公开(公告)号：US20050284912A1

公开(公告)日：2005-12-29

申请号：US10875659

申请日：2004-06-23

申请人： Bao Zhai ,  Ka Shing Kwan

发明人： Bao Zhai ,  Ka Shing Kwan

IPC分类号： B06B3/00 ,  B23K1/06 ,  B23K20/10 ,  H01L21/60

CPC分类号： H01L24/78 ,  B06B3/00 ,  B23K20/106 ,  H01L2224/78301 ,  H01L2224/78347 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A flange-mounted transducer, such as an ultrasonic transducer, is provided that comprises a horn and a driver coupled to the horn for generating an oscillatory energy supply to the horn. A support structure interface is positioned at a node of longitudinal oscillatory displacement of the transducer and a support structure spaced from the horn extends from the support structure interface in a direction substantially parallel to a longitudinal axis of the horn. A flange mounted to the support structure at a node of radial oscillatory displacement of the support structure allows the transducer to be mounted to a machine, such as an ultrasonic wire-bonding machine, at a mounting position so that minimal vibration is transmitted from the transducer to the mounting position.

摘要翻译： 提供了一种法兰安装的换能器，例如超声换能器，其包括喇叭和耦合到喇叭的驱动器，用于产生向喇叭的振荡能量供应。 支撑结构界面位于换能器的纵向振荡位移的节点处，并且与喇叭隔开的支撑结构在与喇叭的纵向轴线基本平行的方向上从支撑结构界面延伸。 在支撑结构的径向振荡位移的节点处安装到支撑结构的凸缘允许传感器在安装位置安装到诸如超声波引线接合机的机器，使得从换能器传递最小的振动 到安装位置。

公开(公告)号：US20140217152A1

公开(公告)日：2014-08-07

申请号：US14246199

申请日：2014-04-07

申请人： Phui Phoong CHUANG ,  Hasrul Bin HASIM ,  Wan AZMI ,  Siti Nurulhaida Bt. RAMLAN ,  Ka Shing KWAN ,  Ting Yu HE ,  Jun WAN

发明人： Phui Phoong CHUANG ,  Hasrul Bin HASIM ,  Wan AZMI ,  Siti Nurulhaida Bt. RAMLAN ,  Ka Shing KWAN ,  Ting Yu HE ,  Jun WAN

IPC分类号： H01L23/00

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K37/04 ,  H01L24/85 ,  H01L2224/78701 ,  H01L2224/78704 ,  H01L2224/78981 ,  H01L2224/85 ,  H01L2924/00014 ,  Y10T29/49826 ,  H01L2224/45099

摘要： A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.

公开(公告)号：US07303109B2

公开(公告)日：2007-12-04

申请号：US10612383

申请日：2003-07-01

申请人： Ka Shing Kwan ,  Guoshen Hu ,  Tingyu He ,  Yie Mi ,  Yam Mo Wong

发明人： Ka Shing Kwan ,  Guoshen Hu ,  Tingyu He ,  Yie Mi ,  Yam Mo Wong

IPC分类号： B23K1/06 ,  B23K37/04

CPC分类号： H01L21/68764 ,  H01L24/10 ,  H01L2924/01078 ,  H01L2924/01079

摘要： The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping.

摘要翻译： 本发明提供了一种在具有可氧化材料的多个半导体器件上形成导电凸块的装置和方法。 该装置包括凸块形成装置，适于容纳半导体装置的室系统和用于将惰性气体供应到室系统中的气体供应装置。 提供了用于在凸起期间支撑半导体器件的支撑台，并且所述支撑台可操作以在撞击之后将半导体器件从凸起部位移动到腔室系统中。

公开(公告)号：US07240820B2

公开(公告)日：2007-07-10

申请号：US10894514

申请日：2004-07-19

申请人： Rong Duan ,  Wei Hong He ,  Ka Shing Kwan

发明人： Rong Duan ,  Wei Hong He ,  Ka Shing Kwan

IPC分类号： B23K37/00

CPC分类号： B23K37/0408 ,  B23K2101/40

摘要： A clamping device is provided for holding an electronic device, such as a semiconductor carrier in the form of a leadframe, during processing thereof. It includes a main body for covering the electronic device and an opening in the main body for providing access to a part of the electronic device to be worked upon. A support structure is attachable for coupling it to a periphery of the opening whereby the support structure is extended across the opening for supporting the part of the electronic device that is accessible through the opening.

摘要翻译： 提供夹持装置，用于在其处理期间保持诸如引线框形式的半导体载体的电子装置。 它包括用于覆盖电子设备的主体和主体中的开口，用于提供对待加工的电子设备的一部分的访问。 支撑结构可附接到所述开口的周边，由此所述支撑结构延伸穿过所述开口以支撑可通过所述开口接近的所述电子设备的所述部分。

公开(公告)号：US08752751B2

公开(公告)日：2014-06-17

申请号：US13548323

申请日：2012-07-13

申请人： Phui Phoong Chuang ,  Hasrul Bin Hasim ,  Wan Azmi ,  Siti Nurulhaida Bt. Ramlan ,  Ka Shing Kwan ,  Ting Yu He ,  Jun Wan

发明人： Phui Phoong Chuang ,  Hasrul Bin Hasim ,  Wan Azmi ,  Siti Nurulhaida Bt. Ramlan ,  Ka Shing Kwan ,  Ting Yu He ,  Jun Wan

IPC分类号： B23K37/04

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K37/04 ,  H01L24/85 ,  H01L2224/78701 ,  H01L2224/78704 ,  H01L2224/78981 ,  H01L2224/85 ,  H01L2924/00014 ,  Y10T29/49826 ,  H01L2224/45099

摘要： A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.

摘要翻译： 本文公开了引线框支撑板200和用于引线接合机的窗夹400。 在所描述的实施例中，引线框架支撑板200包括设置在支撑表面212上的抽吸槽218的网络，每个抽吸槽218布置成与至少一个真空孔216流体连通，以使抽吸力成为 产生响应于真空力的沿着用于将引线框架保持抵靠支撑表面的抽吸槽的网络。 还公开了一种具有用于补偿窗夹的变形的狭槽的窗夹具400和制造引线框架支撑板的方法。

公开(公告)号：US20140014708A1

公开(公告)日：2014-01-16

申请号：US13548323

申请日：2012-07-13

申请人： Phui Phoong CHUANG ,  Hasrul Bin HASIM ,  Wan AZMI ,  Siti Nurulhaida Bt. RAMLAN ,  Ka Shing KWAN ,  Ting Yu HE ,  Jun WAN

发明人： Phui Phoong CHUANG ,  Hasrul Bin HASIM ,  Wan AZMI ,  Siti Nurulhaida Bt. RAMLAN ,  Ka Shing KWAN ,  Ting Yu HE ,  Jun WAN

IPC分类号： B23K37/04 ,  B23P11/00 ,  B23Q3/00

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K37/04 ,  H01L24/85 ,  H01L2224/78701 ,  H01L2224/78704 ,  H01L2224/78981 ,  H01L2224/85 ,  H01L2924/00014 ,  Y10T29/49826 ,  H01L2224/45099

摘要： A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.

摘要翻译： 本文公开了引线框支撑板200和用于引线接合机的窗夹400。 在所描述的实施例中，引线框架支撑板200包括设置在支撑表面212上的抽吸槽218的网络，每个抽吸槽218布置成与至少一个真空孔216流体连通，以使抽吸力成为 产生响应于真空力的沿着用于将引线框架保持抵靠支撑表面的抽吸槽的网络。 还公开了一种具有用于补偿窗夹的变形的狭槽的窗夹具400和制造引线框架支撑板的方法。

公开(公告)号：US20050279805A1

公开(公告)日：2005-12-22

申请号：US10870400

申请日：2004-06-16

申请人： Yam Wong ,  Ka Shing Kwan ,  Chong Chen

发明人： Yam Wong ,  Ka Shing Kwan ,  Chong Chen

IPC分类号： B23K20/00 ,  B23K37/00

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/78823 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： A bondhead is provided that comprises a bondhead body for holding a bonding tool, such as an ultrasonic transducer, and a bondhead actuator coupled to the bondhead body for moving the bonding tool with respect to a bonding surface. A wire clamping device, which may comprise a wire clamp holder and a wire clamp, is movable relative to the bondhead body for feeding a bonding wire to the bonding tool. A wire clamping device actuator is operative to move the wire clamping device relative to the bondhead body for improved control of the feeding of bonding wire to the bonding tool.

摘要翻译： 提供了一种接合头，其包括用于保持诸如超声波换能器的接合工具的接合头体和耦合到接合头体的接合头致动器，用于相对于接合表面移动接合工具。 可以包括线夹保持器和线夹的线夹装置可相对于接合头体移动，用于将接合线馈送到接合工具。 线夹紧装置致动器可操作以相对于接合头体移动线夹装置，以改善对接合工具的接合线的馈送的控制。

公开(公告)号：US08919631B2

公开(公告)日：2014-12-30

申请号：US13420739

申请日：2012-03-15

申请人： Yam Mo Wong ,  Ka Shing Kwan ,  Hing Leung Li ,  Xiang Chao Li

发明人： Yam Mo Wong ,  Ka Shing Kwan ,  Hing Leung Li ,  Xiang Chao Li

IPC分类号： B23K20/00 ,  B23K20/10 ,  H01L23/00 ,  B06B3/00

CPC分类号： B23K20/007 ,  B06B3/00 ,  B23K20/002 ,  B23K20/004 ,  B23K20/005 ,  B23K20/10 ,  B23K20/103 ,  B23K20/106 ,  H01L24/78 ,  H01L24/80 ,  H01L24/85 ,  H01L2224/78301 ,  H01L2224/78308 ,  H01L2224/78343 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/00

摘要： Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.

摘要翻译： 公开了一种用于将换能器安装到引线接合器的接合头的装置。 特别地，当在半导体封装内的不同位置之间形成电互连时，引线接合器的结合头可用于机械地驱动换能器。 具体地，该装置包括：i）具有用于连接到换能器的连接器的弯曲结构，该弯曲结构被构造成弯曲; 以及ii）附接到所述弯曲结构的至少一个致动器，所述至少一个致动器可操作以弯曲所述弯曲结构，从而引起经由所述连接器连接到其上的所述换能器的位移。

公开(公告)号：US06749100B2

公开(公告)日：2004-06-15

申请号：US09996293

申请日：2001-11-28

申请人： Yam Mo Wong ,  Keng Yew Song ,  Ka Shing Kwan ,  Hon Yu Ng ,  Tin Kwan Chan

发明人： Yam Mo Wong ,  Keng Yew Song ,  Ka Shing Kwan ,  Hon Yu Ng ,  Tin Kwan Chan

IPC分类号： B23K3700

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/10 ,  B23K2101/42 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/7865 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

摘要： The invention provides a wire-bonding apparatus for forming electrical connections between a semiconductor chip and a leadframe, comprising a plurality of bond-heads associated with a plurality of work holders on said wire bonding apparatus for holding a plurality of leadframes, wherein each bond-head of the apparatus is capable of independent bonding operation simultaneously with the other bond-heads, without synchronization of movement with the other bond-heads.

摘要翻译： 本发明提供一种用于形成半导体芯片和引线框架之间的电连接的引线键合装置，包括与所述引线接合装置上的多个工件保持器相关联的多个焊接头，用于保持多个引线框架， 该装置的头部能够与其他粘合头同时独立地结合操作，而不与其它粘合头同时移动。

公开(公告)号：US20130240605A1

公开(公告)日：2013-09-19

申请号：US13420739

申请日：2012-03-15

申请人： Yam Mo WONG ,  Ka Shing KWAN ,  Hing Leung LI ,  Xiang Chao LI

发明人： Yam Mo WONG ,  Ka Shing KWAN ,  Hing Leung LI ,  Xiang Chao LI

IPC分类号： B23K1/06

CPC分类号： B23K20/007 ,  B06B3/00 ,  B23K20/002 ,  B23K20/004 ,  B23K20/005 ,  B23K20/10 ,  B23K20/103 ,  B23K20/106 ,  H01L24/78 ,  H01L24/80 ,  H01L24/85 ,  H01L2224/78301 ,  H01L2224/78308 ,  H01L2224/78343 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/00

摘要： Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.

摘要翻译： 公开了一种用于将换能器安装到引线接合器的接合头的装置。 特别地，当在半导体封装内的不同位置之间形成电互连时，引线接合器的结合头可用于机械地驱动换能器。 具体地，该装置包括：i）具有用于连接到换能器的连接器的弯曲结构，该弯曲结构被构造成弯曲; 以及ii）附接到所述弯曲结构的至少一个致动器，所述至少一个致动器可操作以弯曲所述弯曲结构，从而引起经由所述连接器连接到其上的所述换能器的位移。