公开(公告)号：US08752751B2

公开(公告)日：2014-06-17

申请号：US13548323

申请日：2012-07-13

申请人： Phui Phoong Chuang ,  Hasrul Bin Hasim ,  Wan Azmi ,  Siti Nurulhaida Bt. Ramlan ,  Ka Shing Kwan ,  Ting Yu He ,  Jun Wan

发明人： Phui Phoong Chuang ,  Hasrul Bin Hasim ,  Wan Azmi ,  Siti Nurulhaida Bt. Ramlan ,  Ka Shing Kwan ,  Ting Yu He ,  Jun Wan

IPC分类号： B23K37/04

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K37/04 ,  H01L24/85 ,  H01L2224/78701 ,  H01L2224/78704 ,  H01L2224/78981 ,  H01L2224/85 ,  H01L2924/00014 ,  Y10T29/49826 ,  H01L2224/45099

摘要： A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.

摘要翻译： 本文公开了引线框支撑板200和用于引线接合机的窗夹400。 在所描述的实施例中，引线框架支撑板200包括设置在支撑表面212上的抽吸槽218的网络，每个抽吸槽218布置成与至少一个真空孔216流体连通，以使抽吸力成为 产生响应于真空力的沿着用于将引线框架保持抵靠支撑表面的抽吸槽的网络。 还公开了一种具有用于补偿窗夹的变形的狭槽的窗夹具400和制造引线框架支撑板的方法。

公开(公告)号：US08707550B2

公开(公告)日：2014-04-29

申请号：US12508780

申请日：2009-07-24

申请人： Keng Yew James Song ,  Ka Shing Kenny Kwan ,  Choong Kead Leslie Lum ,  Ting Yu He

发明人： Keng Yew James Song ,  Ka Shing Kenny Kwan ,  Choong Kead Leslie Lum ,  Ting Yu He

IPC分类号： H01L21/58 ,  H01L21/60 ,  H05K13/04

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/3011 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53183 ,  Y10T29/53261 ,  Y10T29/53265 ,  H01L2924/00 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756

摘要： A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.

摘要翻译： 用于接合包括基板的电子设备的接合装置包括彼此相邻布置的第一和第二轨道，所述第一和第二轨道被配置为在沿着轨道的运输期间沿垂直取向对准基板。 接合系统可位于沿着第一轨道定位的第一接合位置和沿着第二轨道定位的第二接合位置。 第一分度器位于第一轨道附近并且第二分度器位于第二轨道附近，其中每个分度器独立地操作以沿着一个轨道输送基板，同时保持在另一个导轨上的基板被接合。 位于轨道一端的用于保持多个未粘结基底的容器可操作以将未粘合的基底直接供给到轨道。