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    ACTIVELY CHILLED SUBSTRATE TRANSPORT MODULE
    1.
    发明申请
    ACTIVELY CHILLED SUBSTRATE TRANSPORT MODULE 审中-公开
    高效冷却底板运输模块

    公开(公告)号：US20080145191A1

    公开(公告)日：2008-06-19

    申请号：US11689372

    申请日：2007-03-21

    申请人： Martin Jeff Salinas ,  Tetsuya Ishikawa ,  David H. Quach ,  Natarajan Ramanan

    发明人： Martin Jeff Salinas ,  Tetsuya Ishikawa ,  David H. Quach ,  Natarajan Ramanan

    IPC分类号： H01L21/677

    CPC分类号： H01L21/67173 ,  H01L21/67109 ,  H01L21/67748

    摘要： A substrate transport module adapted to transport a substrate in a processing chamber of a semiconductor processing apparatus. The substrate transport module includes a substrate cooling surface and a plurality of coolant channels disposed in the substrate transport module and in thermal communication with the substrate cooling surface. The substrate transport module also includes a plurality of vacuum channels disposed in the substrate transport module and a plurality of proximity pins extending to a predetermined height above the substrate cooling surface. Each of the plurality of proximity pins is in fluid communication with one or more of the plurality of vacuum channels.

    摘要翻译： 一种适于在半导体处理装置的处理室中输送基板的基板输送模块。 衬底传送模块包括衬底冷却表面和布置在衬底输送模块中并与衬底冷却表面热连通的多个冷却剂通道。 衬底传送模块还包括设置在衬底传送模块中的多个真空通道和延伸到衬底冷却表面上方预定高度的多个接近销。 多个接近销中的每一个与多个真空通道中的一个或多个流体连通。

    Method and apparatus for multi-chamber exhaust control
    2.
    发明申请
    Method and apparatus for multi-chamber exhaust control 审中-公开
    多室排气控制的方法和装置

    公开(公告)号：US20080006650A1

    公开(公告)日：2008-01-10

    申请号：US11475687

    申请日：2006-06-27

    申请人： Ming-Kuei Tseng ,  Natarajan Ramanan ,  Tetsuya Ishikawa ,  Sudhir R. Gondhalekar

    发明人： Ming-Kuei Tseng ,  Natarajan Ramanan ,  Tetsuya Ishikawa ,  Sudhir R. Gondhalekar

    IPC分类号： G01F11/00 ,  B67B7/00

    CPC分类号： G05D16/202 ,  H01L21/67017 ,  H01L21/6719

    摘要： A method of operating a multi-chamber module including a first chamber, a second chamber, and a dispense arm area positioned between the first chamber and the second chamber. The method includes flowing a process gas into the first chamber, the second chamber, and the dispense arm area. The method also includes exhausting a first gas from the first chamber using a first exhaust path in fluid communication with a shared exhaust, exhausting a second gas from the second chamber using a second exhaust path in fluid communication with the shared exhaust, and exhausting a third gas from the dispense arm area using a dispense arm area exhaust in fluid communication with the shared exhaust. The method further includes monitoring a first chamber pressure in the first chamber, a second chamber pressure in the second chamber, and a dispense pressure in the dispense arm area, and adjusting a flow through at least one of the first exhaust path, the second exhaust path, and the dispense arm area exhaust to maintain the first chamber pressure and the second chamber pressure at a value higher than the dispense pressure.

    摘要翻译： 一种操作多室模块的方法，该多室模块包括位于第一室和第二室之间的第一室，第二室和分配臂区域。 该方法包括使处理气体流入第一室，第二室和分配臂区域。 该方法还包括使用与共用排气流体连通的第一排气路径从第一室排出第一气体，使用与共用排气流体连通的第二排气通道从第二室排出第二气体，以及排出第三气体 来自分配臂区域的气体使用与共用排气流体连通的分配臂区域排气。 该方法还包括监测第一室中的第一室压力，第二室中的第二室压力和分配臂区域中的分配压力，以及调节通过第一排气路径，第二排气中的至少一个的流量 路径和分配臂区域排气以将第一室压力和第二室压力保持在高于分配压力的值。

    Integrated thermal unit having laterally adjacent bake and chill plates on different planes
    7.
    发明授权
    Integrated thermal unit having laterally adjacent bake and chill plates on different planes 有权
    集成热单元具有横向相邻的烘烤和冷却板在不同的平面上

    公开(公告)号：US07288746B2

    公开(公告)日：2007-10-30

    申请号：US11174782

    申请日：2005-07-05

    申请人： David H. Quach ,  Tetsuya Ishikawa

    发明人： David H. Quach ,  Tetsuya Ishikawa

    IPC分类号： H05B3/68 ,  C23C16/00

    CPC分类号： H01L21/67109 ,  H01L21/67184 ,  H01L21/67742

    摘要： An integrated thermal unit comprising a bake plate having a substrate holding surface configured to hold and heat a substrate in a baking position and a chill plate having a substrate holding surface configured to hold and cool a substrate in a cooling position where the substrate holding surface of the bake plate is positioned in a first substantially horizontal plane when the bake plate is in the baking position and the substrate holding surface of the chill plate is positioned in a second substantially horizontal plane that is below the first plane when the chill plate is in a cooling position.

    摘要翻译： 一种集成热单元，包括具有被配置为在烘烤位置保持和加热基板的基板保持表面的烘烤板，以及具有基板保持表面的冷却板，所述冷却板被配置为在基板保持表面的基板保持表面的冷却位置保持和冷却基板 当烘烤板处于烘烤位置时，烘烤板定位在第一基本上水平的平面中，并且当冷却板处于烘烤位置时，冷却板的基板保持表面定位在第二基本水平的平面内，该第二基本水平的平面位于第一平面之下 冷却位置。

    Bake plate having engageable thermal mass
    8.
    发明授权
    Bake plate having engageable thermal mass 有权
    烘烤板具有可接合的热质量

    公开(公告)号：US07274005B2

    公开(公告)日：2007-09-25

    申请号：US11174681

    申请日：2005-07-05

    申请人： David H. Quach ,  Tetsuya Ishikawa

    发明人： David H. Quach ,  Tetsuya Ishikawa

    IPC分类号： H05B3/68 ,  C23C16/00 ,  F28F7/00

    CPC分类号： H01L21/67184 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67751

    摘要： A bake station comprising a bake plate adapted to heat a substrate supported on an upper surface of the bake plate, the bake plate vertically moveable between an upper baking position and a lower cooling position; and a plurality of heat sinks adapted to be engageably coupled to a lower surface of the bake plate when the bake plate is in the lower cooling position.

    摘要翻译： 一种烘烤台，包括适于加热支撑在所述烘烤板的上表面上的基底的烘烤板，所述烘烤板可在上烘烤位置和下冷却位置之间垂直移动; 以及多个散热器，其适于在所述烘烤板处于所述下部冷却位置时可接合地联接到所述烘烤板的下表面。