Abstract:
A data storage device and a method for manufacturing the data storage device provide a data storage device having a superior reliability and easy fabrication. The data storage device comprises a substrate including cell and peripheral circuit regions, a first conductive line on the peripheral circuit region, a peripheral contact plug between the substrate and the first conductive line, the peripheral contact plug being in contact with the first conductive line, a second conductive line on the cell region, a plurality of data storage structures between the substrate and the second conductive line, and a wiring structure between the substrate and each of the data storage structures and between the substrate and the peripheral contact plug. The first conductive line includes a bottom surface having a position from the substrate that is lower than a position of a bottom surface of the second conductive line.
Abstract:
A semiconductor memory device includes a first insulating layer covering a substrate, a first contact plug and a second contact plug each penetrating the first insulating layer, a first data storage element disposed on the first contact plug, and a second data storage element disposed on the second contact plug. The first contact plug includes a vertically extending portion and a horizontally extending portion arranged between the vertically extending portion and the first data storage element, and the second contact plug extends substantially vertically from a top surface of the substrate. The first data storage element is laterally spaced apart from the vertically extending portion when viewed in plan view. The first data storage element is disposed on the horizontally extending portion.
Abstract:
Magnetic memory devices are provided. A magnetic memory device includes a Magnetic Tunnel Junction (MTJ) structure on a contact. Moreover, the magnetic memory device includes an insulating structure and an electrode between the MTJ structure and the contact. In some embodiments, a first contact area of the electrode with the MTJ structure is smaller than a second contact area of the insulating structure with the MTJ structure.
Abstract:
A process as shown in FIGS. 1A through 1I, or FIGS. 2A through 2I for providing first areas of gate oxide (30, 30A, 30B) on a substrate (10) having a first thickness and second adjacent areas (32, 32A, 32B) of gate oxide having a lesser thickness without the use of a N2 implantation process.
Abstract:
A first lower interconnection structure and a second lower interconnection structure are formed using a first design rule on a first region of a substrate and a second region of the substrate, respectively. A memory element is formed on the first lower interconnection structure. The memory element includes a bottom electrode, a magnetic tunnel junction and a top electrode stacked on each other. An upper conductive line and an upper interconnection line are formed using a second design rule larger than the first design rule on the first lower interconnection structure and the second lower interconnection structure, respectively. The first lower interconnection structure, the memory element and the upper conductive line are stacked on each other so that the memory element is interposed between the first lower interconnection structure and the upper conductive line.
Abstract:
A magnetic memory device is provided. The magnetic memory device includes a plurality of variable resistance devices connected to a word line, and a plurality of bit lines, each of which provides an electrical pathway between a corresponding one of the variable resistance devices and a read and write circuit. Each of the variable resistance devices includes a free layer and a pinned layer spaced apart from each other and having a tunnel barrier interposed therebetween, an assistant layer spaced apart from the tunnel barrier and having the free layer interposed therebetween, and an exchange coupling layer arranged between the free layer and the assistant layer. The exchange coupling layer has an electric polarization, which results from its ferroelectric property, and having a direction that can be changed by a voltage applied to the corresponding one of the bit lines.
Abstract:
A device, which may include a semiconductor device, may include a contact plug, a first barrier metal covering a bottom surface of the contact plug and a lower sidewall of the contact plug, such that the first barrier metal exposes an upper sidewall of the contact plug, and an insulation pattern covering the upper sidewall of the contact plug such that the insulation pattern isolates the first barrier metal from exposure. A magnetic tunnel junction pattern may cover a top surface of the contact plug. Each element of the contact plug, the first barrier metal, and the insulation pattern may be in a contact hole of a first interlayer dielectric layer.
Abstract:
A semiconductor memory device includes a cell gate dielectric layer and a cell gate electrode disposed in a gate recess region crossing a cell active portion of a substrate, first and second doped regions disposed in the cell active portion at both sides of the gate recess region, respectively, at least one interlayer insulating layer covering the substrate, a data storage element electrically connected to the second doped region through a contact plug penetrating the at least one interlayer insulating layer, a mold layer covering the data storage element, and a bit line disposed in a cell groove formed in the mold layer. The bit line is in direct contact with a top surface of the data storage element.
Abstract:
Provided is a semiconductor device including magnetic tunnel junctions, which are spaced apart from each other on a substrate, and each of which includes a free magnetic pattern, a first pinned magnetic pattern, and a tunnel barrier pattern therebetween. The semiconductor device further includes a separation structure interposed between the magnetic tunnel junctions. The separation structure includes a second pinned magnetic pattern and a first insulating pattern stacked to each other.
Abstract:
A magnetic memory device is provided. The magnetic memory device includes a plurality of variable resistance devices connected to a word line, and a plurality of bit lines, each of which provides an electrical pathway between a corresponding one of the variable resistance devices and a read and write circuit. Each of the variable resistance devices includes a free layer and a pinned layer spaced apart from each other and having a tunnel barrier interposed therebetween, an assistant layer spaced apart from the tunnel barrier and having the free layer interposed therebetween, and an exchange coupling layer arranged between the free layer and the assistant layer. The exchange coupling layer has an electric polarization, which results from its ferroelectric property, and having a direction that can be changed by a voltage applied to the corresponding one of the bit lines.