公开(公告)号：US08748940B1

公开(公告)日：2014-06-10

申请号：US13717282

申请日：2012-12-17

申请人： Willy Rachmady ,  Van H. Le ,  Ravi Pillarisetty ,  Jessica S. Kachian ,  Marc C. French ,  Aaron A. Budrevich

发明人： Willy Rachmady ,  Van H. Le ,  Ravi Pillarisetty ,  Jessica S. Kachian ,  Marc C. French ,  Aaron A. Budrevich

IPC分类号： H01L31/0328 ,  H01L31/0336 ,  H01L31/072 ,  H01L31/109 ,  H01L21/20 ,  H01L21/36 ,  H01L29/66 ,  H01L29/06 ,  C23F1/30

CPC分类号： H01L29/0673 ,  B82Y10/00 ,  B82Y40/00 ,  H01L21/02381 ,  H01L21/0245 ,  H01L21/02532 ,  H01L21/02584 ,  H01L21/30604 ,  H01L21/30608 ,  H01L21/3065 ,  H01L29/1054 ,  H01L29/161 ,  H01L29/165 ,  H01L29/167 ,  H01L29/365 ,  H01L29/42392 ,  H01L29/511 ,  H01L29/66439 ,  H01L29/66477 ,  H01L29/66628 ,  H01L29/66742 ,  H01L29/775 ,  H01L29/7781 ,  H01L29/78 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/786 ,  H01L29/78696 ,  Y02E10/50

摘要： Semiconductor device stacks and devices made there from having Ge-rich device layers. A Ge-rich device layer is disposed above a substrate, with a p-type doped Ge etch suppression layer (e.g., p-type SiGe) disposed there between to suppress etch of the Ge-rich device layer during removal of a sacrificial semiconductor layer richer in Si than the device layer. Rates of dissolution of Ge in wet etchants, such as aqueous hydroxide chemistries, may be dramatically decreased with the introduction of a buried p-type doped semiconductor layer into a semiconductor film stack, improving selectivity of etchant to the Ge-rich device layers.

摘要翻译： 在那里制造的半导体器件堆叠和器件具有富锗器件层。 富锗器件层设置在衬底之上，其中设置有p型掺杂Ge蚀刻抑制层（例如，p型SiGe），以在去除牺牲半导体层期间抑制富锗器件层的蚀刻 Si比设备层更丰富。 随着在半导体膜堆叠中引入掩埋的p型掺杂半导体层，可以显着降低Ge在湿蚀刻剂（例如氢氧化物水溶液）中的溶解速率，从而提高蚀刻剂对Ge富集器件层的选择性。

公开(公告)号：US09159787B2

公开(公告)日：2015-10-13

申请号：US14301281

申请日：2014-06-10

申请人： Willy Rachmady ,  Van H. Le ,  Ravi Pillarisetty ,  Jessica S. Kachian ,  Marc C. French ,  Aaron A. Budrevich

发明人： Willy Rachmady ,  Van H. Le ,  Ravi Pillarisetty ,  Jessica S. Kachian ,  Marc C. French ,  Aaron A. Budrevich

IPC分类号： H01L29/06 ,  H01L29/78 ,  H01L29/66 ,  H01L21/306 ,  H01L29/786

CPC分类号： H01L29/0673 ,  B82Y10/00 ,  B82Y40/00 ,  H01L21/02381 ,  H01L21/0245 ,  H01L21/02532 ,  H01L21/02584 ,  H01L21/30604 ,  H01L21/30608 ,  H01L21/3065 ,  H01L29/1054 ,  H01L29/161 ,  H01L29/165 ,  H01L29/167 ,  H01L29/365 ,  H01L29/42392 ,  H01L29/511 ,  H01L29/66439 ,  H01L29/66477 ,  H01L29/66628 ,  H01L29/66742 ,  H01L29/775 ,  H01L29/7781 ,  H01L29/78 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/786 ,  H01L29/78696 ,  Y02E10/50

摘要： Semiconductor device stacks and devices made there from having Ge-rich device layers. A Ge-rich device layer is disposed above a substrate, with a p-type doped Ge etch suppression layer (e.g., p-type SiGe) disposed there between to suppress etch of the Ge-rich device layer during removal of a sacrificial semiconductor layer richer in Si than the device layer. Rates of dissolution of Ge in wet etchants, such as aqueous hydroxide chemistries, may be dramatically decreased with the introduction of a buried p-type doped semiconductor layer into a semiconductor film stack, improving selectivity of etchant to the Ge-rich device layers.

摘要翻译： 在那里制造的半导体器件堆叠和器件具有富锗器件层。 富锗器件层设置在衬底之上，其中设置有p型掺杂Ge蚀刻抑制层（例如，p型SiGe），以在去除牺牲半导体层期间抑制富锗器件层的蚀刻 Si比设备层更丰富。 随着在半导体膜堆叠中引入掩埋的p型掺杂半导体层，可以显着降低Ge在湿蚀刻剂（例如氢氧化物水溶液）中的溶解速率，从而提高蚀刻剂对Ge富集器件层的选择性。

公开(公告)号：US20160233344A1

公开(公告)日：2016-08-11

申请号：US15134093

申请日：2016-04-20

申请人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/786 ,  H01L29/423 ,  H01L29/66 ,  H01L29/06

CPC分类号： H01L29/78609 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/165 ,  H01L29/205 ,  H01L29/42392 ,  H01L29/66742 ,  H01L29/785 ,  H01L29/78606 ,  H01L29/78618 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696

摘要： Deep gate-all-around semiconductor devices having germanium or group III-V active layers are described. For example, a non-planar semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a hetero-junction between an upper layer and a lower layer of differing composition. An active layer is disposed above the hetero-structure and has a composition different from the upper and lower layers of the hetero-structure. A gate electrode stack is disposed on and completely surrounds a channel region of the active layer, and is disposed in a trench in the upper layer and at least partially in the lower layer of the hetero-structure. Source and drain regions are disposed in the active layer and in the upper layer, but not in the lower layer, on either side of the gate electrode stack.

公开(公告)号：US20150349077A1

公开(公告)日：2015-12-03

申请号：US14821561

申请日：2015-08-07

申请人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/423 ,  H01L29/205 ,  H01L29/786 ,  H01L29/165 ,  H01L29/06

CPC分类号： H01L29/78609 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/165 ,  H01L29/205 ,  H01L29/42392 ,  H01L29/66742 ,  H01L29/785 ,  H01L29/78606 ,  H01L29/78618 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696

摘要： Deep gate-all-around semiconductor devices having germanium or group III-V active layers are described. For example, a non-planar semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a hetero-junction between an upper layer and a lower layer of differing composition. An active layer is disposed above the hetero-structure and has a composition different from the upper and lower layers of the hetero-structure. A gate electrode stack is disposed on and completely surrounds a channel region of the active layer, and is disposed in a trench in the upper layer and at least partially in the lower layer of the hetero-structure. Source and drain regions are disposed in the active layer and in the upper layer, but not in the lower layer, on either side of the gate electrode stack.

摘要翻译： 描述具有锗或III-V族有源层的深栅极全面半导体器件。 例如，非平面半导体器件包括设置在衬底上的异质结构。 异质结构包括不同组成的上层和下层之间的异质结。 有源层设置在杂结构上方，并且具有与异质结构的上层和下层不同的组成。 栅电极堆叠设置在有源层的沟道区上并完全包围有源层的沟道区，并且设置在上层中的沟槽中，并且至少部分地设置在异质结构的下层中。 源极和漏极区域设置在栅电极堆叠的任一侧上的有源层和上层中，而不是在下层中。

公开(公告)号：US20140167108A1

公开(公告)日：2014-06-19

申请号：US13717282

申请日：2012-12-17

申请人： Willy RACHMADY ,  Van H. LE ,  Ravi PILLARISETTY ,  Jessica S. KACHIAN ,  Marc C. FRENCH ,  Aaron A. BUDREVICH

发明人： Willy RACHMADY ,  Van H. LE ,  Ravi PILLARISETTY ,  Jessica S. KACHIAN ,  Marc C. FRENCH ,  Aaron A. BUDREVICH

IPC分类号： H01L29/78 ,  H01L29/66

CPC分类号： H01L29/0673 ,  B82Y10/00 ,  B82Y40/00 ,  H01L21/02381 ,  H01L21/0245 ,  H01L21/02532 ,  H01L21/02584 ,  H01L21/30604 ,  H01L21/30608 ,  H01L21/3065 ,  H01L29/1054 ,  H01L29/161 ,  H01L29/165 ,  H01L29/167 ,  H01L29/365 ,  H01L29/42392 ,  H01L29/511 ,  H01L29/66439 ,  H01L29/66477 ,  H01L29/66628 ,  H01L29/66742 ,  H01L29/775 ,  H01L29/7781 ,  H01L29/78 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/786 ,  H01L29/78696 ,  Y02E10/50

摘要： Semiconductor device stacks and devices made there from having Ge-rich device layers. A Ge-rich device layer is disposed above a substrate, with a p-type doped Ge etch suppression layer (e.g., p-type SiGe) disposed there between to suppress etch of the Ge-rich device layer during removal of a sacrificial semiconductor layer richer in Si than the device layer. Rates of dissolution of Ge in wet etchants, such as aqueous hydroxide chemistries, may be dramatically decreased with the introduction of a buried p-type doped semiconductor layer into a semiconductor film stack, improving selectivity of etchant to the Ge-rich device layers.

摘要翻译： 在那里制造的半导体器件堆叠和器件具有富锗器件层。 富锗器件层设置在衬底之上，其中设置有p型掺杂Ge蚀刻抑制层（例如，p型SiGe），以在去除牺牲半导体层期间抑制富锗器件层的蚀刻 Si比设备层更丰富。 随着在半导体膜堆叠中引入掩埋的p型掺杂半导体层，可以显着降低Ge在湿蚀刻剂（例如氢氧化物水溶液）中的溶解速率，从而提高蚀刻剂对Ge富集器件层的选择性。

公开(公告)号：US09337291B2

公开(公告)日：2016-05-10

申请号：US14821561

申请日：2015-08-07

申请人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/66 ,  H01L29/423 ,  H01L29/165 ,  H01L29/06 ,  H01L29/205 ,  H01L29/78 ,  H01L29/786

CPC分类号： H01L29/78609 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/165 ,  H01L29/205 ,  H01L29/42392 ,  H01L29/66742 ,  H01L29/785 ,  H01L29/78606 ,  H01L29/78618 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696

摘要： Deep gate-all-around semiconductor devices having germanium or group III-V active layers are described. For example, a non-planar semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a hetero-junction between an upper layer and a lower layer of differing composition. An active layer is disposed above the hetero-structure and has a composition different from the upper and lower layers of the hetero-structure. A gate electrode stack is disposed on and completely surrounds a channel region of the active layer, and is disposed in a trench in the upper layer and at least partially in the lower layer of the hetero-structure. Source and drain regions are disposed in the active layer and in the upper layer, but not in the lower layer, on either side of the gate electrode stack.

公开(公告)号：US20140291772A1

公开(公告)日：2014-10-02

申请号：US14301281

申请日：2014-06-10

申请人： Willy RACHMADY ,  Van H. Le ,  Ravi Pillarisetty ,  Jessica S. Kachian ,  Marc C. French ,  Aaron A. Budrevich

发明人： Willy RACHMADY ,  Van H. Le ,  Ravi Pillarisetty ,  Jessica S. Kachian ,  Marc C. French ,  Aaron A. Budrevich

IPC分类号： H01L29/06 ,  H01L21/306 ,  H01L29/786

CPC分类号： H01L29/0673 ,  B82Y10/00 ,  B82Y40/00 ,  H01L21/02381 ,  H01L21/0245 ,  H01L21/02532 ,  H01L21/02584 ,  H01L21/30604 ,  H01L21/30608 ,  H01L21/3065 ,  H01L29/1054 ,  H01L29/161 ,  H01L29/165 ,  H01L29/167 ,  H01L29/365 ,  H01L29/42392 ,  H01L29/511 ,  H01L29/66439 ,  H01L29/66477 ,  H01L29/66628 ,  H01L29/66742 ,  H01L29/775 ,  H01L29/7781 ,  H01L29/78 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/786 ,  H01L29/78696 ,  Y02E10/50

摘要： Semiconductor device stacks and devices made there from having Ge-rich device layers. A Ge-rich device layer is disposed above a substrate, with a p-type doped Ge etch suppression layer (e.g., p-type SiGe) disposed there between to suppress etch of the Ge-rich device layer during removal of a sacrificial semiconductor layer richer in Si than the device layer. Rates of dissolution of Ge in wet etchants, such as aqueous hydroxide chemistries, may be dramatically decreased with the introduction of a buried p-type doped semiconductor layer into a semiconductor film stack, improving selectivity of etchant to the Ge-rich device layers.

摘要翻译： 在那里制造的半导体器件堆叠和器件具有富锗器件层。 富锗器件层设置在衬底之上，其中设置有p型掺杂Ge蚀刻抑制层（例如，p型SiGe），以在去除牺牲半导体层期间抑制富锗器件层的蚀刻 Si比设备层更丰富。 随着在半导体膜堆叠中引入掩埋的p型掺杂半导体层，可以显着降低Ge在湿蚀刻剂（例如氢氧化物水溶液）中的溶解速率，从而提高蚀刻剂对Ge富集器件层的选择性。

公开(公告)号：US09136343B2

公开(公告)日：2015-09-15

申请号：US13749139

申请日：2013-01-24

申请人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/66 ,  H01L29/423 ,  H01L29/78 ,  H01L29/786

CPC分类号： H01L29/78609 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/165 ,  H01L29/205 ,  H01L29/42392 ,  H01L29/66742 ,  H01L29/785 ,  H01L29/78606 ,  H01L29/78618 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696

摘要： Deep gate-all-around semiconductor devices having germanium or group III-V active layers are described. For example, a non-planar semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a hetero-junction between an upper layer and a lower layer of differing composition. An active layer is disposed above the hetero-structure and has a composition different from the upper and lower layers of the hetero-structure. A gate electrode stack is disposed on and completely surrounds a channel region of the active layer, and is disposed in a trench in the upper layer and at least partially in the lower layer of the hetero-structure. Source and drain regions are disposed in the active layer and in the upper layer, but not in the lower layer, on either side of the gate electrode stack.

摘要翻译： 描述具有锗或III-V族有源层的深栅极全面半导体器件。 例如，非平面半导体器件包括设置在衬底上的异质结构。 异质结构包括不同组成的上层和下层之间的异质结。 有源层设置在杂结构上方，并且具有与异质结构的上层和下层不同的组成。 栅电极堆叠设置在有源层的沟道区上并完全包围有源层的沟道区，并且设置在上层中的沟槽中，并且至少部分地设置在异质结构的下层中。 源极和漏极区域设置在栅电极堆叠的任一侧上的有源层和上层中，而不是在下层中。

公开(公告)号：US08987794B2

公开(公告)日：2015-03-24

申请号：US13997118

申请日：2011-12-23

申请人： Willy Rachmady ,  Ravi Pillarisetty ,  Van H. Le ,  Jack T. Kavalieros ,  Robert S. Chau ,  Jessica S. Kachian

发明人： Willy Rachmady ,  Ravi Pillarisetty ,  Van H. Le ,  Jack T. Kavalieros ,  Robert S. Chau ,  Jessica S. Kachian

IPC分类号： H01L21/336 ,  H01L29/06 ,  H01L29/423 ,  H01L29/786 ,  H01L29/78 ,  H01L29/165 ,  H01L29/66

CPC分类号： H01L29/7848 ,  H01L29/045 ,  H01L29/0669 ,  H01L29/0673 ,  H01L29/1033 ,  H01L29/165 ,  H01L29/42392 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/785 ,  H01L29/7851 ,  H01L29/78618 ,  H01L29/78696 ,  H01L2029/7858

摘要： A non-planar gate all-around device and method of fabrication thereby are described. In one embodiment, the device includes a substrate having a top surface with a first lattice constant. Embedded epi source and drain regions are formed on the top surface of the substrate. The embedded epi source and drain regions have a second lattice constant that is different from the first lattice constant. Channel nanowires having a third lattice are formed between and are coupled to the embedded epi source and drain regions. In an embodiment, the second lattice constant and the third lattice constant are different from the first lattice constant. The channel nanowires include a bottom-most channel nanowire and a bottom gate isolation is formed on the top surface of the substrate under the bottom-most channel nanowire. A gate dielectric layer is formed on and all-around each channel nanowire. A gate electrode is formed on the gate dielectric layer and surrounding each channel nanowire.

摘要翻译： 描述了非平面栅极全面器件及其制造方法。 在一个实施例中，该器件包括具有第一晶格常数的顶表面的衬底。 嵌入的epi源极和漏极区域形成在衬底的顶表面上。 嵌入的epi源极和漏极区具有不同于第一晶格常数的第二晶格常数。 具有第三晶格的沟道纳米线形成在嵌入的epi源极和漏极区之间并耦合到嵌入的epi源极和漏极区。 在一个实施例中，第二晶格常数和第三晶格常数不同于第一晶格常数。 通道纳米线包括最底部的沟道纳米线，并且在最底部的沟道纳米线下方的衬底的顶表面上形成底栅隔离。 在每个通道纳米线上形成栅极电介质层。 在栅极电介质层上形成栅电极并围绕每个沟道纳米线。

公开(公告)号：US20140225065A1

公开(公告)日：2014-08-14

申请号：US13997118

申请日：2011-12-23

申请人： Willy Rachmady ,  Ravi Pillarisetty ,  Van H. Le ,  Jack T. Kavalieros ,  Robert S. Chau ,  Jessica S. Kachian

发明人： Willy Rachmady ,  Ravi Pillarisetty ,  Van H. Le ,  Jack T. Kavalieros ,  Robert S. Chau ,  Jessica S. Kachian

IPC分类号： H01L29/06 ,  H01L29/78 ,  H01L29/66

CPC分类号： H01L29/7848 ,  H01L29/045 ,  H01L29/0669 ,  H01L29/0673 ,  H01L29/1033 ,  H01L29/165 ,  H01L29/42392 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/785 ,  H01L29/7851 ,  H01L29/78618 ,  H01L29/78696 ,  H01L2029/7858

摘要： A non-planar gate all-around device and method of fabrication thereby are described. In one embodiment, the device includes a substrate having a top surface with a first lattice constant. Embedded epi source and drain regions are formed on the top surface of the substrate. The embedded epi source and drain regions have a second lattice constant that is different from the first lattice constant. Channel nanowires having a third lattice are formed between and are coupled to the embedded epi source and drain regions. In an embodiment, the second lattice constant and the third lattice constant are different from the first lattice constant. The channel nanowires include a bottom-most channel nanowire and a bottom gate isolation is formed on the top surface of the substrate under the bottom-most channel nanowire. A gate dielectric layer is formed on and all-around each channel nanowire. A gate electrode is formed on the gate dielectric layer and surrounding each channel nanowire.

摘要翻译： 描述了非平面栅极全面器件及其制造方法。 在一个实施例中，该器件包括具有第一晶格常数的顶表面的衬底。 嵌入的epi源极和漏极区域形成在衬底的顶表面上。 嵌入的epi源极和漏极区具有不同于第一晶格常数的第二晶格常数。 具有第三晶格的沟道纳米线形成在嵌入的epi源极和漏极区之间并耦合到嵌入的epi源极和漏极区。 在一个实施例中，第二晶格常数和第三晶格常数不同于第一晶格常数。 通道纳米线包括最底部的沟道纳米线，并且在最底部的沟道纳米线下方的衬底的顶表面上形成底栅隔离。 在每个通道纳米线上形成栅极电介质层。 在栅极电介质层上形成栅电极并围绕每个沟道纳米线。