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公开(公告)号：US6153505A
公开(公告)日：2000-11-28
申请号：US388300
申请日：1999-09-01
CPC分类号： B23K3/0638 , H01L21/4853 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/128
摘要： Disclosed is a solder injection mold apparatus and method for providing solder balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit ends to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which the substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutually compatible with respect to CTE when exposed to temperatures of molten solder.
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公开(公告)号：US6029882A
公开(公告)日：2000-02-29
申请号：US67904
申请日：1998-04-27
CPC分类号： B23K3/0638 , H01L21/4853 , H05K3/3468 , B23K2201/40 , H01L2224/11003 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/10253 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/128
摘要： Disclosed is a solder injection mold apparatus and method for providing solder balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit ends to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which the substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutually compatible with respect to CTE when exposed to temperatures of molten solder.
摘要翻译： 公开了一种使用塑料球栅阵列（PBGA）中的焊料注射模具装置向印刷电路板基板提供焊球的焊料注射模具装置和方法。 焊接模具通孔在入口处和出口端被倒角，以帮助接收熔融焊料，并且将焊球形成和转移到衬底上的焊盘上。 在模具的第二主表面，即面向衬底的一侧设置盲孔，以容纳安装在其上的电子部件。 焊球在仅需要一个回流的过程中输送和冶金地附着在焊盘上，留下通孔清洁焊料并且模具准备好重新使用。 选择基材，模具和基板的材料，当暴露于熔融焊料的温度时，被选择为不被焊料润湿并且相对于CTE相互兼容。
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3.发明授权
公开(公告)号：US5913985A
公开(公告)日：1999-06-22
申请号：US907790
申请日：1997-08-08
IPC分类号： H01L21/673 , B08B3/04 , B08B3/10
CPC分类号： H01L21/67333 , H01L21/67336 , Y10S134/902
摘要： A fixture for securing a circuit chip substrate having on one side solder connections during wet processing using a pulse jet delivery cleaning system for removing solder flux residue on the solder connections. The fixture comprises a frame of sufficient size to at least partially surround and contact the substrate on a first side and a lid cooperating with the frame to at least partially cover the substrate on a second side containing the solder connections. A resilient polymeric separator is disposed on the lid and faces the substrate for contacting the substrate second side containing the solder connections. There are also openings in the frame for permitting circulation of a cleaner to contact the second side of the substrate.
摘要翻译： 一种固定电路芯片基板的固定装置，在使用脉冲喷射输送清洁系统进行湿法处理时，在一侧焊接连接，以消除焊料连接上的焊剂残留。 夹具包括足够尺寸的框架，以至少部分地围绕和接触与框架配合的第一侧面上的基板并且在与包含焊接连接件的第二侧上至少部分地覆盖基板。 弹性聚合物分离器设置在盖上并面向基板，用于接触包含焊料连接的基板第二侧。 在框架中还有开口，用于允许清洁器循环以接触基板的第二面。
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公开(公告)号：US06708872B2
公开(公告)日：2004-03-23
申请号：US10107985
申请日：2002-03-27
IPC分类号： B23K3102
CPC分类号： B23K3/0638 , B23K2101/42 , H05K3/3468 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , H05K2203/128
摘要： There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.
摘要翻译： 提供了将焊料施加到基板表面上的元件的方法。 该方法包括以下步骤：（a）将模具放置在表面上，其中模具包括含有焊料的导管，和（b）将焊料加热至熔融状态，使得焊料从导管流到元件上。 导管相对于表面具有两度的水平自由度，使得当焊料处于熔融状态时，导管变得基本上与元件对齐。 还提供了一种用于将焊料施加到衬底表面上的元件的系统。
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公开(公告)号：US06425518B1
公开(公告)日：2002-07-30
申请号：US09912845
申请日：2001-07-25
IPC分类号： B23K3102
CPC分类号： B23K3/0638 , B23K2101/42 , H05K3/3468 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , H05K2203/128
摘要： There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.
摘要翻译： 提供了将焊料施加到基板表面上的元件的方法。 该方法包括以下步骤：（a）将模具放置在表面上，其中模具包括含有焊料的导管，和（b）将焊料加热至熔融状态，使得焊料从导管流到元件上。 导管相对于表面具有两度的水平自由度，使得当焊料处于熔融状态时，导管变得基本上与元件对齐。 还提供了一种用于将焊料施加到衬底表面上的元件的系统。
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6.发明授权Solder reflow type electrical apparatus packaging having integrated circuit and discrete components 失效具有集成电路和分立元件的焊接回流型电器包装公开(公告)号：US06910615B2
公开(公告)日：2005-06-28
申请号：US10400944
申请日：2003-03-27
IPC分类号： B23K1/00 , B23K1/008 , H01L21/56 , H01L21/60 , H01L21/66 , H01L21/68 , H05K3/22 , H05K3/26 , H05K3/34 , B23K31/02 , B23K37/00
CPC分类号： H01L21/6835 , B23K1/0016 , B23K1/008 , H01L21/563 , H01L22/14 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13111 , H01L2224/16 , H01L2224/73203 , H01L2224/8121 , H01L2224/81815 , H01L2224/8191 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/3011 , H05K3/225 , H05K3/26 , H05K3/341 , H05K3/3463 , H05K2203/047 , H05K2203/1476 , H05K2203/162 , H05K2203/176 , Y02P70/613 , H01L2224/05599
摘要： In a solder reflow type building of modular electrical apparatus involving integrated circuit and discrete components, fabrication operations are arranged to include the providing of a general type series of steps for each component element involving a reflow or joining step at the highest joining temperature, immediately followed by a solder flux cleaning step and immediately followed by a testing of the entire module constructed thus far. There is provided a further specific type operation for each different type of component element that includes the providing of a loop for the introduction of a replacement for any broken discrete component with joining being achieved with use of a lower fusion temperature solder, flux cleaning and testing at each joining followed by reinsertion into the module. There is further provided an operation at the encapsulation stage of the module building for introducing underfill between the component and supporting carrier.
摘要翻译： 在涉及集成电路和分立组件的模块化电气设备的回流焊接建筑物中，制造操作被布置为包括为在最高接合温度下涉及回流或接合步骤的每个部件元件提供一般类型的一系列步骤，紧接着 通过焊剂清洁步骤，并立即进行到目前为止构成的整个模块的测试。 为每个不同类型的元件提供了另外的特定类型的操作，包括提供一个环，用于引入任何破损的分立元件的替换，使用较低的熔融温度焊料，焊剂清洁和测试 在每次连接之后重新插入模块。 在模块建筑物的封装阶段进一步提供了在组件和支撑载体之间引入底部填充物的操作。
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7.发明授权公开(公告)号：US06569252B1
公开(公告)日：2003-05-27
申请号：US09609283
申请日：2000-06-30
IPC分类号： C23G502
CPC分类号： H01L21/02063 , B23K35/025 , C11D7/263 , C11D11/0047 , C11D11/007 , C23G5/032 , H05K3/1233 , H05K3/26 , Y10S134/902
摘要： A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.
摘要翻译： 清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。
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公开(公告)号：US6016947A
公开(公告)日：2000-01-25
申请号：US954988
申请日：1997-10-21
申请人： Timothy W. Donahue , Ellyn M. Ingalls , Chon Cheong Lei , Wai Mon Ma , Horatio Quinones , Charles L. Reynolds, Jr. , Peter J. Brofman
发明人： Timothy W. Donahue , Ellyn M. Ingalls , Chon Cheong Lei , Wai Mon Ma , Horatio Quinones , Charles L. Reynolds, Jr. , Peter J. Brofman
CPC分类号： H05K3/3457 , H01L22/12 , H05K1/0269 , H05K2203/0113 , H05K2203/0338 , H05K2203/163
摘要： A non-destructive method for identifying off-composition solder columns of for example, a ceramic column grid array. The method is performed at the ceramic module level prior to card assembly to avoid costly loss or rework post card assembly. The assembly of solder columns on a substrate is heated to a temperature below the melting temperature of pure-composition solder and above the temperature of attachment of a solder column to an organic board. Heating the assembly produces visually detectable changes characteristic of off-composition solder which are used for identifying which solder columns are composed of off-composition solder.
摘要翻译： 用于识别例如陶瓷柱格栅阵列的组合焊料柱的非破坏性方法。 该方法在卡组件之前在陶瓷模块级执行，以避免卡片组装后的昂贵损失或返工。 衬底上的焊料柱的组装被加热到低于纯组合焊料的熔化温度并高于焊料柱附着到有机板的温度的温度。 加热组件产生视觉上可检测到的组成外焊料的特性，其用于鉴定哪些焊料柱由脱组合的焊料组成。
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9.发明授权公开(公告)号：US06742530B2
公开(公告)日：2004-06-01
申请号：US10294236
申请日：2002-11-14
IPC分类号： B08B308
CPC分类号： H01L21/02063 , B23K35/025 , C11D7/263 , C11D11/0047 , C11D11/007 , C23G5/032 , H05K3/1233 , H05K3/26 , Y10S134/902
摘要： A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.
摘要翻译： 清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。
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