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1.发明申请POLYIMIDE COPOLYMERS AND METHOD FOR FABRICATING PATTERNED METAL OXIDE LAYERS 有权聚酰亚胺共聚物和制备图案化金属氧化物层的方法公开(公告)号：US20130029049A1
公开(公告)日：2013-01-31
申请号：US13336606
申请日：2011-12-23
申请人： Jhy-Long JENG , Jeng-Yu TSAI , Shur-Fen LIU , Chin-Ching LIN , Yu-Chun CHEN , Wen-Ching SUN , Jinn-Shing KING
发明人： Jhy-Long JENG , Jeng-Yu TSAI , Shur-Fen LIU , Chin-Ching LIN , Yu-Chun CHEN , Wen-Ching SUN , Jinn-Shing KING
CPC分类号： C08G73/10 , C03C17/253 , C03C2218/34 , C08G73/101 , C08G73/1017 , C08G73/1039 , C08G73/1046 , C08G73/1064 , C08G73/1075 , C08G73/1078 , C08L79/08
摘要： A polyimide copolymer represented by formula (I) or formula (II) is provided. In formula (I) or formula (II), B is a cycloaliphatic group or aromatic group, A is an aromatic group, R is hydrogen or phenyl, and m and n are 20-50. The invention also provides a method for fabricating a patterned metal oxide layer.
摘要翻译： 提供由式（I）或式（II）表示的聚酰亚胺共聚物。 在式（I）或式（II）中，B是脂环族基团或芳基，A是芳基，R是氢或苯基，m和n是20-50。 本发明还提供了一种用于制造图案化金属氧化物层的方法。
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公开(公告)号：US20110306703A1
公开(公告)日：2011-12-15
申请号：US13216653
申请日：2011-08-24
申请人： Jhy-Long JENG , Jeng-Yu TSAI , Shur-Fen LIU , Jinn-Shing KING
发明人： Jhy-Long JENG , Jeng-Yu TSAI , Shur-Fen LIU , Jinn-Shing KING
IPC分类号： C08L63/10
CPC分类号： C08G59/066 , C08G59/22 , H05K1/0393 , H05K3/285 , H05K2201/0145
摘要： A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.
摘要翻译： 提供了一种用于柔性印刷电路板的热固化阻焊组合物。 阻焊剂组合物包含（a）50-100重量份的环氧树脂，其中环氧树脂至少包含具有式（I）或（II）的脂族聚酯改性环氧树脂，其中R1和R2各自 独立地是C6-38饱和或不饱和碳链，R3是醚，苯基，C6-38杂环或C6-38饱和碳链，n是1-10的整数，脂肪族聚酯改性环氧树脂具有 分子量1000-5000; （b）1-10重量份的固化剂; 和（c）1-10重量份的催化剂。
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公开(公告)号：US20070141509A1
公开(公告)日：2007-06-21
申请号：US11365489
申请日：2006-03-02
申请人： Jyh-Long Jeng , Jeng-Yu Tsai , Charng-Shing Lu , Jinn-Shing King
发明人： Jyh-Long Jeng , Jeng-Yu Tsai , Charng-Shing Lu , Jinn-Shing King
IPC分类号： G03C1/00
CPC分类号： G03F7/037 , G03F7/027 , H05K3/287 , Y10S430/117 , Y10S430/121 , Y10S430/148
摘要： The present invention is directed to a negative photoresist composition which mainly is composed of a) a polyimide having pendant carboxyl groups, wherein a portion of the carboxyl groups reacted with glycidyl (meth)acrylate monomers to form covalent bonds. The photoresist composition further contains b) monomers having a tertiary amino group and a C═C double bond, which form ionic bonds with the remaining hydroxyl groups of the polyimide. The photoresist composition further contains c) a photoinitiator which is also called photosensitizer. The components a) to c) are all dissolved in a solvent.
摘要翻译： 本发明涉及负光致抗蚀剂组合物，其主要由a）具有羧基侧基的聚酰亚胺组成，其中一部分羧基与（甲基）丙烯酸缩水甘油酯单体反应形成共价键。 光致抗蚀剂组合物还含有b）具有叔氨基和C-C双键的单体，其与聚酰亚胺的剩余羟基形成离子键。 光致抗蚀剂组合物还包含c）光引发剂，其也称为光敏剂。 组分a）至c）都溶解在溶剂中。
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公开(公告)号：US20100167205A1
公开(公告)日：2010-07-01
申请号：US12437217
申请日：2009-05-07
申请人： Jhy-Long JENG , Jeng-Yu TSAI , Shur-Fen LIU , Jinn-Shing KING
发明人： Jhy-Long JENG , Jeng-Yu TSAI , Shur-Fen LIU , Jinn-Shing KING
IPC分类号： G03F7/004
CPC分类号： H05K3/285 , C08G59/066 , H05K1/0393 , H05K2201/0145
摘要： A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.
摘要翻译： 提供了一种用于柔性印刷电路板的热固化阻焊组合物。 阻焊剂组合物包含（a）50-100重量份的环氧树脂，其中环氧树脂至少包含具有式（I）或（II）的脂族聚酯改性环氧树脂，其中R1和R2各自 独立地是C6-38饱和或不饱和碳链，R3是醚，苯基，C6-38杂环或C6-38饱和碳链，n是1-10的整数，脂肪族聚酯改性环氧树脂具有 分子量1000-5000; （b）1-10重量份的固化剂; 和（c）1-10重量份的催化剂。
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公开(公告)号：US07374861B2
公开(公告)日：2008-05-20
申请号：US11365489
申请日：2006-03-02
申请人： Jyh-Long Jeng , Jeng-Yu Tsai , Charng-Shing Lu , Jinn-Shing King
发明人： Jyh-Long Jeng , Jeng-Yu Tsai , Charng-Shing Lu , Jinn-Shing King
CPC分类号： G03F7/037 , G03F7/027 , H05K3/287 , Y10S430/117 , Y10S430/121 , Y10S430/148
摘要： The present invention is directed to a negative photoresist composition which mainly is composed of a) a polyimide having pendant carboxyl groups, wherein a portion of the carboxyl groups reacted with glycidyl (meth)acrylate monomers to form covalent bonds. The photoresist composition further contains b) monomers having a tertiary amino group and a C═C double bond, which form ionic bonds with the remaining hydroxyl groups of the polyimide. The photoresist composition further contains c) a photoinitiator which is also called photosensitizer. The components a) to c) are all dissolved in a solvent.
摘要翻译： 本发明涉及负光致抗蚀剂组合物，其主要由a）具有羧基侧基的聚酰亚胺组成，其中一部分羧基与（甲基）丙烯酸缩水甘油酯单体反应形成共价键。 光致抗蚀剂组合物还含有b）具有叔氨基和C-C双键的单体，其与聚酰亚胺的剩余羟基形成离子键。 光致抗蚀剂组合物还包含c）光引发剂，其也称为光敏剂。 组分a）至c）都溶解在溶剂中。
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6.发明授权Polyimide copolymers and method for fabricating patterned metal oxide layers 有权聚酰亚胺共聚物和制造图案化金属氧化物层的方法公开(公告)号：US09169357B2
公开(公告)日：2015-10-27
申请号：US13336606
申请日：2011-12-23
申请人： Jhy-Long Jeng , Jeng-Yu Tsai , Shur-Fen Liu , Chin-Ching Lin , Yu-Chun Chen , Wen-Ching Sun , Jinn-Shing King
发明人： Jhy-Long Jeng , Jeng-Yu Tsai , Shur-Fen Liu , Chin-Ching Lin , Yu-Chun Chen , Wen-Ching Sun , Jinn-Shing King
CPC分类号： C08G73/10 , C03C17/253 , C03C2218/34 , C08G73/101 , C08G73/1017 , C08G73/1039 , C08G73/1046 , C08G73/1064 , C08G73/1075 , C08G73/1078 , C08L79/08
摘要： A polyimide copolymer represented by formula (I) or formula (II) is provided. In formula (I) or formula (II), B is a cycloaliphatic group or aromatic group, A is an aromatic group, R is hydrogen or phenyl, and m and n are 20-50. The invention also provides a method for fabricating a patterned metal oxide layer.
摘要翻译： 提供由式（I）或式（II）表示的聚酰亚胺共聚物。 在式（I）或式（II）中，B是脂环族基团或芳基，A是芳基，R是氢或苯基，m和n是20-50。 本发明还提供了一种用于制造图案化金属氧化物层的方法。
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公开(公告)号：US08420745B2
公开(公告)日：2013-04-16
申请号：US13216653
申请日：2011-08-24
申请人： Jhy-Long Jeng , Jeng-Yu Tsai , Shur-Fen Liu , Jinn-Shing King
发明人： Jhy-Long Jeng , Jeng-Yu Tsai , Shur-Fen Liu , Jinn-Shing King
CPC分类号： C08G59/066 , C08G59/22 , H05K1/0393 , H05K3/285 , H05K2201/0145
摘要： A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.
摘要翻译： 提供了一种用于柔性印刷电路板的热固化阻焊组合物。 阻焊剂组合物包含（a）50-100重量份的环氧树脂，其中环氧树脂至少包含具有式（I）或（II）的脂族聚酯改性环氧树脂，其中R1和R2各自 独立地是C6-38饱和或不饱和碳链，R3是醚，苯基，C6-38杂环或C6-38饱和碳链，n是1-10的整数，脂肪族聚酯改性环氧树脂具有 分子量1000-5000; （b）1-10重量份的固化剂; 和（c）1-10重量份的催化剂。
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