Method for Manufacturing a Board Tray, a Blank for the Tray, and a Tray Obtained by the Method
    3.
    发明申请
    Method for Manufacturing a Board Tray, a Blank for the Tray, and a Tray Obtained by the Method 有权
    制造纸盘的方法,纸盘的空白和方法获得的纸盘

    公开(公告)号:US20090152333A1

    公开(公告)日:2009-06-18

    申请号:US11992888

    申请日:2006-09-28

    IPC分类号: B65D5/00 B31B1/00 B32B3/10

    摘要: The invention relates to a method for manufacturing a board tray (7), to a tray blank feasible for the method, and to a tray obtained by the method. The method comprises moulding a blank of plastic-coated board into the tray (7) comprising a bottom (3), side walls (4), as well as a rim flange (5), the blank being compressed in a direction transverse to the tray's side walls and rim flange. According to the invention, the blank is made thinner on its side opposite to the plastic coating such that, during the moulding process, the plastic coating double-folds at the compressed parts and stabilizes compressions (8) by becoming sealed to itself. Making the blank thinner is most conveniently effected by carving the board layer with a laser beam for having the fiber material predominantly or completely removed from where the cuts are located. As a result of the moulding process, the tray's rim flange (5) develops a smooth plastic surface which enables closing the tray hermetically with a heat-sealed cover.

    摘要翻译: 本发明涉及一种用于制造板托盘(7)的方法,可用于该方法的托盘空白件以及通过该方法获得的托盘的方法。 该方法包括将塑料涂覆板的坯件成型到包括底部(3),侧壁(4)以及边缘凸缘(5)的托盘(7)中,坯料沿横向于 托盘的侧壁和边缘法兰。 根据本发明,坯料在其与塑料涂层相对的一侧制成更薄,使得在成型过程中,塑料涂层在压缩部分处双重折叠并通过使其自身密封来稳定压缩(8)。 通过用激光束雕刻板层,使得坯料更薄的方法最为方便,使得纤维材料主要或完全从切割位置移除。 作为模制过程的结果,托盘的边缘凸缘(5)形成光滑的塑料表面,其能够用热密封的盖子气密地关闭托盘。

    Method For Machining A Material With High-Power Density Electromagnetic Radiation
    7.
    发明申请
    Method For Machining A Material With High-Power Density Electromagnetic Radiation 审中-公开
    高功率密度电磁辐射材料加工方法

    公开(公告)号:US20080047933A1

    公开(公告)日:2008-02-28

    申请号:US10592596

    申请日:2005-03-16

    IPC分类号: C03C15/00

    摘要: The invention relates to a method for machining a material with high-power density electromagnetic radiation. The radiation has its wavelength selected material-specifically, such that the radiation penetrates inside the material without substantial surface absorption. The radiation is focused on a spot inside the material and/or in the proximity of a penetration surface and this spot is moved along a desired machining path. The electromagnetic radiation can be provided by laser light and the focusing can be effected by means of optics. The method is particularly useful in cutting glass and the method offers benefits, including only slight heating of the machined workpiece, smoothness of the fracture plane and no vaporization of harmful alloying elements.

    摘要翻译: 本发明涉及一种用于加工具有高功率密度电磁辐射的材料的方法。 辐射具有选择的材料 - 具体地,使得辐射穿透材料内部而没有实质的表面吸收。 辐射聚焦在材料内部和/或在穿透表面附近的点上,并且该光斑沿所需的加工路径移动。 可以通过激光提供电磁辐射,并且可以通过光学器件实现聚焦。 该方法在切割玻璃方面特别有用,该方法提供的益处包括加工工件的轻微加热,断裂面的平滑度和有害合金元素的蒸发。