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    Apparatus and method for sensing temperature
    2.
    发明授权
    Apparatus and method for sensing temperature 有权
    用于感测温度的装置和方法

    公开(公告)号：US08987666B2

    公开(公告)日：2015-03-24

    申请号：US13616445

    申请日：2012-09-14

    申请人： Ho Soo Park ,  In Sang Song ,  Duck Hwan Kim ,  Chul Soo Kim ,  Sang Uk Son ,  Jea Shik Shin ,  Cui Jing

    发明人： Ho Soo Park ,  In Sang Song ,  Duck Hwan Kim ,  Chul Soo Kim ,  Sang Uk Son ,  Jea Shik Shin ,  Cui Jing

    IPC分类号： G01J5/44

    CPC分类号： G01J5/44

    摘要： A temperature sensing apparatus and method are described to detect a change in a frequency due to a change in a temperature. An infrared light sensing apparatus and method are also provided. The temperature sensing apparatus may include an electrode to generate an electrical signal, a piezoelectric layer to convert the electrical signal into an acoustic wave, and a temperature sensitive layer formed by doping impurities in one or more structures formed on a substrate. Additionally, the infrared light sensing apparatus may convert into heat infrared light incident to an infrared light absorption layer, using an infrared light reflection layer and the infrared light absorption layer. A temperature sensitive layer may detect a change in a resonant frequency based on a change in a temperature of the heat, and may detect a change in infrared light based on the change in the resonant frequency.

    摘要翻译： 描述了一种温度检测装置和方法，以检测由于温度变化引起的频率变化。 还提供了一种红外光感测装置和方法。 温度检测装置可以包括用于产生电信号的电极，将电信号转换成声波的压电层，以及通过在衬底上形成的一个或多个结构中掺杂杂质形成的温度敏感层。 此外，红外光检测装置可以使用红外光反射层和红外光吸收层转换入入红外光吸收层的热红外光。 温度敏感层可以基于热的温度的变化来检测谐振频率的变化，并且可以基于谐振频率的变化来检测红外光的变化。

    Balance filter packaging chip having balun mounted therein and manufacturing method thereof
    5.
    发明授权
    Balance filter packaging chip having balun mounted therein and manufacturing method thereof 有权
    具有平衡 - 不平衡转换器的平衡过滤器包装芯片及其制造方法

    公开(公告)号：US08624369B2

    公开(公告)日：2014-01-07

    申请号：US11844084

    申请日：2007-08-23

    申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    IPC分类号： H01L23/02

    CPC分类号： H03H9/0547

    摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

    摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

    BULK ACOUSTIC WAVE RESONATOR STRUCTURE, A MANUFACTURING METHOD THEREOF, AND A DUPLEXER USING THE SAME
    7.
    发明申请
    BULK ACOUSTIC WAVE RESONATOR STRUCTURE, A MANUFACTURING METHOD THEREOF, AND A DUPLEXER USING THE SAME 有权
    大容量声波谐振器结构及其制造方法，以及使用其的双工器

    公开(公告)号：US20120049976A1

    公开(公告)日：2012-03-01

    申请号：US13088905

    申请日：2011-04-18

    申请人： Sang Uk Son ,  In Sang Song ,  Young Il Kim ,  Duck Hwan Kim ,  Chul Soo Kim ,  Jea Shik Shin ,  Hyung Rak Kim ,  Jae Chun Lee

    发明人： Sang Uk Son ,  In Sang Song ,  Young Il Kim ,  Duck Hwan Kim ,  Chul Soo Kim ,  Jea Shik Shin ,  Hyung Rak Kim ,  Jae Chun Lee

    IPC分类号： H03H9/70 ,  H03H3/02 ,  H01L41/047

    CPC分类号： H03H9/02149 ,  H03H3/04 ,  H03H9/1014 ,  H03H9/131 ,  H03H9/564 ,  H03H9/706 ,  H03H2003/021

    摘要： A Bulk Acoustic Wave Resonator (BAWR), a method of manufacturing of the BAWR, and duplexer including the BAWR are provided. The BAWR may include a first substrate including a via hole formed in a predetermined area of a bottom surface of the first substrate. A first air cavity may be formed above the first substrate, and a first lamination resonating portion may be laminated above the first air cavity in sequence of a lower electrode, a piezoelectric layer, and an upper electrode. A second air cavity may be formed above the first substrate, and a second lamination resonating portion may be laminated above the second air cavity in sequence of the lower electrode, the piezoelectric layer, and the upper electrode. The first lamination resonating portion and the second lamination resonating portion may be connected via either the lower electrode or the upper electrode. A first electrode portion may include a third air cavity formed on a bottom surface of either the lower electrode or the upper electrode connecting between the first lamination resonating portion and the second lamination resonating portion.

    摘要翻译： 提供了一种体声波谐振器（BAWR），一种制造BAWR的方法，以及包括BAWR的双工器。 BAWR可以包括第一基板，其包括形成在第一基板的底表面的预定区域中的通孔。 可以在第一基板上形成第一空气腔，并且第一层叠谐振部分可以按照下电极，压电层和上电极的顺序层叠在第一空气腔的上方。 可以在第一基板的上方形成第二空气腔，并且第二层压谐振部分可以按照下电极，压电层和上电极的顺序层叠在第二空气腔的上方。 第一层叠谐振部分和第二层叠谐振部分可以通过下电极或上电极连接。 第一电极部分可以包括形成在第一层压谐振部分和第二层压谐振部分之间的下电极或上电极的底表面上的第三空腔。

    Array variable capacitor apparatus
    8.
    发明授权
    Array variable capacitor apparatus 有权
    阵列可变电容器

    公开(公告)号：US08040656B2

    公开(公告)日：2011-10-18

    申请号：US12253587

    申请日：2008-10-17

    申请人： Yun-Kwon Park ,  Jea-Shik Shin ,  Yong-Kweon Kim ,  Yong-Seung Bang

    发明人： Yun-Kwon Park ,  Jea-Shik Shin ,  Yong-Kweon Kim ,  Yong-Seung Bang

    IPC分类号： H01G5/00

    CPC分类号： H01G5/18 ,  H01G5/38

    摘要： An array variable capacitor apparatus includes a line unit including a ground line and a signal line which operates as a lower electrode; and a plurality of plates which are engaged with the line unit to generate capacitance and which operate as upper electrodes, the plurality of plates being arranged in an array pattern and having different degrees of stiffness.

    摘要翻译： 阵列可变电容器装置包括线路单元，其包括接地线和作为下电极工作的信号线; 以及与所述线路单元接合以产生电容并且作为上电极操作的多个板，所述多个板被布置成阵列图案并具有不同的刚度。