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1.发明授权公开(公告)号：US09735754B2
公开(公告)日：2017-08-15
申请号：US13558907
申请日：2012-07-26
申请人： Jea Shik Shin , In Sang Song , Young Il Kim , Duck Hwan Kim , Chul Soo Kim , Sang Uk Son , Hyung Rak Kim , Jae Chun Lee
发明人： Jea Shik Shin , In Sang Song , Young Il Kim , Duck Hwan Kim , Chul Soo Kim , Sang Uk Son , Hyung Rak Kim , Jae Chun Lee
摘要： A bulk acoustic wave resonator (BAWR) includes a bulk acoustic resonance unit and at least one compensation layer. The bulk acoustic resonance unit includes a first electrode, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode. The first electrode, the second electrode, and the piezoelectric layer each include a material that modifies a resonance frequency based on a temperature, and the at least one compensation layer includes a material that adjusts the resonance frequency modified based on the temperature in a direction opposite to a direction of the modification.
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2.发明申请BULK ACOUSTIC WAVE RESONATOR STRUCTURE, A MANUFACTURING METHOD THEREOF, AND A DUPLEXER USING THE SAME 有权大容量声波谐振器结构及其制造方法，以及使用其的双工器公开(公告)号：US20120049976A1
公开(公告)日：2012-03-01
申请号：US13088905
申请日：2011-04-18
申请人： Sang Uk Son , In Sang Song , Young Il Kim , Duck Hwan Kim , Chul Soo Kim , Jea Shik Shin , Hyung Rak Kim , Jae Chun Lee
发明人： Sang Uk Son , In Sang Song , Young Il Kim , Duck Hwan Kim , Chul Soo Kim , Jea Shik Shin , Hyung Rak Kim , Jae Chun Lee
IPC分类号： H03H9/70 , H03H3/02 , H01L41/047
CPC分类号： H03H9/02149 , H03H3/04 , H03H9/1014 , H03H9/131 , H03H9/564 , H03H9/706 , H03H2003/021
摘要： A Bulk Acoustic Wave Resonator (BAWR), a method of manufacturing of the BAWR, and duplexer including the BAWR are provided. The BAWR may include a first substrate including a via hole formed in a predetermined area of a bottom surface of the first substrate. A first air cavity may be formed above the first substrate, and a first lamination resonating portion may be laminated above the first air cavity in sequence of a lower electrode, a piezoelectric layer, and an upper electrode. A second air cavity may be formed above the first substrate, and a second lamination resonating portion may be laminated above the second air cavity in sequence of the lower electrode, the piezoelectric layer, and the upper electrode. The first lamination resonating portion and the second lamination resonating portion may be connected via either the lower electrode or the upper electrode. A first electrode portion may include a third air cavity formed on a bottom surface of either the lower electrode or the upper electrode connecting between the first lamination resonating portion and the second lamination resonating portion.
摘要翻译： 提供了一种体声波谐振器（BAWR），一种制造BAWR的方法，以及包括BAWR的双工器。 BAWR可以包括第一基板，其包括形成在第一基板的底表面的预定区域中的通孔。 可以在第一基板上形成第一空气腔，并且第一层叠谐振部分可以按照下电极，压电层和上电极的顺序层叠在第一空气腔的上方。 可以在第一基板的上方形成第二空气腔，并且第二层压谐振部分可以按照下电极，压电层和上电极的顺序层叠在第二空气腔的上方。 第一层叠谐振部分和第二层叠谐振部分可以通过下电极或上电极连接。 第一电极部分可以包括形成在第一层压谐振部分和第二层压谐振部分之间的下电极或上电极的底表面上的第三空腔。
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3.发明申请BULK ACOUSTIC WAVE RESONATOR AND DUPLEXER USING BULK ACOUSTIC WAVE RESONATOR 有权使用大容量声波谐振器的大容量声波谐波器和双工器公开(公告)号：US20130027153A1
公开(公告)日：2013-01-31
申请号：US13558907
申请日：2012-07-26
申请人： Jea Shik Shin , In Sang Song , Young Il Kim , Duck Hwan Kim , Chul Soo Kim , Sang Uk Son , Hyung Rak Kim , Jae Chun Lee
发明人： Jea Shik Shin , In Sang Song , Young Il Kim , Duck Hwan Kim , Chul Soo Kim , Sang Uk Son , Hyung Rak Kim , Jae Chun Lee
IPC分类号： H01L41/083 , H03H9/54 , H03H9/70
摘要： A bulk acoustic wave resonator (BAWR) includes a bulk acoustic resonance unit and at least one compensation layer. The bulk acoustic resonance unit includes a first electrode, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode. The first electrode, the second electrode, and the piezoelectric layer each include a material that modifies a resonance frequency based on a temperature, and the at least one compensation layer includes a material that adjusts the resonance frequency modified based on the temperature in a direction opposite to a direction of the modification.
摘要翻译： 体声波谐振器（BAWR）包括体声共振单元和至少一个补偿层。 体声共振单元包括第一电极，第二电极和设置在第一电极和第二电极之间的压电层。 第一电极，第二电极和压电层各自包括基于温度改变谐振频率的材料，并且至少一个补偿层包括调节基于相反方向上的温度改变的谐振频率的材料 到修改的方向。
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4.发明授权Bulk acoustic wave resonator structure, a manufacturing method thereof, and a duplexer using the same 有权体声波谐振器结构，其制造方法以及使用其的双工器公开(公告)号：US08648671B2
公开(公告)日：2014-02-11
申请号：US13088905
申请日：2011-04-18
申请人： Sang Uk Son , In Sang Song , Young Il Kim , Duck Hwan Kim , Chul Soo Kim , Jea Shik Shin , Hyung Rak Kim , Jae Chun Lee
发明人： Sang Uk Son , In Sang Song , Young Il Kim , Duck Hwan Kim , Chul Soo Kim , Jea Shik Shin , Hyung Rak Kim , Jae Chun Lee
CPC分类号： H03H9/02149 , H03H3/04 , H03H9/1014 , H03H9/131 , H03H9/564 , H03H9/706 , H03H2003/021
摘要： A Bulk Acoustic Wave Resonator (BAWR), a method of manufacturing of the BAWR, and duplexer including the BAWR are provided. The BAWR may include a first substrate including a via hole formed in a predetermined area of a bottom surface of the first substrate. A first air cavity may be formed above the first substrate, and a first lamination resonating portion may be laminated above the first air cavity in sequence of a lower electrode, a piezoelectric layer, and an upper electrode. A second air cavity may be formed above the first substrate, and a second lamination resonating portion may be laminated above the second air cavity in sequence of the lower electrode, the piezoelectric layer, and the upper electrode. The first lamination resonating portion and the second lamination resonating portion may be connected via either the lower electrode or the upper electrode. A first electrode portion may include a third air cavity formed on a bottom surface of either the lower electrode or the upper electrode connecting between the first lamination resonating portion and the second lamination resonating portion.
摘要翻译： 提供了一种体声波谐振器（BAWR），一种制造BAWR的方法，以及包括BAWR的双工器。 BAWR可以包括第一基板，其包括形成在第一基板的底表面的预定区域中的通孔。 可以在第一基板上形成第一空气腔，并且第一层叠谐振部分可以按照下电极，压电层和上电极的顺序层叠在第一空气腔的上方。 可以在第一基板的上方形成第二空气腔，并且第二层压谐振部分可以按照下电极，压电层和上电极的顺序层叠在第二空气腔的上方。 第一层叠谐振部分和第二层叠谐振部分可以通过下电极或上电极连接。 第一电极部分可以包括形成在第一层压谐振部分和第二层压谐振部分之间的下电极或上电极的底表面上的第三空腔。
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公开(公告)号：US08896396B2
公开(公告)日：2014-11-25
申请号：US13307159
申请日：2011-11-30
申请人： Chul Soo Kim , Jun Chul Kim , In Sang Song , Young Il Kim , Duck Hwan Kim , Sang Uk Son , Jea Shik Shin , Hyung Rak Kim
发明人： Chul Soo Kim , Jun Chul Kim , In Sang Song , Young Il Kim , Duck Hwan Kim , Sang Uk Son , Jea Shik Shin , Hyung Rak Kim
摘要： Provided are low pass filters using a bulk acoustic wave resonator (BAWR). A low pass filter may include an input terminal configured to be connected with a first radio frequency (RF) device, an output terminal configured to be connected with a second RF device, a parallel segment including a first BAWR, a third BAWR, and a fifth BAWR that may be connected in parallel with each other to a reference potential, a first series segment having a second BAWR and a first inductor, and a second series segment having a fourth BAWR and a second inductor, and connected in series with the first series segment.
摘要翻译： 提供了使用体声波谐振器（BAWR）的低通滤波器。 低通滤波器可以包括被配置为与第一射频（RF）装置连接的输入端子，被配置为与第二RF装置连接的输出端子，包括第一BAWR，第三BAWR和 可以彼此并联连接到参考电位的第五BAWR，具有第二BAWR和第一电感器的第一串联段，以及具有第四BAWR和第二电感器的第二串联段，并且与第一BAWR串联连接 系列片段。
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6.发明申请RF LAYERED MODULE USING THREE DIMENSIONAL VERTICAL WIRING AND DISPOSING METHOD THEREOF 有权使用三维垂直接线的射频分层模块及其处理方法公开(公告)号：US20120063106A1
公开(公告)日：2012-03-15
申请号：US13217371
申请日：2011-08-25
申请人： Young Il KIM , In Sang Song , Duck Hwan Kim , Chul Soo Kim , Yun Kwon Park , Jea Shik Shin , Hyung Rak Kim , Jae Chun Lee
发明人： Young Il KIM , In Sang Song , Duck Hwan Kim , Chul Soo Kim , Yun Kwon Park , Jea Shik Shin , Hyung Rak Kim , Jae Chun Lee
CPC分类号： H01L23/66 , H01L23/13 , H01L23/5385 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2223/6616 , H01L2224/16225 , H01L2224/48227 , H01L2225/0652 , H01L2225/06548 , H01L2225/06572 , H01L2924/01322 , H01L2924/15311 , H01L2924/3011 , Y10T29/49165 , H01L2924/00
摘要： Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via- hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.
摘要翻译： 提供了一种使用三维（3D）垂直布线的射频（RF）分层模块的结构和布置方法。 具有3D垂直布线的RF分层模块中的第一晶片可以包括第一RF器件和至少一个第一通孔。 第二晶片可以包括第二RF器件和设置在对应于至少一个第一通孔的位置处的至少一个第二通孔。 垂直布线可以连接至少一个第一通孔和至少一个第二通孔。 垂直布线可以被配置为通过至少一个第一通孔的底表面或至少一个第二通孔的顶表面连接到外部装置。
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7.发明授权RF layered module using three dimensional vertical wiring and disposing method thereof 有权RF分层模块采用三维垂直布线及其布置方法公开(公告)号：US08824163B2
公开(公告)日：2014-09-02
申请号：US13217371
申请日：2011-08-25
申请人： Young Il Kim , In Sang Song , Duck Hwan Kim , Chul Soo Kim , Yun Kwon Park , Jea Shik Shin , Hyung Rak Kim , Jae Chun Lee
发明人： Young Il Kim , In Sang Song , Duck Hwan Kim , Chul Soo Kim , Yun Kwon Park , Jea Shik Shin , Hyung Rak Kim , Jae Chun Lee
IPC分类号： H05K1/18 , H01L25/065 , H01L25/16 , H01L23/66 , H01L23/13 , H01L23/538
CPC分类号： H01L23/66 , H01L23/13 , H01L23/5385 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2223/6616 , H01L2224/16225 , H01L2224/48227 , H01L2225/0652 , H01L2225/06548 , H01L2225/06572 , H01L2924/01322 , H01L2924/15311 , H01L2924/3011 , Y10T29/49165 , H01L2924/00
摘要： Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via-hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.
摘要翻译： 提供了一种使用三维（3D）垂直布线的射频（RF）分层模块的结构和布置方法。 具有3D垂直布线的RF分层模块中的第一晶片可以包括第一RF器件和至少一个第一通孔。 第二晶片可以包括第二RF器件和设置在对应于至少一个第一通孔的位置处的至少一个第二通孔。 垂直布线可以连接至少一个第一通孔和至少一个第二通孔。 垂直布线可以被配置为通过至少一个第一通孔的底表面或至少一个第二通孔的顶表面连接到外部装置。
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公开(公告)号：US09768753B2
公开(公告)日：2017-09-19
申请号：US14382115
申请日：2012-06-12
申请人： Jae Chun Lee , Duck Hwan Kim , Chul Soo Kim , Ho Soo Park , Sang Uk Son , In Sang Song , Jea Shik Shin , Moon Chul Lee , Jing Cui
发明人： Jae Chun Lee , Duck Hwan Kim , Chul Soo Kim , Ho Soo Park , Sang Uk Son , In Sang Song , Jea Shik Shin , Moon Chul Lee , Jing Cui
摘要： A filter using bulk acoustic wave resonators (BAWRs) is provided including BAWRs connected in series or in parallel to each other. A BAWR set is configured by connecting an inductance and capacitance (L/C) element to each BAWR in series or in parallel.
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9.发明授权Radio frequency filter and radio frequency duplexer including bulk acoustic wave resonators in a ladder and a bridge 有权射频滤波器和射频双工器，包括梯形和桥梁中的体声波谐振器公开(公告)号：US08902021B2
公开(公告)日：2014-12-02
申请号：US13108822
申请日：2011-05-16
申请人： Jea Shik Shin , Soo Chul Kim , In Sang Song , Young Il Kim , Duck Hwan Kim , Hyung Rak Kim , Jae Chun Lee
发明人： Jea Shik Shin , Soo Chul Kim , In Sang Song , Young Il Kim , Duck Hwan Kim , Hyung Rak Kim , Jae Chun Lee
摘要： A Radio Frequency (RF) duplexer including Bulk Acoustic Wave Resonators (BAWRs) and an RF filter including BAWRs are provided. The RF duplexer may convert the received signal into a balance signal and output the balance signal via a dual-output port. The RF duplexer may also include a BAWR receiving filter unit including an input end to receive the balance signal from the dual-output port, and an output end used for dual output. The RF duplexer may also include a BAWR transmitting filter unit to transmit a transmitted signal to the antenna via a single-output port.
摘要翻译： 提供了包括体声波谐振器（BAWR）的射频（RF）双工器和包括BAWR的RF滤波器。 RF双工器可以将接收的信号转换成平衡信号，并通过双输出端口输出平衡信号。 RF双工器还可以包括BAWR接收滤波器单元，其包括用于从双输出端口接收平衡信号的输入端和用于双输出的输出端。 RF双工器还可以包括经由单输出端口将发射信号发送到天线的BAWR发射滤波器单元。
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公开(公告)号：US20150155852A1
公开(公告)日：2015-06-04
申请号：US14382115
申请日：2012-06-12
申请人： Jae Chun Lee , Duck Hwan Kim , Chul Soo Kim , Ho Soo Park , Sang Uk Son , In Sang Song , Jea Shik Shin , Moon Chul Lee , Jing Cui
发明人： Jae Chun Lee , Duck Hwan Kim , Chul Soo Kim , Ho Soo Park , Sang Uk Son , In Sang Song , Jea Shik Shin , Moon Chul Lee , Jing Cui
摘要： Provided is a filter using bulk acoustic wave resonators (BAWRs), the filter comprising two or more BAWRs connected in series or in parallel to each other, one or more LC elements being connected in series or in parallel to the respective BAWRs, thus constituting a BAWR set.
摘要翻译： 提供了使用体声波谐振器（BAWR）的滤波器，该滤波器包括彼此串联或并联连接的两个或更多个BAWR，一个或多个LC元件串联或并联连接到相应的BAWR，从而构成 BAWR集。
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