Abstract:
Novel sorption cooling devices capable of providing cooling over an extended period of time are disclosed. The sorption cooling devices are particularly useful for temperature-controlled shipping containers that are required to maintain a temperature below ambient for a time sufficient to complete delivery of the container and its contents. The shipping containers can be utilized to cost-effectively transport temperature-sensitive products.
Abstract:
A sorption cooling device capable of providing cooling over an extended period of time. The sorption cooling device is particularly useful in a temperature-controlled shipping container that is required to maintain a temperature below ambient for an extended period of time. In one embodiment, the cooling device includes a means for restricting the flow of refrigerant liquid to control the degree of cooling over an extended period of time.
Abstract:
A sorption cooling device adapted to cool a gas or liquid flowing through a conduit. The cooling device has a high cooling density and a user can independently control the cooling rate. The cooling device can be incorporated in a number of apparatus and in one embodiment is incorporated in a personnel cooling apparatus, such as a closed-loop breathing apparatus or a body cooler.
Abstract:
A sorption cooling device adapted to cool a gas or liquid flowing through a conduit. The cooling device has a high cooling density and a user can independently control the cooling rate. The cooling device can be incorporated in a number of apparatus and in one embodiment is incorporated in a personnel cooling apparatus, such as a closed-loop breathing apparatus or a body cooler.
Abstract:
The present invention relates to low dielectric constant nanoporous silica films and to processes for their manufacture. A substrate, e.g., a wafer suitable for the production of an integrated circuit, having a plurality of raised lines and/or electronic elements present on its surface, is provided with a relatively high porosity, low dielectric constant, silicon-containing polymer film composition.
Abstract:
A process for the manufacture of nanoporous silica dielectric films by vapor deposition of silica precursors on a substrate. The process provides for vaporizing at least one alkoxysilane composition; depositing the vaporized alkoxysilane composition onto a substrate; exposing the deposited alkoxysilane composition to a water vapor, and either an acid or a base vapor; and drying the exposed alkoxysilane composition, thereby forming a relatively high porosity, low dielectric constant, silicon containing polymer composition on the substrate.
Abstract:
Novel sorption cooling devices capable of providing cooling over an extended period of time are disclosed. The sorption cooling devices are particularly useful for temperature-controlled shipping containers that are required to maintain a temperature below ambient for a time sufficient to complete delivery of the container and its contents. The shipping containers can be utilized to cost-effectively transport temperature-sensitive products.
Abstract:
A container insert for providing a thermally insulated enclosure. The container insert includes a bottom panel, side panels and end panels that are interconnected by a plastic backing sheet. The side panels and end panels can be pivoted upwardly to form side walls and end walls. The plastic backing sheet covers the seams between adjacent insulation panels to provide a moisture barrier. The plastic backing sheet can also urge adjacent panels together to reduce the gap between adjacent panels and improve thermal performance.
Abstract:
A device for adsorbing water vapor from a gas stream. The device can be incorporated with an enclosure or garment in such a manner so as to enable water vapor to be adsorbed, thereby decreasing the relative humidity in the micrlimate surrounding the user. The water adsorption device is light-weight, has a high mass and volumetric energy capacity. A desiccant material is included within the water adsorption device to adsorb water vapor and a phase-change material is located in thermal communication with the desiccant to increase the loading capacity of the desiccant and maintain a cool gas stream by extracting the heat of adsorption from the desiccant.
Abstract:
The present invention relates to nanoporous dielectric films and to a process for their manufacture. Such films are useful in the production of integrated circuits. A precursor of an alkoxysilane, and low and high volatility solvents are mixed at a pH of about 2-5, raised to a pH of about 8 or above with a low volatility base and deposited on a semiconductor substrate. After exposure to atmospheric moisture, a nanoporous dielectric film is produced on the substrate.