摘要:
A memory device includes an antifuse. The antifuse is configured to program a bit cell of the memory device. The antifuse is configured with a PMOS device
摘要:
A delay locked loop generates a voltage on a common node as a function of a phase difference between a reference input and a feedback input. A first voltage-controlled delay line coupled between the reference input and the feedback input and has a first delay, which is controlled by the voltage on the common node. A second voltage-controlled delay line is selectively coupled in series with the first delay line, between the reference input and the feedback input, as a function of a test control input. The second delay line has a second delay, which is controlled by the voltage on the common node.
摘要:
An integrated circuit having a DC current test function operates at a core supply voltage and interfaces at an input-output (I/O) supply voltage. The I/O supply voltage is greater than the core supply voltage. The integrated circuit includes a buffer, a voltage level shifting circuit and a pull-up circuit. The buffer is coupled between a core terminal and a pad terminal. The pad terminal has a voltage swing which is substantially equal to the I/O supply voltage. The voltage level shifting circuit has a test signal input with a voltage swing substantially equal to the core supply voltage and a test signal output with a voltage swing from the I/O supply voltage to a selected bias voltage. The pull-up circuit is coupled to the pad terminal and has a control terminal coupled to the test signal output. The pull-up circuit pulls the pad terminal toward the I/O supply voltage during normal operation and selectively isolates the pad terminal from the I/O supply voltage as a function of the test signal during a DC current test.
摘要:
A programmable memory cell including a thick oxide spacer transistor, a programmable thin oxide anti-fuse disposed adjacent to the thick oxide spacer transistor, and first and second thick oxide access transistors. The thick oxide spacer transistor and first and second thick oxide access transistors can include an oxide layer that is thicker than an oxide layer of the programmable thin oxide anti-fuse. The programmable thin oxide anti-fuse and the thick oxide spacer transistor can be natively doped. The first and second thick oxide access transistors can be doped so as to have standard threshold voltage characteristics.
摘要:
Methods and systems for split threshold voltage programmable bitcells are disclosed and may include selectively programming bitcells in a memory device by applying a high voltage to a gate terminal of the bitcells, where the programming burns a conductive hole in an oxide layer above a higher threshold voltage layer in a memory device. The bitcells may comprise an oxide layer and a doped channel, which may comprise a plurality of different threshold voltage layers. The plurality of different threshold voltage layers may comprise at least one layer with a higher threshold voltage and at least one layer with a lower threshold voltage. The oxide may comprise a gate oxide. The bitcell may comprise an anti-fuse device. The layer with a higher threshold voltage may be separated from an output terminal of the bitcell by the at least one layer with a lower threshold voltage.
摘要:
A disclosed embodiment is a programmable memory cell comprising an elevated ground node having a voltage greater than a common ground node by an amount substantially equal to a voltage drop across a trigger point adjustment element. In one embodiment, the trigger point adjustment element can be a diode. The trigger voltage of the programmable memory cell is raised closer to a supply voltage when current passes through the trigger point adjustment element during a write operation. The programmable memory cell can comprise a pair of cross-coupled inverters, and first and second programmable antifuses that can be coupled to each inverter in the pair of cross-coupled inverters. Since the trigger voltage of the programmable memory cell is raised closer to the supply voltage, a programmed antifuse can easily reach below the trigger voltage and result in a successful write operation even when the supply voltage is a low voltage.
摘要:
A disclosed embodiment is a programmable memory cell comprising an elevated ground node having a voltage greater than a common ground node by an amount substantially equal to a voltage drop across a trigger point adjustment element. In one embodiment, the trigger point adjustment element can be a diode. The trigger voltage of the programmable memory cell is raised closer to a supply voltage when current passes through the trigger point adjustment element during a write operation. The programmable memory cell can comprise a pair of cross-coupled inverters, and first and second programmable antifuses that can be coupled to each inverter in the pair of cross-coupled inverters. Since the trigger voltage of the programmable memory cell is raised closer to the supply voltage, a programmed antifuse can easily reach below the trigger voltage and result in a successful write operation even when the supply voltage is a low voltage.
摘要:
A quad SRAM based one time programmable memory cell is provided. Prior to programming, the memory cell operates as an SRAM memory cell. After programming, the memory cell operates as a one-time programmable non-volatile memory cell. The memory cell includes a storage element coupled at a first side to a first upper fuse and a first lower fuse and coupled at a second side to a second upper fuse and a second lower fuse. When the first upper fuse and second lower fuse are programmed, the storage element outputs a first value. When the second upper fuse and first lower fuse are programmed, the storage element outputs a second value. After programming the upper fuse acts as a pull-up fuse and the lower fuse acts as a pull-down fuse hold the state of the cell.
摘要:
A phase-locked loop within an integrated circuit assembly is provided. The phase-locked loop includes a plurality of subcells of semiconductor devices arranged in a base layer pattern on base layers of the integrated circuit assembly. One or more metal layers are formed over and interconnect the plurality of semiconductor devices in a metallization pattern. The phase-locked loop has an output frequency range that is changeable with a change to the metallization pattern without a corresponding change to the base layer pattern.
摘要:
A method of power sequence protection for a level shifter is disclosed that includes the steps of placing the level shifter in a pre-selected state if an input voltage supply is not powered on when an output voltage supply is powered on and releasing the level shifter from the pre-selected state to follow transitions of an input signal when the input voltage supply is powered on.