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    METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE
    1.
    发明申请
    METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE 审中-公开
    用于从胶带中分离半导体器件的方法和装置

    公开(公告)号：US20100037445A1

    公开(公告)日：2010-02-18

    申请号：US12603913

    申请日：2009-10-22

    申请人： Youn-sung Ko ,  Hak-kyoon Byun ,  Jung-hwan Woo ,  Hyun-jung Song

    发明人： Youn-sung Ko ,  Hak-kyoon Byun ,  Jung-hwan Woo ,  Hyun-jung Song

    IPC分类号： B23P19/04

    CPC分类号： H01L21/67132 ,  H01L21/67092 ,  Y10T29/49815 ,  Y10T29/49819 ,  Y10T29/49824 ,  Y10T29/53091 ,  Y10T29/53187 ,  Y10T29/53274

    摘要： An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

    摘要翻译： 从半导体芯片上分离半导体芯片的方法和方法最小化了半导体芯片会破裂的可能性。 该装置包括保持器，具有上端的第一喷射器和其上端设置在第一喷射器的中心的第二喷射器。 保持器具有延伸穿过上部的上部和通孔。 喷射器具有可以通过保持器上部的通孔而延伸和缩回到保持器内的上端。 安装有至少一个半导体芯片的胶带抵靠着保持器的上部。 第一喷射器从保持器延伸第一距离以向上推半导体芯片。 第二喷射器从保持器延伸大于第一距离的第二距离，以将半导体芯片进一步向上推。 因此，磁带从半导体芯片逐渐分离。

    METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE
    2.
    发明申请
    METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE 失效
    用于从胶带中分离半导体器件的方法和装置

    公开(公告)号：US20070293022A1

    公开(公告)日：2007-12-20

    申请号：US11755170

    申请日：2007-05-30

    申请人： Youn-sung KO ,  Hak-kyoon BYUN ,  Jung-hwan WOO ,  Hyun-jung SONG

    发明人： Youn-sung KO ,  Hak-kyoon BYUN ,  Jung-hwan WOO ,  Hyun-jung SONG

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67132 ,  H01L21/67092 ,  Y10T29/41 ,  Y10T29/49815 ,  Y10T29/49819 ,  Y10T29/49824 ,  Y10T29/53091 ,  Y10T29/53187 ,  Y10T29/53274

    摘要： An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

    摘要翻译： 从半导体芯片上分离半导体芯片的方法和方法最小化了半导体芯片会破裂的可能性。 该装置包括保持器，具有上端的第一喷射器和其上端设置在第一喷射器的中心的第二喷射器。 保持器具有延伸穿过上部的上部和通孔。 喷射器具有可以通过保持器上部的通孔而延伸和缩回到保持器内的上端。 安装有至少一个半导体芯片的胶带抵靠着保持器的上部。 第一喷射器从保持器延伸第一距离以向上推半导体芯片。 第二喷射器从保持器延伸大于第一距离的第二距离，以将半导体芯片进一步向上推。 因此，磁带从半导体芯片逐渐分离。

    APPARATUS FOR SEMICONDUCTOR DIE BONDING
    4.
    发明申请
    APPARATUS FOR SEMICONDUCTOR DIE BONDING 审中-公开
    用于半导体DIE结合的装置

    公开(公告)号：US20110079361A1

    公开(公告)日：2011-04-07

    申请号：US12850027

    申请日：2010-08-04

    申请人： Byeong-kuk Park ,  Seok Goh ,  Kyoung-bok Cho ,  Dong-soo Lee ,  Jung-hwan Woo

    发明人： Byeong-kuk Park ,  Seok Goh ,  Kyoung-bok Cho ,  Dong-soo Lee ,  Jung-hwan Woo

    IPC分类号： B32B37/02

    CPC分类号： H01L24/83 ,  H01L24/75 ,  H01L2224/83 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  Y10T156/1707 ,  Y10T156/1744

    摘要： An apparatus for semiconductor die bonding includes a first bonding head and a second bonding head configured to respectively pickup a first semiconductor chip and a second semiconductor chip located at a pickup point. The apparatus for semiconductor die bonding may also include a first transfer device configured to transfer the first bonding head from the pickup point to a bonding point located on a substrate along a transfer path. The first transfer device may further be configured to return to the pickup point along a first return path after the first semiconductor chip is bonded to the substrate. Also, the apparatus for semiconductor die bonding may include a second transfer device configured to transfer the second bonding head from the pickup point to the bonding point located on the substrate along the transfer path. The second transfer device may further be configured to return to the pickup point along a second return path after the second semiconductor chip is bonded to the substrate. Additionally, the apparatus for semiconductor die bonding may include a controller configured to alternately apply a transfer signal and a return signal to the first transfer device and the second transfer device so the first bonding head and the second bonding head do not collide with each other.

    摘要翻译： 一种用于半导体管芯接合的设备包括：第一接合头和第二接合头，其被配置为分别拾取位于拾取点处的第一半导体芯片和第二半导体芯片。 用于半导体管芯接合的设备还可以包括第一传送设备，其被配置为沿着传送路径将第一接合头从拾取点传送到位于衬底上的接合点。 第一传送装置还可以被配置为在第一半导体芯片被接合到基板之后沿着第一返回路径返回到拾取点。 此外，用于半导体管芯接合的装置可以包括第二传送装置，其被配置为沿着传送路径将第二接合头从拾取点传送到位于衬底上的接合点。 第二传送装置还可以被配置为在第二半导体芯片被接合到基板之后沿着第二返回路径返回到拾取点。 另外，用于半导体管芯接合的装置可以包括控制器，其被配置为交替地将传递信号和返回信号施加到第一传送装置和第二传送装置，使得第一接合头和第二接合头不会彼此碰撞。

    Die attaching apparatus
    5.
    发明授权
    Die attaching apparatus 失效
    模具附着装置

    公开(公告)号：US07650687B2

    公开(公告)日：2010-01-26

    申请号：US11155181

    申请日：2005-06-16

    申请人： Jung-Hwan Woo ,  Ho-Jae Byon ,  Jae-Bong Shin ,  Yong-Kyun Sun ,  Hyun-Ho Kim ,  Choo-Ho Kim ,  Youn-Sung Ko

    发明人： Jung-Hwan Woo ,  Ho-Jae Byon ,  Jae-Bong Shin ,  Yong-Kyun Sun ,  Hyun-Ho Kim ,  Choo-Ho Kim ,  Youn-Sung Ko

    IPC分类号： B23P19/00 ,  B21F1/00

    CPC分类号： H01L21/67144 ,  H01L21/67092 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53239

    摘要： Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.

    摘要翻译： 提供了一种模具附接装置，清洁系统和方法，其具有能够在短时间内容易地替换适用于各种包装的新的部件。 防止模压构件和加热板的表面被污染。 模压构件可拆卸地附接到可以直接对模具施加压力的附接单元的下端。 其上安装有用于研磨加热板的研磨装置的加热板研磨机与模压构件隔开预定距离。 加热板清洁剂附着在加热板研磨机的侧壁上并去除残留在加热板上的残留物。

    SYSTEM AND METHOD FOR SENSING SHAPE OF CHIP
    6.
    发明申请
    SYSTEM AND METHOD FOR SENSING SHAPE OF CHIP 审中-公开
    用于感应芯片形状的系统和方法

    公开(公告)号：US20070277128A1

    公开(公告)日：2007-11-29

    申请号：US11752183

    申请日：2007-05-22

    申请人： Dong-Chul HAN ,  Jung-Hwan WOO ,  Youn-Sung KO

    发明人： Dong-Chul HAN ,  Jung-Hwan WOO ,  Youn-Sung KO

    IPC分类号： G06F17/50

    CPC分类号： G01B11/24 ,  G01B11/245

    摘要： In one embodiment of a system for sensing the shape of a chip, a support plate is provided that preferably includes at least one chip mounted thereon. A lower lighting unit is preferably disposed below the support plate to emit light through the support plate and around or between the chip(s) toward an optical sensing unit, with a portion of the light emitted being blocked by the opaque chip(s). The optical sensing unit preferably senses the light that passes through the support plate and around or between the chip(s), but not the light that is blocked by the chip(s). In this manner, the shape of the chip can be more accurately determined, even when it is deformed within an acceptable range. A method for using a system constructed according to the principles of the present invention is also provided.

    摘要翻译： 在用于感测芯片形状的系统的一个实施例中，提供了优选地包括安装在其上的至少一个芯片的支撑板。 下部照明单元优选地设置在支撑板下方以通过支撑板发射光，并且在芯片周围或之间朝向光学感测单元发射光，其中所发射的光的一部分被不透明芯片阻挡。 光学感测单元优选地感测穿过支撑板并且在芯片之间或之间的光，而不是被芯片阻挡的光。 以这种方式，即使在可接受的范围内变形的情况下，也能够更精确地确定芯片的形状。 还提供了使用根据本发明的原理构造的系统的方法。

    Apparatus for detaching a semiconductor chip from a tape
    9.
    发明授权
    Apparatus for detaching a semiconductor chip from a tape 失效
    用于从胶带上分离半导体芯片的装置

    公开(公告)号：US07624498B2

    公开(公告)日：2009-12-01

    申请号：US11755170

    申请日：2007-05-30

    申请人： Youn-sung Ko ,  Hak-kyoon Byun ,  Jung-hwan Woo ,  Hyun-jung Song

    发明人： Youn-sung Ko ,  Hak-kyoon Byun ,  Jung-hwan Woo ,  Hyun-jung Song

    IPC分类号： B23P19/00 ,  H01L21/00

    CPC分类号： H01L21/67132 ,  H01L21/67092 ,  Y10T29/41 ,  Y10T29/49815 ,  Y10T29/49819 ,  Y10T29/49824 ,  Y10T29/53091 ,  Y10T29/53187 ,  Y10T29/53274

    摘要： An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

    摘要翻译： 从半导体芯片上分离半导体芯片的方法和方法最小化了半导体芯片会破裂的可能性。 该装置包括保持器，具有上端的第一喷射器和其上端设置在第一喷射器的中心的第二喷射器。 保持器具有延伸穿过上部的上部和通孔。 喷射器具有可以通过保持器上部的通孔而延伸和缩回到保持器内的上端。 安装有至少一个半导体芯片的胶带抵靠着保持器的上部。 第一喷射器从保持器延伸第一距离以向上推半导体芯片。 第二喷射器从保持器延伸大于第一距离的第二距离，以将半导体芯片进一步向上推。 因此，磁带从半导体芯片逐渐分离。