公开(公告)号：US07416763B2

公开(公告)日：2008-08-26

申请号：US10870671

申请日：2004-06-16

申请人： Yuichi Kanda ,  Takashi Abe ,  Atsushi Tanaka ,  Keisuke Nishu

发明人： Yuichi Kanda ,  Takashi Abe ,  Atsushi Tanaka ,  Keisuke Nishu

IPC分类号： B05D1/36 ,  B05D7/00

CPC分类号： H05K3/388 ,  H05K3/225 ,  H05K2201/0329 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coating within any pinhole defects, and effectively filling the defects. A metal film is then formed on top of the base metal film using an electroplating process, thus forming a metal wet plating layer.

摘要翻译： 使用干电镀法在塑料膜的表面上形成贱金属膜的方法，然后使含有有机单体的液体与贱金属膜接触，由此选择性地形成导电有机聚合物涂层 任何针孔缺陷，有效填补缺陷。 然后使用电镀工艺在基底金属膜的顶部上形成金属膜，从而形成金属湿镀层。

公开(公告)号：US20050097735A1

公开(公告)日：2005-05-12

申请号：US10870671

申请日：2004-11-01

申请人： Yuichi Kanda ,  Takashi Abe ,  Atsushi Tanaka ,  Keisuke Nishu

发明人： Yuichi Kanda ,  Takashi Abe ,  Atsushi Tanaka ,  Keisuke Nishu

IPC分类号： C23C18/16 ,  C23C18/20 ,  C23C28/00 ,  C25D5/34 ,  C25D5/56 ,  C25D7/00 ,  H05K3/00 ,  H05K3/14 ,  H05K3/22 ,  H05K3/38 ,  H01R43/00 ,  H05K3/02

CPC分类号： H05K3/388 ,  H05K3/225 ,  H05K2201/0329 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coating within any pinhole defects, and effectively filling the defects. A metal film is then formed on top of the base metal film using an electroplating process, thus forming a metal wet plating layer.

摘要翻译： 使用干电镀法在塑料膜的表面上形成贱金属膜的方法，然后使含有有机单体的液体与贱金属膜接触，由此选择性地形成导电有机聚合物涂层 任何针孔缺陷，有效填补缺陷。 然后使用电镀工艺在基底金属膜的顶部上形成金属膜，从而形成金属湿镀层。

公开(公告)号：US20120061698A1

公开(公告)日：2012-03-15

申请号：US13302362

申请日：2011-11-22

申请人： Lenora M. Toscano ,  Ernest Long ,  Witold Paw ,  Donna M. Kologe ,  Katsutsugu Koyasu ,  Keisuke Nishu

发明人： Lenora M. Toscano ,  Ernest Long ,  Witold Paw ,  Donna M. Kologe ,  Katsutsugu Koyasu ,  Keisuke Nishu

IPC分类号： H01L33/08 ,  H01L33/40 ,  B05D3/00

CPC分类号： B23K1/203 ,  B23K1/0012 ,  B23K2101/42 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/36 ,  C23C18/54 ,  H01L33/60 ,  H01L2933/0025

摘要： A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications and in manufacturing light emitting diodes (LEDs).

摘要翻译： 一种用于处理金属表面以减少其上的腐蚀和/或增加处理表面的反射率的方法，所述方法包括：a）用化学镀镍溶液电镀金属表面; 然后b）在镀镍的化学镀面上浸镀银，从而基本上防止金属表面的腐蚀和/或镀银表面的反射率得到显着提高。 该处理方法对于增加金属表面的可焊性是有用的，例如在电子封装应用和制造发光二极管（LED）中。

公开(公告)号：US20120061710A1

公开(公告)日：2012-03-15

申请号：US12879672

申请日：2010-09-10

申请人： Lenora M. Toscano ,  Ernest Long ,  Witold Paw ,  Donna M. Kologe ,  Katsutsugu Koyasu ,  Keisuke Nishu

发明人： Lenora M. Toscano ,  Ernest Long ,  Witold Paw ,  Donna M. Kologe ,  Katsutsugu Koyasu ,  Keisuke Nishu

IPC分类号： H01L33/62 ,  B05D5/12

CPC分类号： B23K1/203 ,  B23K1/0012 ,  B23K2101/42 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/34 ,  C23C18/36 ,  C23C18/54 ,  H01L33/60 ,  H01L2933/0025 ,  Y10T428/12896

摘要： A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications.

公开(公告)号：US20120061705A1

公开(公告)日：2012-03-15

申请号：US13229210

申请日：2011-09-09

申请人： Lenora M. Toscano ,  Ernest Long ,  Witold Paw ,  Donna M. Kologe ,  Katsutsugu Koyasu ,  Keisuke Nishu

发明人： Lenora M. Toscano ,  Ernest Long ,  Witold Paw ,  Donna M. Kologe ,  Katsutsugu Koyasu ,  Keisuke Nishu

IPC分类号： H01L33/46 ,  B23K31/02 ,  B32B15/04 ,  B05D5/12

CPC分类号： B23K1/203 ,  B23K1/0012 ,  B23K2101/42 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/34 ,  C23C18/36 ,  C23C18/54 ,  H01L33/60 ,  H01L2933/0025 ,  Y10T428/12896

摘要： A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications.

摘要翻译： 一种用于处理金属表面以减少其上的腐蚀和/或增加处理表面的反射率的方法，所述方法包括：a）用化学镀镍溶液电镀金属表面; 然后b）在镀镍的化学镀面上浸镀银，从而基本上防止金属表面的腐蚀和/或镀银表面的反射率得到显着提高。 该处理方法可用于增加金属表面的可焊性，例如在电子封装应用中。

公开(公告)号：US20080023218A1

公开(公告)日：2008-01-31

申请号：US11726992

申请日：2007-03-23

申请人： Keisuke Nishu ,  Morio Iijima ,  Naomi Ando

发明人： Keisuke Nishu ,  Morio Iijima ,  Naomi Ando

IPC分类号： H05K1/09 ,  C25D3/38 ,  H01L23/00

CPC分类号： H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76877 ,  H05K3/421 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T428/12229

摘要： A novel electrolytic plating method suitable for filling non-through holes with metal is disclosed. The electrolytic plating method uses a plating solution containing additives such as a surfactant, a brightening agent and a smoothing agent and includes pulse plating for controlling adsorption and desorption of tie additives on the surface and in the non-through holes of substrate and subsequent DC plating for filling up the non-through holes with metal.

摘要翻译： 公开了一种适用于用金属填充非通孔的新型电解电镀方法。 电解电镀方法使用含有表面活性剂，增亮剂和平滑剂等添加剂的电镀液，并且包括用于控制表面和基板的非通孔和随后的直流电镀中的粘结添加剂的吸附和解吸的脉冲电镀 用金属填充非通孔。