公开(公告)号：US6006447A

公开(公告)日：1999-12-28

申请号：US296548

申请日：1999-04-22

申请人： James R. Neal ,  Estella B. Lindsay

发明人： James R. Neal ,  Estella B. Lindsay

IPC分类号： A43B7/06 ,  A43B17/08

CPC分类号： A43B17/08 ,  A43B7/06

摘要： The present invention discloses a device for a shoe insole having multiple layers which form an air circulation system. A first layer is a fabric-like covering; a non-deformable second and deformable third layers forming together a layer with a cavity therein having offset apertures therein communicating by means of the cavity positioned underneath the fabric-like covering; a fourth layer made of foam rubber like material that deflates under the user's weight and re-expands when not under the user's weight; a bottom layer being a stiffer layer that forms a recess for receiving the other layers. A first and second exhaust conduit is formed in a side extension area for outward passage of stale air. The layers are joined to each other and the device is then inserted into the shoe of the user. The weight of the user is alternatively placed on and removed from the insole while walking or running. When the weight of the user is on the insole it compresses and stale air is forced out the exhaust conduit. When the weight of the user is removed from the insole, the foam rubber layer seeks to expand and therefore creates a vacuum which pulls air through the apertures of the second and third layers as the deformable third layer is deposed toward the foam rubber layer.

摘要翻译： 本发明公开了一种具有形成空气循环系统的多层的鞋垫的装置。 第一层是织物状的覆盖物; 不可变形的第二和可变形的第三层，其中其中具有腔的层与其中具有偏移孔的层通过位于织物状覆盖物下面的空腔连通; 由泡沫橡胶制成的第四层材料，在用户的重量下放气，并在不在使用者体重的情况下重新膨胀; 底层是形成用于接收其它层的凹部的更硬的层。 第一和第二排气导管形成在侧延伸区域中，用于向外通过陈旧的空气。 这些层彼此连接，然后将该装置插入使用者的鞋中。 在步行或跑步时，使用者的重量可替代地放置在鞋内底上并从内底移除。 当用户的重量在鞋垫上时，其压缩并且陈旧的空气被迫排出排气导管。 当使用者的重量从鞋内底移除时，泡沫橡胶层试图膨胀并且因此产生真空，当真空可变形的第三层朝向泡沫橡胶层时，真空将空气抽吸通过第二和第三层的孔。

公开(公告)号：US5946470A

公开(公告)日：1999-08-31

申请号：US648559

申请日：1996-05-15

申请人： James R. Neal ,  Ted W. Pickerrell, Jr. ,  Louis W. Agatstein, Jr.

发明人： James R. Neal ,  Ted W. Pickerrell, Jr. ,  Louis W. Agatstein, Jr.

IPC分类号： G06F13/40 ,  G06F13/42

CPC分类号： G06F13/4068

摘要： An upgrade integrated circuit is used in a board without redesigning the board. The board is operative at a first voltage level, and the upgrade integrated circuit is operative at a second voltage level. The method comprises the steps of intercepting a first set of signals originating from the board. These signals are shifted using a voltage level shifter to be operative at a second voltage level. The voltage level shifter, however, does not reside on the board. The voltage level shifted signals are provided to the upgrade integrated circuit. The upgrade integrated circuit and the voltage level shifter may reside on a processor card.

摘要翻译： 板上使用升级集成电路，无需重新设计电路板。 电路板工作在第一电压电平，升压集成电路工作在第二电压电平。 该方法包括以下步骤：拦截源自该板的第一组信号。 这些信号使用电压电平转换器移位，以在第二电压电平下工作。 然而，电压电平转换器不在电路板上。 电压电平转换信号提供给升级集成电路。 升级集成电路和电压电平转换器可以驻留在处理器卡上。

公开(公告)号：US06594556B1

公开(公告)日：2003-07-15

申请号：US08795817

申请日：1997-02-05

申请人： Louis W. Agatstein ,  James R. Neal

发明人： Louis W. Agatstein ,  James R. Neal

IPC分类号： G05D900

CPC分类号： H05K1/141 ,  G06F1/26 ,  H05K1/0262 ,  H05K1/0286 ,  H05K1/18 ,  H05K3/366 ,  H05K2201/10189 ,  H05K2201/10196

摘要： An apparatus for regulating voltage and power in a computer system is disclosed. The voltage and power regulation is performed by voltage regulation circuitry on a voltage regulator module. The voltage regulator module is a detachable unit which interfaces with the motherboard through a socket connector. The socket connector has a fixed pin definition which allows a variety of voltage regulator modules programmed to regulate voltages and power at different levels to be implemented on the motherboard.

摘要翻译： 公开了一种用于调节计算机系统中的电压和功率的装置。 电压和功率调节由电压调节器模块上的电压调节电路执行。 电压调节器模块是通过插座连接器与主板接口的可拆卸单元。 插座连接器具有固定的引脚定义，允许编程的各种电压调节器模块调节在主板上实现的不同电平的电压和功率。

公开(公告)号：US5483102A

公开(公告)日：1996-01-09

申请号：US241777

申请日：1994-05-12

申请人： James R. Neal ,  Peter F. Brown ,  Louis W. Agatstein ,  Michael Gutman

发明人： James R. Neal ,  Peter F. Brown ,  Louis W. Agatstein ,  Michael Gutman

IPC分类号： G06F1/20 ,  G06F1/32 ,  G06F15/20

CPC分类号： G06F1/3215 ,  G06F1/206 ,  G06F1/324 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/15322 ,  H01L2924/16195 ,  Y02B60/1217 ,  Y02B60/1275

摘要： A circuit and method for reducing an internal clocking frequency of the semiconductor device upon receiving a first signal indicating that a fan element disposed on the semiconductor device is operating at an unacceptable performance level and/or a second signal indicating that the semiconductor device is operating at a temperature greater than a prescribed boundary temperature.

摘要翻译： 一种用于在接收到指示设置在半导体器件上的风扇元件处于不可接受的性能水平的第一信号和/或指示半导体器件正在操作的第二信号时减小半导体器件的内部时钟频率的电路和方法 温度大于规定的边界温度。

公开(公告)号：US5967161A

公开(公告)日：1999-10-19

申请号：US34292

申请日：1998-03-04

申请人： James R. Neal

发明人： James R. Neal

IPC分类号： A42B1/00 ,  A42B1/20 ,  A45B11/04 ,  A45B19/00 ,  A45B27/00

CPC分类号： A42B1/201 ,  A42B1/004 ,  A45B11/04 ,  A45B19/00 ,  A45B27/00 ,  A45B2023/0087

摘要： A foldable umbrella fan is constructed of a form-retaining pleated shield and a protective support binder. The pleated shield of the umbrella fan may be fanned open 360.degree. into a full circle for use as an umbrella. Alternatively, the pleated shield may be fanned partially open for use as a fan. The pleated shield also may be fully collapsed to store the closed umbrella fan in a briefcase, handbag, or pocket.

摘要翻译： 可折叠的伞形风扇由保持形式的打褶屏蔽和保护支撑结构构成。 伞形风扇的打褶屏可以360度旋转成一个圆圈，用作伞。 或者，打褶的屏蔽可以被部分地打开以用作风扇。 打褶的护罩也可能完全折叠，以将封闭的伞形风扇存储在公文包，手提包或口袋中。

公开(公告)号：US5621245A

公开(公告)日：1997-04-15

申请号：US741526

申请日：1996-10-31

申请人： Willy Agatstein ,  Mostafa Aghazadeh ,  Chia-pin Chiu ,  Amar Ghori ,  James R. Neal ,  Gregory Turturio

发明人： Willy Agatstein ,  Mostafa Aghazadeh ,  Chia-pin Chiu ,  Amar Ghori ,  James R. Neal ,  Gregory Turturio

IPC分类号： G06F1/26 ,  H01L23/498 ,  H01L23/50 ,  H01L25/16 ,  H01L23/34

CPC分类号： H01L25/16 ,  G06F1/26 ,  H01L23/49811 ,  H01L23/50 ,  H01L2924/0002

摘要： A very large scale integrated (VLSI) chip designed to operate at 3.3 volts is modified to be compatible with prior systems having a 5 volt voltage supply. A central processing unit (CPU) is fabricated at a center position on an integrated circuit chip that has an operating voltage of 3.3 volts. The chip is soldered into a pin grid array (PGA) package and a heat sink is attached on the PGA package above the CPU. A 5 volt-to-3.3 volt voltage regulator having a 5 volt input and a 3.3 volt output is placed at an edge of the PGA package. The 3.3 volt output of the voltage regulator is connected to the 3.3 volt operating voltage input of the chip. The VCC 5 V on board pins are connected to the 5 volt input of the voltage regulator and the 3.3 volt output of the voltage regulator is connected to the VCC pins of the chip. VSS ground on board pins are connected in common to both the ground terminal of the voltage regulator and the VSS pads of the chip. High performance capacitors are used to improve the transient response of the on-package voltage regulator. Dual voltage operation of the voltage regulated package is achieved by making the output of the voltage regulator available at the pins of the pin grid array (PGA) package.

摘要翻译： 设计用于3.3伏工作的非常大规模的集成（VLSI）芯片被修改为与具有5伏特电压的现有系统兼容。 中央处理单元（CPU）制造在集成电路芯片的中心位置，该集成电路芯片的工作电压为3.3伏。 该芯片被焊接到引脚格栅阵列（PGA）封装中，散热片连接在CPU上方的PGA封装上。 具有5伏特输入和3.3伏特输出的5伏至3.3伏电压调节器位于PGA封装的边缘。 电压调节器的3.3伏特输出端连接到芯片的3.3伏工作电压输入端。 VCC 5 V板载引脚连接到电压调节器的5 V输入，3.3 V稳压器输出端连接到芯片的VCC引脚。 VSS接地板上的引脚共同连接到电压调节器的接地端子和芯片的VSS焊盘。 高性能电容器用于改善封装内稳压器的瞬态响应。 电压调节封装的双电压工作是通过使引脚格栅阵列（PGA）封装引脚上的电压调节器的输出可用来实现的。

公开(公告)号：US5556811A

公开(公告)日：1996-09-17

申请号：US468972

申请日：1995-06-06

申请人： Willy Agatstein ,  Mostafa Aghazadeh ,  Chia-pin Chiu ,  Amar Ghori ,  James R. Neal ,  Gregory Turturio

发明人： Willy Agatstein ,  Mostafa Aghazadeh ,  Chia-pin Chiu ,  Amar Ghori ,  James R. Neal ,  Gregory Turturio

IPC分类号： G06F1/26 ,  H01L23/498 ,  H01L23/50 ,  H01L25/16 ,  H01L21/60

CPC分类号： H01L25/16 ,  G06F1/26 ,  H01L23/49811 ,  H01L23/50 ,  H01L2924/0002

摘要： A very large scale integrated (VLSI) chip designed to operate at 3.3 volts is modified to be compatible with prior systems having a 5 volt voltage supply. A central processing unit (CPU) is fabricated at a center position on an integrated circuit chip that has an operating voltage of 3.3 volts. The chip is soldered into a pin grid array (PGA) package and a heat sink is attached on the PGA package above the CPU. A 5 volt- to- 3.3 volt voltage regulator having a 5 volt input and a 3.3 volt output is placed at an edge of the PGA package. The 3.3 volt output of the voltage regulator is connected to the 3.3 volt operating voltage input of the chip. The VCC 5V on board pins are connected to the 5 volt input of the voltage regulator and the 3.3 volt output of the voltage regulator is connected to the VCC pins of the chip. VSS ground on board pins are connected in common to both the ground terminal of the voltage regulator and the VSS pads of the chip, High performance capacitors are used to improve the transient response of the on-package voltage regulator. Dual voltage operation of the voltage regulated package is achieved by making the output of the voltage regulator available at the pins of the pin grid array (PGA) package.

摘要翻译： 设计用于3.3伏工作的非常大规模的集成（VLSI）芯片被修改为与具有5伏特电压的现有系统兼容。 中央处理单元（CPU）制造在集成电路芯片的中心位置，该集成电路芯片的工作电压为3.3伏。 该芯片被焊接到引脚格栅阵列（PGA）封装中，散热片连接在CPU上方的PGA封装上。 具有5伏输入和3.3伏输出的5伏至3.3伏稳压器放置在PGA封装的边缘。 电压调节器的3.3伏特输出端连接到芯片的3.3伏工作电压输入端。 VCC 5V板载引脚连接到电压调节器的5伏特输入端，稳压器的3.3伏特输出端连接到芯片的VCC引脚。 VSS接地板上的引脚共同连接到电压调节器的接地端子和芯片的VSS焊盘，高性能电容器用于提高封装电压调节器的瞬态响应。 电压调节封装的双电压工作是通过使引脚格栅阵列（PGA）封装引脚上的电压调节器的输出可用来实现的。