公开(公告)号：US07806312B2

公开(公告)日：2010-10-05

申请号：US11551754

申请日：2006-10-23

申请人： Lannie R. Bolde ,  James H. Covell ,  Mark W. Kapfhammer

发明人： Lannie R. Bolde ,  James H. Covell ,  Mark W. Kapfhammer

IPC分类号： B23K1/018

CPC分类号： H01L21/67144 ,  B23K1/018

摘要： A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.

摘要翻译： 公开了一种用于将芯片从衬底上分离的方法和结构，其将剪切力的传递延迟到芯片，直到将芯片附接到衬底的连接器足够柔软，使得剪切力的传递不会损坏芯片的连接器。 更具体地，剪切力由双金属盘产生，当加热时，双金属盘被转化为剪切力。 剪切力由延迟装置延迟，直到将芯片连接到基板的连接器足够柔软，使得施加剪切力将使芯片与基板分离而不损坏芯片的连接器。 该延迟装置包括物理间隙，该物理间隙可以被调整以控制何时施加剪切力到芯片。

公开(公告)号：US06276596B1

公开(公告)日：2001-08-21

申请号：US09649487

申请日：2000-08-28

申请人： Peter A. Gruber ,  Lannie R. Bolde ,  Guy P. Brouillette ,  James H. Covell ,  David Danovitch ,  Chon C. Lei

发明人： Peter A. Gruber ,  Lannie R. Bolde ,  Guy P. Brouillette ,  James H. Covell ,  David Danovitch ,  Chon C. Lei

IPC分类号： B23K3102

CPC分类号： H05K3/3468 ,  B23K3/0638 ,  B23K35/0222 ,  B23K2101/40 ,  H01L21/4846 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K2203/074 ,  H05K2203/128

摘要： A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.

摘要翻译： 公开了一种将多种多合金焊料柱连接到电子基板的方法以及通过这种方法形成的结构。 在该方法中，首先通过注射成型的焊接技术填充配备有多个空腔的模板，其中高温焊料形成多个焊料柱。 然后通过利用设置在提取板中的多个位移装置将模板夹在提取板和转印板之间，以将多个焊料柱从模板移位成装配在转印板中的多个孔。 传递板中的多个空腔各具有直的开口和扩口的开口。 然后用扩散的开口填充低温焊膏以封装高温焊料柱的一端。 然后在低于高温焊料的熔融温度的温度下，将低温焊膏在电子基板上的导电焊盘的顶部上进行退火，以在焊料柱和导电焊盘之间形成接合。

公开(公告)号：US5971058A

公开(公告)日：1999-10-26

申请号：US876140

申请日：1997-06-13

申请人： Lannie R. Bolde ,  James H. Covell, II

发明人： Lannie R. Bolde ,  James H. Covell, II

IPC分类号： B23K3/06 ,  H05K3/34 ,  B22D33/04

CPC分类号： B23K3/0607 ,  H05K3/3457 ,  B23K2201/40 ,  H05K2203/0113 ,  H05K2203/1545

摘要： An apparatus and method are provided for continuously injecting molten solder into a plurality of molds for transfer of the formed solder mounds to electronic devices such as multilayer ceramic packages. A conventional injection molding apparatus is employed with a specially designed apparatus for forming the molds and preferably with a specially designed mold to provide a continuous molding process. The apparatus is preferably of a U-shaped configuration whereby molds are advanced under the molten solder reservoir and injection head by a preceding mold in the apparatus. The urging action of the preceding mold on the succeeding mold and, preferably in conjunction with the preferred mold design, enables a continuous method and apparatus for injecting molten solder into a plurality of molds. The preferred mold design utilizes an upper plate having mold opening, and a lower substrate or backing plate, with the length and width of the upper plate being slightly longer than the length and width of the lower substrate or late.

摘要翻译： 提供了一种装置和方法，用于将熔融焊料连续地注入多个模具中，以将形成的焊料块转移到电子器件如多层陶瓷封装。 常规的注射成型装置采用专门设计的用于形成模具的装置，优选地具有专门设计的模具以提供连续的模制工艺。 该装置优选为U形构造，由此模具在熔融的焊料储存器和注射头的前方通过前述的模具在装置中前进。 前一模具在后续模具上的推动作用，优选结合优选的模具设计，能够实现将熔融焊料注入多个模具中的连续方法和设备。 优选的模具设计利用具有模具开口的上板和下基板或背板，上板的长度和宽度比下基板的长度和宽度稍长，或较晚。

公开(公告)号：US06186216B1

公开(公告)日：2001-02-13

申请号：US09208791

申请日：1998-12-10

申请人： Lannie R. Bolde ,  James H. Covell II

发明人： Lannie R. Bolde ,  James H. Covell II

IPC分类号： B22D2900

CPC分类号： H01L21/4853 ,  H05K3/3457

摘要： An apparatus for removing a casting comprising an electronic package substrate and an array of cast solder columns having a column pitch of less than 2 mm extending therefrom from the corresponding openings of a mold. The apparatus includes a removable mold containing a plurality of openings for casting a corresponding array of solder columns and bonding the columns to the underside of an electronic package substrate. A stripper plate for receiving the mold contains openings through a thickness thereof corresponding to at least some of the openings in the mold. An ejector assembly including ejector pins having a length at least as long as the sum of the thickness of the stripper plate at the stripper plate openings and the thickness of the mold at the column casting openings, and corresponding to openings in the mold and the stripper plate. The mold and the ejector assembly are relatively movable toward each other to cause at least some of the ejector pins to engage cast columns in the mold openings and push the engaged cast columns and substrate out of the mold. The stripper plate is movable relative to the ejector pins away from the ejector assembly after the ejector pins push the cast columns and substrate out of the mold.

摘要翻译： 一种用于移除铸件的装置，包括电子封装衬底和从模具的相应开口延伸的具有小于2mm的柱间距的铸造焊料柱阵列。 该装置包括一个可移除的模具，该模具包含多个用于铸造相应阵列的焊料柱的开口，并将该柱结合到电子封装衬底的下侧。 用于接收模具的剥离板包含通过其对应于模具中的至少一些开口的厚度的开口。 一种喷射器组件，其包括具有至少等于剥离板开口处的剥离板的厚度和柱形铸造开口处的模具的厚度的总和的长度的喷射销，并且对应于模具和剥离器中的开口 盘子。 模具和喷射器组件可相对于彼此相对移动，以使得至少一些顶针与模具开口中的铸造柱接合并将接合的铸造柱和基底推出模具。 脱模板在推出销将铸造柱和基材推出模具之后相对于顶出销定位离开喷射器组件是可移动的。

公开(公告)号：US5982038A

公开(公告)日：1999-11-09

申请号：US850092

申请日：1997-05-01

申请人： Hilton T. Toy ,  Lannie R. Bolde ,  James H. Covell, II ,  David L. Edwards ,  Lewis S. Goldmann ,  Peter A. Gruber

发明人： Hilton T. Toy ,  Lannie R. Bolde ,  James H. Covell, II ,  David L. Edwards ,  Lewis S. Goldmann ,  Peter A. Gruber

IPC分类号： H01L23/02 ,  H01L23/10 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/10 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/16152

摘要： The present invention relates generally to a new scheme of providing a seal for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection.For the preferred embodiment the multi-layer metallic seal is a two layer, solder structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder structure has a thick high melting point temperature region that is attached to a cap, and a thin interconnecting region of lower melting point temperature region for sealing the substrate to the cap.

摘要翻译： 本发明一般涉及为半导体衬底和芯片载体提供密封的新方案。 更具体地，本发明包括使用多层金属密封件来为芯片载体上的芯片提供保护的结构和方法。 这种多层金属密封提供增强的气密寿命和环境保护。 对于优选实施例，多层金属密封件是用于为模块产生低成本，高可靠性气密密封的两层焊料结构。 这种焊料结构具有连接到盖的厚的高熔点温度区域和用于将衬底密封到帽的较低熔点温度区域的薄互连区域。

公开(公告)号：US5821161A

公开(公告)日：1998-10-13

申请号：US850091

申请日：1997-05-01

申请人： James H. Covell, II ,  Lannie R. Bolde ,  David L. Edwards ,  Lewis S. Goldmann ,  Peter A. Gruber ,  Hilton T. Toy

发明人： James H. Covell, II ,  Lannie R. Bolde ,  David L. Edwards ,  Lewis S. Goldmann ,  Peter A. Gruber ,  Hilton T. Toy

IPC分类号： H01L21/50 ,  H01L23/10 ,  H01L21/44

CPC分类号： H01L23/10 ,  H01L21/50 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/163

摘要： The present invention relates generally to a new scheme of providing a seal for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal is a two layer, solder structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder structure has a thick high melting point temperature region that is attached to a cap, and a thin interconnecting region of lower melting point temperature region for sealing the substrate to the cap.

摘要翻译： 本发明一般涉及为半导体衬底和芯片载体提供密封的新方案。 更具体地，本发明包括使用多层金属密封件来为芯片载体上的芯片提供保护的结构和方法。 这种多层金属密封提供增强的气密寿命和环境保护。 对于优选实施例，多层金属密封件是用于为模块产生低成本，高可靠性气密密封的两层焊料结构。 这种焊料结构具有连接到盖的厚的高熔点温度区域和用于将衬底密封到帽的较低熔点温度区域的薄互连区域。

公开(公告)号：US06915563B2

公开(公告)日：2005-07-12

申请号：US10604150

申请日：2003-06-27

申请人： Lannie R. Bolde ,  Christopher Wayne Whittaker

发明人： Lannie R. Bolde ,  Christopher Wayne Whittaker

IPC分类号： B23P19/00 ,  H01L21/00 ,  H01R43/00

CPC分类号： H01L21/67144 ,  Y10T29/49117 ,  Y10T29/49139 ,  Y10T29/49822 ,  Y10T29/53257 ,  Y10T29/53274 ,  Y10T29/53283

摘要： An apparatus for removing attached die having a pivoting means, having a pivot point and first and second sides, the pivot point having a corresponding first y coordinate, the first and second sides positioned opposite to one another, said pivoting means capable of attaching to a die carrier. The apparatus also having a shaft attached to the first side of the pivoting means. The apparatus further having a counterweight attached to the second side of the pivoting means. The apparatus lastly having a clamping means capable of attaching to at least one die, the die having a corresponding second y coordinate, wherein the first y coordinate is greater than the second y coordinate.

摘要翻译： 一种用于去除连接的模具的装置，具有枢转装置，具有枢转点和第一和第二侧面，所述枢轴点具有对应的第一y坐标，所述第一和第二侧面彼此相对定位，所述枢转装置能够附接到 模具载体 该装置还具有附接到枢转装置的第一侧的轴。 该装置还具有附接到枢转装置的第二侧的配重。 该装置最后具有能够附接到至少一个模具的夹紧装置，该模具具有对应的第二y坐标，其中第一y坐标大于第二y坐标。

公开(公告)号：US06182356B2

公开(公告)日：2001-02-06

申请号：US08977523

申请日：1997-11-24

申请人： Lannie R. Bolde

发明人： Lannie R. Bolde

IPC分类号： B23P1920

CPC分类号： H01L21/67144 ,  B23K3/0623 ,  B23K2101/40 ,  H05K3/3478 ,  Y10T29/49895 ,  Y10T29/53535

摘要： A method and apparatus for loading solder balls into a mold. Solder balls are loaded into a reservoir having multiple exit ports. A removable mold is fitted into the apparatus and the reservoir is passed across the top of the mold while solder balls are fed into cavities in the mold. After the reservoir has advanced across the mold and the mold cavities are filled with solder balls, the reservoir is reset as a roller is simultaneously guided across the mold to seat the solder balls firmly within the mold. Alternatively, the roller may be applied to the solder balls while the reservoir advances across the mold, or both as the the reservoir is advanced and when it is returned to its original position.

摘要翻译： 一种用于将焊球加载到模具中的方法和装置。 焊球被装载到具有多个出口的储存器中。 将可移除的模具装配到装置中，并且将储存器穿过模具的顶部，同时将焊球进给到模具中的空腔中。 在储存器已经推进穿过模具并且模具腔充满焊球之后，当辊同时被引导穿过模具以将焊球牢固地安置在模具内时，储存器被复位。 或者，当储存器前进并且当其返回到其初始位置时，可以将储存器推进到模具上，或者两者都可以将滚筒施加到焊球。

公开(公告)号：US06888363B1

公开(公告)日：2005-05-03

申请号：US10710223

申请日：2004-06-28

申请人： Lannie R. Bolde ,  David C. Olson

发明人： Lannie R. Bolde ,  David C. Olson

IPC分类号： G01R31/26

CPC分类号： G01R31/2891

摘要： A system for burn-in testing of integrated circuits employs a cooling module with an aperture that accommodates a standard size holder for various chips, the holder being placed in the mouth of the aperture, in contact with a flexible seal. When the module is raised to make contact from below with a socket on a test board, the seal confines the cooling fluid and contacts on the upper surface of the holder are pressed against a set of corresponding contacts on the test board.

摘要翻译： 用于集成电路的老化测试的系统采用具有孔的冷却模块，其容纳用于各种芯片的标准尺寸保持器，所述保持器放置在孔的口中，与柔性密封件接触。 当模块升高以从下方与测试板上的插座接触时，密封件限制冷却流体，并且保持器的上表面上的触点被压在测试板上的一组对应的触点上。

公开(公告)号：US06360940B1

公开(公告)日：2002-03-26

申请号：US09709092

申请日：2000-11-08

申请人： Lannie R. Bolde ,  James Hennekens ,  Gregory M. Johnson ,  David Olson

发明人： Lannie R. Bolde ,  James Hennekens ,  Gregory M. Johnson ,  David Olson

IPC分类号： B23K1018

CPC分类号： H01L21/67144 ,  B23K1/018 ,  H01L21/67253

摘要： Preferred embodiments for methods of removing an integrated circuit (“IC”) from a substrate, where the IC is attached to the substrate by multiple solder connections are disclosed. One preferred embodiment of the inventive methods provides the steps of heating the IC and substrate to the reflow temperature for the solder connections and pulling the IC from the substrate by means of a vacuum force. Another preferred embodiment of the inventive method provides the step of shearing the IC from the substrate after the substrate and IC are heated, but before solder reflow temperature has been reached, and where the shearing force may be programmed through a computer controlled servomotor. Preferred embodiments of certain apparatus applying the inventive methods for removing an integrated circuit from a substrate are also disclosed. One preferred embodiment of the inventive apparatus includes a vented pallet to hold the substrate and IC and through which the vacuum force is applied to pull the IC from the substrate without the use of physical clamping or contact forces applied to the substrate or IC. In a further preferred embodiment of the inventive apparatus, shear elements are provided and used with a programmable servomotor for precisely controlling the forces applied to the substrate and IC as a function of time, temperature and translational distance.

摘要翻译： 公开了用于通过多个焊接连接将集成电路附接到衬底的衬底去除集成电路（“IC”）的方法的优选实施例。 本发明方法的一个优选实施例提供了将IC和衬底加热至用于焊料连接的回流温度并通过真空力将IC从衬底拉出的步骤。 本发明方法的另一优选实施例提供了在衬底和IC被加热之后但在达到焊锡回流温度之前以及剪切力可以通过计算机控制的伺服电动机编程的情况下从衬底剪切IC的步骤。 还公开了应用本发明的从基板去除集成电路的方法的某些设备的优选实施例。 本发明装置的一个优选实施例包括一个通风的托盘，用于保持基板和IC，并且通过其施加真空力以将IC从基板拉出，而不用施加到基板或IC上的物理夹紧或接触力。 在本发明装置的另一优选实施例中，提供剪切元件并与可编程伺服电机一起使用，用于根据时间，温度和平移距离精确控制施加到基板和IC的力。