公开(公告)号：US4775573A

公开(公告)日：1988-10-04

申请号：US34791

申请日：1987-04-03

Applicant: Joseph A. Turek

Inventor： Joseph A. Turek

IPC: H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/24 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC classification number: H05K3/4664 ,  H05K1/116 ,  H05K1/162 ,  H05K1/095 ,  H05K2201/0209 ,  H05K2201/092 ,  H05K2201/09309 ,  H05K2203/044 ,  H05K2203/0571 ,  H05K3/243 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3468 ,  H05K3/3473 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4602 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A multilayer printed circuit board which reliably and economically marries conventional copper clad printed circuit board technology with polymeric conductors and insulators. Reliability is enhanced by forming all solder pads of copper, providing conductive tails on solder pads which are to be connected by polymeric inks, and ultimately forming a solder resist over all but the solder pads. As a result, polymer inks can be applied to both sides of the board, and the completed board can be subject to conventional solder dipping or wave soldering operations. According to one feature of the invention, a thin dielectric layer can be applied as intermediate to planar conductive layers which form a power plane having built-in distributed capacitance for decoupling.

Abstract translation: 一种多层印刷电路板，可靠且经济地将传统的铜包层印刷电路板技术与聚合物导体和绝缘体结合在一起。 通过形成铜的所有焊盘来提高可靠性，在焊盘上提供导电尾部，这些焊盘将通过聚合物墨水连接，并最终在除焊盘之外的所有焊料上形成阻焊剂。 结果，可以将聚合物油墨施加到板的两侧，并且完成的板可以进行常规的焊料浸渍或波峰焊操作。 根据本发明的一个特征，可以将薄介电层作为中间层应用于形成具有用于去耦的内置分布电容的功率平面的平面导电层。

公开(公告)号：US5366027A

公开(公告)日：1994-11-22

申请号：US016111

申请日：1993-02-10

Applicant: Joseph A. Turek ,  Joel S. Dryer ,  Harold L. Sexson

Inventor： Joseph A. Turek ,  Joel S. Dryer ,  Harold L. Sexson

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K3/00 ,  H05K3/32 ,  H05K3/38 ,  H05K3/42

CPC classification number: H05K3/0061 ,  H05K1/0237 ,  H05K1/034 ,  H05K1/05 ,  H05K2201/015 ,  H05K3/321 ,  H05K3/386 ,  H05K3/42 ,  Y10S428/901 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A double-sided printed circuit board and a method for making the circuit board. The circuit board includes a metal support that functions as both a heat sink and a ground plane. The circuit board contains a dielectric having first and second conductive foil platings on opposing sides of the dielectric. Prior to bonding the first foil plating to the metal support with a conductive adhesive, a standard protective coating on the first foil plating, which typically remains on the foil plating in conventional practice, is removed in order to expose a bare surface of the first foil plating. The exposed bare surface of the first foil plating is then bonded to the metal support before any substantial oxidation or a build up of impurities on the first foil plating surface can occur.

Abstract translation: 双面印刷电路板和制造电路板的方法。 电路板包括用作散热器和接地平面的金属支架。 电路板包含在电介质的相对侧上具有第一和第二导电箔的电介质。 在用导电粘合剂将第一箔镀层接合到金属支撑体之前，通常在常规实践中在箔镀层上保留的第一箔镀层上的标准保护涂层被去除，以暴露第一箔的裸露表面 电镀。 然后在发生第一箔电镀表面上的杂质的任何实质氧化或堆积之前，将第一箔镀层的暴露的裸露表面接合到金属载体上。

公开(公告)号：US4854040A

公开(公告)日：1989-08-08

申请号：US212321

申请日：1988-06-27

Applicant: Joseph A. Turek

Inventor： Joseph A. Turek

IPC: H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/24 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4664 ,  H05K1/116 ,  H05K1/162 ,  H05K1/095 ,  H05K2201/0209 ,  H05K2201/092 ,  H05K2201/09309 ,  H05K2203/044 ,  H05K2203/0571 ,  H05K2203/1394 ,  H05K3/243 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3468 ,  H05K3/3473 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4602 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A multilayer printed circuit board which reliably and economically marries conventional copper clad printed circuit board technology with polymeric conductors and insulators. Reliability is enhanced by forming all solder pads of copper, providing conductive tails on solder pads which are to be connected by polymeric inks, and ultimately forming a solder resist over all but the solder pads. As a result, polymer inks can be applied to both sides of the board, and the completed board can be subject to conventional solder dipping or wave soldering operations. According to one feature of the invention, a thin dielectric layer can be applied as intermediate to planar conductive layers which form a power plane having built-in distributed capacitance for decoupling.

Abstract translation: 一种多层印刷电路板，可靠且经济地将传统的铜包层印刷电路板技术与聚合物导体和绝缘体结合在一起。 通过形成铜的所有焊盘来提高可靠性，在焊盘上提供导电尾部，这些焊盘将通过聚合物墨水连接，并最终在除焊盘之外的所有焊料上形成阻焊剂。 因此，聚合物油墨可以应用于板的两侧，并且完成的板可以进行常规焊料浸渍或波峰焊操作。 根据本发明的一个特征，可以将薄介电层作为中间层应用于形成具有用于去耦的内置分布电容的功率平面的平面导电层。

公开(公告)号：US5432303A

公开(公告)日：1995-07-11

申请号：US296324

申请日：1994-08-25

Applicant: Joseph A. Turek ,  Joel S. Dryer ,  Harold L. Sexson

Inventor： Joseph A. Turek ,  Joel S. Dryer ,  Harold L. Sexson

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K3/00 ,  H05K3/32 ,  H05K3/38 ,  H05K3/42

CPC classification number: H05K3/0061 ,  H05K1/0237 ,  H05K1/034 ,  H05K1/05 ,  H05K2201/015 ,  H05K3/321 ,  H05K3/386 ,  H05K3/42 ,  Y10S428/901 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A double-sided printed circuit board and a method for making the circuit board. The circuit board includes a metal support that functions as both a heat sink and a ground plane. The circuit board contains a dielectric having first and second conductive foil platings on opposing sides of the dielectric. Prior to bonding the first foil plating to the metal support with a conductive adhesive, a standard protective coating on the first foil plating, which typically remains on the foil plating in conventional practice, is removed in order to expose a bare surface of the first foil plating. The exposed bare surface of the first foil plating is then bonded to the metal support before any substantial oxidation or a build up of impurities on the first foil plating surface can occur.

Abstract translation: 双面印刷电路板和制造电路板的方法。 电路板包括用作散热器和接地平面的金属支架。 电路板包含在电介质的相对侧上具有第一和第二导电箔的电介质。 在用导电粘合剂将第一箔镀层接合到金属支撑体之前，通常在常规实践中在箔镀层上保留的第一箔镀层上的标准保护涂层被去除，以暴露第一箔的裸露表面 电镀。 然后在发生第一箔电镀表面上的杂质的任何实质氧化或堆积之前，将第一箔镀层的暴露的裸露表面接合到金属载体上。

公开(公告)号：US5210941A

公开(公告)日：1993-05-18

申请号：US732665

申请日：1991-07-19

Applicant: Joseph A. Turek ,  Joel S. Dryer ,  Harold L. Sexson

Inventor： Joseph A. Turek ,  Joel S. Dryer ,  Harold L. Sexson

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K3/00 ,  H05K3/32 ,  H05K3/38 ,  H05K3/42

CPC classification number: H05K3/0061 ,  H05K1/0237 ,  H05K1/034 ,  H05K1/05 ,  H05K2201/015 ,  H05K3/321 ,  H05K3/386 ,  H05K3/42 ,  Y10S428/901 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A double-sided printed circuit board and a method for making the circuit board. The circuit board includes a metal support that functions as both a heat sink and a ground plane. The circuit board contains a dielectric having first and second conductive foil platings on opposing sides of the dielectric. Prior to bonding the first foil plating to the metal support with a conductive adhesive, a standard protective coating on the first foil plating, which typically remains on the foil plating in conventional practice, is removed in order to expose a bare surface of the first foil plating. The exposed bare surface of the first foil plating is then bonded to the metal support before any substantial oxidation or a build up of impurities on the first foil plating surface can occur.

Abstract translation: 双面印刷电路板和制造电路板的方法。 电路板包括用作散热器和接地平面的金属支架。 电路板包含在电介质的相对侧上具有第一和第二导电箔的电介质。 在用导电粘合剂将第一箔镀层接合到金属支撑体之前，通常在常规实践中在箔镀层上保留的第一箔电镀上的标准保护涂层被去除以暴露第一箔的裸露表面 电镀。 然后在发生第一箔电镀表面上的杂质的任何实质氧化或堆积之前，将第一箔镀层的暴露的裸露表面接合到金属载体上。