公开(公告)号：US20120061705A1

公开(公告)日：2012-03-15

申请号：US13229210

申请日：2011-09-09

Applicant: Lenora M. Toscano ,  Ernest Long ,  Witold Paw ,  Donna M. Kologe ,  Katsutsugu Koyasu ,  Keisuke Nishu

Inventor： Lenora M. Toscano ,  Ernest Long ,  Witold Paw ,  Donna M. Kologe ,  Katsutsugu Koyasu ,  Keisuke Nishu

IPC: H01L33/46 ,  B23K31/02 ,  B32B15/04 ,  B05D5/12

CPC classification number: B23K1/203 ,  B23K1/0012 ,  B23K2101/42 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/34 ,  C23C18/36 ,  C23C18/54 ,  H01L33/60 ,  H01L2933/0025 ,  Y10T428/12896

Abstract: A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications.

Abstract translation: 一种用于处理金属表面以减少其上的腐蚀和/或增加处理表面的反射率的方法，所述方法包括：a）用化学镀镍溶液电镀金属表面; 然后b）在镀镍的化学镀面上浸镀银，从而基本上防止金属表面的腐蚀和/或镀银表面的反射率得到显着提高。 该处理方法可用于增加金属表面的可焊性，例如在电子封装应用中。

公开(公告)号：US06773757B1

公开(公告)日：2004-08-10

申请号：US10412932

申请日：2003-04-14

Applicant: Ronald Redline ,  David Angelone ,  Steven A. Castaldi ,  Lenora M Toscano

Inventor： Ronald Redline ,  David Angelone ,  Steven A. Castaldi ,  Lenora M Toscano

IPC: B05D136

CPC classification number: C23C18/42 ,  B05D1/18 ,  B05D3/0254 ,  B05D7/14 ,  B05D2202/40 ,  H05K3/244 ,  H05K3/282 ,  H05K2201/0769

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion or electroless silver plate prior to soldering, after which immersion silver plate is treated with an alkaline polymer coating comprising aqueous vinyl polymers, aqueous acrylic polymers, anti-fungal agents and a benzotriazole or benzimidazole compound to produce a deposit that is resistant to electromigration and that provides an anti-tarnish and anti-corrosion coating on the surface.

Abstract translation: 公开了一种用于增强金属表面的可焊性的方法，其中金属表面在焊接之前镀有浸渍或无电镀银板，然后用含有乙烯基聚合物的水性丙烯酸聚合物的含水聚合物涂层处理浸渍银板， 抗真菌剂和苯并三唑或苯并咪唑化合物，以产生耐电迁移的沉积物，并且在表面上提供抗晦暗和防腐蚀涂层。

公开(公告)号：US07631798B1

公开(公告)日：2009-12-15

申请号：US12244136

申请日：2008-10-02

Applicant: Ernest Long ,  Lenora M. Toscano ,  Paul Romaine ,  Colleen McKirryher ,  Donna M. Kologe ,  Steven A. Castaldi ,  Carl P. Steinecker

Inventor： Ernest Long ,  Lenora M. Toscano ,  Paul Romaine ,  Colleen McKirryher ,  Donna M. Kologe ,  Steven A. Castaldi ,  Carl P. Steinecker

IPC: B23K35/24 ,  B23K35/36 ,  B05D5/12

CPC classification number: H05K3/282 ,  B23K35/3006 ,  B23K35/3612 ,  C23C18/1204 ,  C23C18/1601 ,  C23C18/1689 ,  C23C18/1824 ,  C23C18/42 ,  C23C18/54 ,  H05K3/244

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.

Abstract translation: 公开了一种用于增强金属表面的可焊性的方法，其中金属表面在焊接之前镀有银板，该浸渍银板用包含巯基取代或硫取代的硅烷化合物的添加剂处理。 优选的后处理包括3-巯基丙基三甲氧基硅烷和/或3-氧羰基硫基-1-丙基三乙氧基硅烷。

公开(公告)号：US20120061710A1

公开(公告)日：2012-03-15

申请号：US12879672

申请日：2010-09-10

Applicant: Lenora M. Toscano ,  Ernest Long ,  Witold Paw ,  Donna M. Kologe ,  Katsutsugu Koyasu ,  Keisuke Nishu

Inventor： Lenora M. Toscano ,  Ernest Long ,  Witold Paw ,  Donna M. Kologe ,  Katsutsugu Koyasu ,  Keisuke Nishu

IPC: H01L33/62 ,  B05D5/12

CPC classification number: B23K1/203 ,  B23K1/0012 ,  B23K2101/42 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/34 ,  C23C18/36 ,  C23C18/54 ,  H01L33/60 ,  H01L2933/0025 ,  Y10T428/12896

Abstract: A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications.

公开(公告)号：US20090123656A1

公开(公告)日：2009-05-14

申请号：US11983982

申请日：2007-11-13

Applicant: Ernest Long ,  Andrew Krol ,  Lenora M. Toscano ,  Steven A. Castaldi

Inventor： Ernest Long ,  Andrew Krol ,  Lenora M. Toscano ,  Steven A. Castaldi

IPC: B05D1/02 ,  B32B9/04 ,  B05D1/18 ,  C04B9/02

CPC classification number: H05K3/282 ,  B23K35/3613 ,  C23C22/40 ,  C23F11/10 ,  C23F11/161 ,  C23F11/173 ,  H05K2203/121 ,  H05K2203/122

Abstract: A composition for inhibiting the galvanic corrosion of printed circuit boards. The corrosion resistant coating composition may be applied to the printed circuit board to reduce corrosion and to shut down the chemical mechanism for galvanic corrosion so that corrosion protection of the product is achieved. The corrosion resistant coating composition comprises a) a mercaptan; b) an ethoxylated alcohol; and c) at least one metal species selected from the group consisting of molybdates, tungstates, vanadataes, zirconium, cobalt.

Abstract translation: 一种用于抑制印刷电路板电偶腐蚀的组合物。 可以将耐腐蚀涂料组合物施加到印刷电路板上以减少腐蚀并关闭用于电镀腐蚀的化学机构，从而实现产品的防腐蚀。 耐腐蚀涂料组合物包含：a）硫醇; b）乙氧基化醇; 和c）选自钼酸盐，钨酸盐，钒化物，锆，钴中的至少一种金属物质。

公开(公告)号：US20120061698A1

公开(公告)日：2012-03-15

申请号：US13302362

申请日：2011-11-22

Applicant: Lenora M. Toscano ,  Ernest Long ,  Witold Paw ,  Donna M. Kologe ,  Katsutsugu Koyasu ,  Keisuke Nishu

Inventor： Lenora M. Toscano ,  Ernest Long ,  Witold Paw ,  Donna M. Kologe ,  Katsutsugu Koyasu ,  Keisuke Nishu

IPC: H01L33/08 ,  H01L33/40 ,  B05D3/00

CPC classification number: B23K1/203 ,  B23K1/0012 ,  B23K2101/42 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/36 ,  C23C18/54 ,  H01L33/60 ,  H01L2933/0025

Abstract: A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications and in manufacturing light emitting diodes (LEDs).

Abstract translation: 一种用于处理金属表面以减少其上的腐蚀和/或增加处理表面的反射率的方法，所述方法包括：a）用化学镀镍溶液电镀金属表面; 然后b）在镀镍的化学镀面上浸镀银，从而基本上防止金属表面的腐蚀和/或镀银表面的反射率得到显着提高。 该处理方法对于增加金属表面的可焊性是有用的，例如在电子封装应用和制造发光二极管（LED）中。