公开(公告)号：US20050134867A1

公开(公告)日：2005-06-23

申请号：US11012005

申请日：2004-12-13

Applicant: Koung-Su Shin ,  Kwang-Jun Yoon ,  Sun-Yong Choi ,  Chung-Sam Jun ,  Dong-Jin Park

Inventor： Koung-Su Shin ,  Kwang-Jun Yoon ,  Sun-Yong Choi ,  Chung-Sam Jun ,  Dong-Jin Park

IPC: H01L21/66 ,  G03F7/20 ,  G01B11/14

CPC classification number: G03F7/70616

Abstract: A system and method of measuring a distance of semiconductor patterns is provided. The system includes a microscope and a control unit. The control unit calculates standard coordinates of standard points in view-fields that include spots, spot coordinates of spots with respect to standard points, real coordinates of spots from both of the standard coordinates and spot coordinates, and finally the distance between the two spots from the first and second real coordinates. Coordinates are determined using high magnification, in conjunction with pixel counting, allowing more precise distance measurements.

Abstract translation: 提供了测量半导体图形的距离的系统和方法。 该系统包括显微镜和控制单元。 控制单元计算包括斑点，相对于标准点的点的点坐标，来自两个标准坐标和点坐标的点的实际坐标的视场中的标准点的标准坐标，以及最后两个点之间的距离 第一个和第二个实际坐标。 使用高倍率，结合像素计数确定坐标，允许更精确的距离测量。

公开(公告)号：US20070188748A1

公开(公告)日：2007-08-16

申请号：US11703095

申请日：2007-02-07

Applicant: Koung-Su Shin ,  Dong-Su Ha ,  Chung-Sam Jun

Inventor： Koung-Su Shin ,  Dong-Su Ha ,  Chung-Sam Jun

IPC: G01J3/00

CPC classification number: G01J3/10 ,  G01J3/02 ,  G01J3/0267 ,  G01J3/0291 ,  G01N21/255

Abstract: An apparatus for examining spectral characteristics of an object may include a chuck configured to support and releasably fix the object, wherein the chuck is larger than the object, a first light source assembly integral with the chuck and configured to illuminate a bottom surface of the object with light having a predetermined spectrum and intensity, and a transmission analysis unit for collecting and analyzing light transmitted through the object. The first light source assembly may include multiple and/or adjustable light sources. A second light source assembly may illuminate a top surface of the object, and a reflection analysis unit may collect resultant reflected light.

Abstract translation: 用于检查物体的光谱特性的装置可以包括配置成支撑和可释放地固定物体的卡盘，其中卡盘大于物体;第一光源组件，与卡盘一体并且被构造成照射物体的底面 具有预定的光谱和强度的光，以及用于收集和分析透过物体的光的透射分析单元。 第一光源组件可以包括多个和/或可调光源。 第二光源组件可以照亮物体的顶表面，并且反射分析单元可以收集所得到的反射光。

公开(公告)号：US07601555B2

公开(公告)日：2009-10-13

申请号：US11132352

申请日：2005-05-19

Applicant: Kwang-soo Kim ,  Koung-su Shin ,  Seung-min Choi ,  Yu-han Jeong

Inventor： Kwang-soo Kim ,  Koung-su Shin ,  Seung-min Choi ,  Yu-han Jeong

IPC: H01L21/00

CPC classification number: G06T7/0004 ,  G01R31/2831 ,  G06T2207/30148

Abstract: A wafer inspection system includes an electrical testing part to control a probe to be in contact with a pad of a wafer to perform a predetermined electrical test, a defect detecting part to detect a defect in the wafer passing through the electrical test, a defect sorting part to sort the defect detected in the defect detecting part by an in-line method, and a defective determining part to determine whether the wafer is a defective according to a sorting result of the defect sorting part. The wafer inspection system and a method thereof can determine the kinds of the defect in the wafer during a fabricating procedure, so that it is possible to instantly and correctly determine whether the die on the wafer is a defective.

Abstract translation: 晶片检查系统包括电测试部分，用于控制探针与晶片的焊盘接触以执行预定的电测试;缺陷检测部分，用于检测通过电测试的晶片中的缺陷，缺陷分类 通过在线方式对在缺陷检测部分中检测到的缺陷进行分类的部分，以及根据缺陷分类部分的分类结果确定晶片是否有缺陷的缺陷确定部分。 晶片检查系统及其方法可以在制造过程中确定晶片中的缺陷的种类，使得可以立即且正确地确定晶片上的裸片是否有缺陷。

公开(公告)号：US07280233B2

公开(公告)日：2007-10-09

申请号：US10787765

申请日：2004-02-27

Applicant: Koung-Su Shin ,  Sun-Yong Choi ,  Chung-Sam Jun ,  Dong-Chun Lee ,  Kwang-Jun Yoon

Inventor： Koung-Su Shin ,  Sun-Yong Choi ,  Chung-Sam Jun ,  Dong-Chun Lee ,  Kwang-Jun Yoon

IPC: G01B11/02 ,  G01B11/14 ,  G01B11/28 ,  G01N21/00

CPC classification number: G01N21/9503 ,  G01N21/9501 ,  G01N21/9505

Abstract: For an automatic defect inspection of an edge exposure area of a wafer, an optical unit supplies a light beam onto the edge portion of a wafer and a detection unit detects light reflected from the edge portion. The detection unit converts the detected light into an electrical signal to transmit the electrical signal to a processing unit. The processing unit analyzes the electrical signal to measure the reflectivity of the edge portion, compares the measured reflectivity with a reference reflectivity, and calculates the width of the edge exposure area. The processing unit compares the calculated width with a reference width to detect any defect in the edge exposure area.

Abstract translation: 为了对晶片的边缘曝光区域进行自动缺陷检查，光学单元将光束提供到晶片的边缘部分，并且检测单元检测从边缘部分反射的光。 检测单元将检测到的光转换为电信号，以将电信号传送到处理单元。 处理单元分析电信号以测量边缘部分的反射率，将测量的反射率与参考反射率进行比较，并计算边缘曝光区域的宽度。 处理单元将计算的宽度与参考宽度进行比较，以检测边缘曝光区域中的任何缺陷。

公开(公告)号：US07646478B2

公开(公告)日：2010-01-12

申请号：US11703095

申请日：2007-02-07

Applicant: Koung-Su Shin ,  Dong-Su Ha ,  Chung-Sam Jun

Inventor： Koung-Su Shin ,  Dong-Su Ha ,  Chung-Sam Jun

IPC: G01N21/00

CPC classification number: G01J3/10 ,  G01J3/02 ,  G01J3/0267 ,  G01J3/0291 ,  G01N21/255

Abstract: An apparatus for examining spectral characteristics of an object may include a chuck configured to support and releasably fix the object, wherein the chuck is larger than the object, a first light source assembly integral with the chuck and configured to illuminate a bottom surface of the object with light having a predetermined spectrum and intensity, and a transmission analysis unit for collecting and analyzing light transmitted through the object. The first light source assembly may include multiple and/or adjustable light sources. A second light source assembly may illuminate a top surface of the object, and a reflection analysis unit may collect resultant reflected light.

Abstract translation: 用于检查物体的光谱特性的装置可以包括配置成支撑和可释放地固定物体的卡盘，其中卡盘大于物体;第一光源组件，与卡盘一体并且被构造成照射物体的底面 具有预定的光谱和强度的光，以及用于收集和分析透过物体的光的透射分析单元。 第一光源组件可以包括多个和/或可调光源。 第二光源组件可以照亮物体的顶表面，并且反射分析单元可以收集所得到的反射光。

公开(公告)号：US07274471B2

公开(公告)日：2007-09-25

申请号：US11012005

申请日：2004-12-13

Applicant: Koung-Su Shin ,  Kwang-Jun Yoon ,  Sun-Yong Choi ,  Chung-Sam Jun ,  Dong-Jin Park

Inventor： Koung-Su Shin ,  Kwang-Jun Yoon ,  Sun-Yong Choi ,  Chung-Sam Jun ,  Dong-Jin Park

IPC: G01B11/14

CPC classification number: G03F7/70616

Abstract: A system and method of measuring a distance of semiconductor patterns is provided. The system includes a microscope and a control unit. The control unit calculates standard coordinates of standard points in view-fields that include spots, spot coordinates of spots with respect to standard points, real coordinates of spots from both of the standard coordinates and spot coordinates, and finally the distance between the two spots from the first and second real coordinates. Coordinates are determined using high magnification, in conjunction with pixel counting, allowing more precise distance measurements.

Abstract translation: 提供了测量半导体图形的距离的系统和方法。 该系统包括显微镜和控制单元。 控制单元计算包括斑点，相对于标准点的点的点坐标，来自两个标准坐标和点坐标的点的实际坐标的视场中的标准点的标准坐标，以及最后两个点之间的距离 第一个和第二个实际坐标。 使用高倍率，结合像素计数确定坐标，允许更精确的距离测量。

公开(公告)号：US20050282299A1

公开(公告)日：2005-12-22

申请号：US11132352

申请日：2005-05-19

Applicant: Kwang-soo Kim ,  Koung-su Shin ,  Seung-min Choi ,  Yu-han Jeong

Inventor： Kwang-soo Kim ,  Koung-su Shin ,  Seung-min Choi ,  Yu-han Jeong

IPC: H01L21/66 ,  G01R31/26 ,  G01R31/28 ,  G06F19/00 ,  G06T7/00

CPC classification number: G06T7/0004 ,  G01R31/2831 ,  G06T2207/30148

Abstract: A wafer inspection system includes an electrical testing part to control a probe to be in contact with a pad of a wafer to perform a predetermined electrical test, a defect detecting part to detect a defect in the wafer passing through the electrical test, a defect sorting part to sort the defect detected in the defect detecting part by an in-line method, and a defective determining part to determine whether the wafer is a defective according to a sorting result of the defect sorting part. The wafer inspection system and a method thereof can determine the kinds of the defect in the wafer during a fabricating procedure, so that it is possible to instantly and correctly determine whether the die on the wafer is a defective.

Abstract translation: 晶片检查系统包括电测试部分，用于控制探针与晶片的焊盘接触以执行预定的电测试;缺陷检测部分，用于检测通过电测试的晶片中的缺陷，缺陷分类 通过在线方式对在缺陷检测部分中检测到的缺陷进行分类的部分，以及根据缺陷分类部分的分类结果确定晶片是否有缺陷的缺陷确定部分。 晶片检查系统及其方法可以在制造过程中确定晶片中的缺陷的种类，使得可以立即且正确地确定晶片上的裸片是否有缺陷。

公开(公告)号：US06815236B2

公开(公告)日：2004-11-09

申请号：US10694882

申请日：2003-10-29

Applicant: Tae-Kyoung Kim ,  Sun-Yong Choi ,  Chung-Sam Jun ,  Kwang-Soo Kim ,  Koung-Su Shin ,  Jeong-Hyun Choi ,  Dong-Chun Lee

Inventor： Tae-Kyoung Kim ,  Sun-Yong Choi ,  Chung-Sam Jun ,  Kwang-Soo Kim ,  Koung-Su Shin ,  Jeong-Hyun Choi ,  Dong-Chun Lee

IPC: H01L2166

CPC classification number: G01N21/3563 ,  G01N21/8422

Abstract: A method of measuring a concentration of a material includes irradiating an infrared light onto a substrate having a layer including a first material and dopants, wherein the infrared light is partially absorbed by and partially transmitted through the substrate including the layer. Intensities of the infrared light absorbed in the first material and the dopants are computed according to light wave numbers by utilizing a difference between intensities of the infrared light before and after transmitting the substrate and layer and by utilizing a difference between intensities of the infrared light absorbed in the substrate and layer and absorbed in only the substrate. Concentrations of the dopants are obtained by utilizing a ratio of light wave number regions corresponding to predetermined intensities of infrared light absorbed in the dopants relative to light wave number regions corresponding to the predetermined intensity of infrared light absorbed in the first material.