozzle holes and replica planar control cavities; (b) molding a first material into a nozzle forming microstructured pattern using the microstructured mold pattern, with the nozzle forming microstructured pattern comprising a plurality of nozzle hole forming features and planar control cavity forming features; (c) forming a second material into a nozzle pre-form using the nozzle forming microstructured pattern, with the nozzle pre-form comprising a plurality of nozzle pre-form holes and sacrificial planar control cavities; and (d) forming a nozzle from the nozzle pre-form, said forming the nozzle comprising removing enough of the second material to remove the sacrificial planar control cavities so as to form a top surface of the nozzle pre-form into a planar top surface of the nozzle, and to form each of the nozzle pre-form holes into a nozzle through hole.
摘要翻译： 公开了喷嘴及其制造方法。 该方法包括（a）提供限定模具的至少一部分并且包括多个复制喷嘴孔和复制平面控制腔的微结构模具图案; （b）使用微结构化模具将第一材料模制成形成微结构图案的喷嘴，喷嘴形成微结构图案包括多个喷嘴孔形成特征和平面控制腔形成特征; （c）使用所述喷嘴形成微结构图案将喷嘴预成型形成第二材料，所述喷嘴预成型件包括多个喷嘴预成型孔和牺牲平面控制腔; 并且（d）从喷嘴预成型件形成喷嘴，所述形成喷嘴包括去除足够的第二材料以去除牺牲平面控制腔，以便将喷嘴预成型件的顶表面形成为平面顶表面 并且将每个喷嘴预成形孔形成为喷嘴通孔。
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公开(公告)号：US08232550B2
公开(公告)日：2012-07-31
申请号：US12996473
申请日：2009-05-29
IPC分类号： H01L29/08
CPC分类号： H01L51/0007 , H01L51/0005 , H01L51/0094 , H01L51/0545
摘要： Compositions that contain an organic semiconductor dissolved in a solvent mixture are described. More specifically, the solvent mixture includes an alkane having 9 to 16 carbon atoms in an amount equal to 1 to 20 weight percent and an aromatic compound in an amount equal to 80 to 99 weight percent. The semiconductor material is dissolved in the solvent mixture in an amount equal to at least 0.1 weight percent based on a total weight of the composition. Methods of making a semiconductor device using the compositions to form a semiconductor layer are also described.
摘要翻译： 描述了含有溶解在溶剂混合物中的有机半导体的组合物。 更具体地说，溶剂混合物包括等于1至20重量％的具有9至16个碳原子的烷烃和等于80至99重量％的芳族化合物。 半导体材料以等于组合物总重量的至少0.1重量％的量溶解在溶剂混合物中。 还描述了使用组合物制造半导体器件以形成半导体层的方法。
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公开(公告)号：US06311524B1
公开(公告)日：2001-11-06
申请号：US09616117
申请日：2000-07-14
IPC分类号： G01N2300
CPC分类号： C03C25/6226 , C03C3/06 , C03C25/00 , C03C25/607 , C03C2201/21 , C03C2201/31 , G02B6/02114
摘要： A method for rapidly increasing the photosensitivity of an optical fiber comprising the step of providing an optical fiber comprising a glassy material and a thermally-stable coating. The thermally-stable coating has a thermally-stable exposure band, wherein desired time/temperature exposure parameters fall within the time/temperature thermal stability exposure band for the coating. The optical fiber is exposed for the desired time/temperature exposure to a hydrogen-containing atmosphere. The desired temperature is more than 250° C. and the desired time exposure does not exceed one hour. The glassy material then may be irradiated with actinic radiation, such that the refractive index of the irradiated portion results in a normalized index change of at least 10−5.
摘要翻译： 一种用于快速增加光纤的光敏性的方法，包括提供包括玻璃状材料和热稳定涂层的光纤的步骤。 热稳定涂层具有热稳定的曝光带，其中期望的时间/温度暴露参数落在用于涂层的时间/温度热稳定性暴露带内。 将光纤暴露于含氢气氛所需的时间/温度下。 所需温度大于250℃，所需时间不超过1小时。 然后可以用光化辐射照射玻璃状材料，使得照射部分的折射率导致至少10-5的归一化指数变化。
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10.发明授权Optical fiber element having a permanent protective coating with a Shore D hardness value of 65 or more 失效具有肖氏D硬度值为65以上的永久保护涂层的光纤元件
公开(公告)号：US5381504A
公开(公告)日：1995-01-10
申请号：US152206
申请日：1993-11-15
CPC分类号： G02B6/443 , C03C25/106 , C03C25/1065
摘要： An optical fiber element includes an optical fiber having a numerical aperture ranging from 0.08 to 0.34 and a protective coating affixed to the outer surface of the optical fiber. The protective coating has a Shore D hardnees value of 65 or more and remains on the optical fiber during connectorization so that the fiber is neither damaged by the blades of a stripping tool nor subjected to chemical or physical attack.
摘要翻译： 光纤元件包括数值孔径范围为0.08至0.34的光纤和固定在光纤外表面上的保护涂层。 保护涂层的肖氏D硬度值为65以上，并且在连接处理期间保留在光纤上，使得光纤既不被剥离工具的刀片损坏也不会遭受化学或物理攻击。
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