公开(公告)号：US08488322B2

公开(公告)日：2013-07-16

申请号：US12914903

申请日：2010-10-28

Applicant: Meng-Cheng Huang ,  Chi-Chung Tseng

Inventor： Meng-Cheng Huang ,  Chi-Chung Tseng

IPC: H05K7/20 ,  F28F7/00 ,  F28D15/00

CPC classification number: H01L23/427 ,  F28D15/0275 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The heat sink fastener includes a heat conductive board and a flexible metallic wire. The heat conductive board has a pair of pivot portions. The flexible metallic wire has a pair of flexible arms and a middle portion connecting therebetween. Each flexible arm connects to the pivot portion. The pivot portion side of the heat conductive board is formed with a blocking sheet. The middle portion is provided with a bend for being blocked by the blocking sheet. When the flexible metallic wire is hooked to a ring on a circuit board, it will generate pressure to the heat conductive board resulting from the bent flexible arms and the blocked middle portion.

Abstract translation: 散热片紧固件包括导热板和柔性金属线。 导热板具有一对枢轴部。 柔性金属线具有一对柔性臂和连接在其间的中间部分。 每个柔性臂连接到枢轴部分。 导热板的枢轴部分侧形成有阻挡片。 中间部分设置有被阻挡片阻挡的弯曲部。 当柔性金属线钩在电路板上的环上时，由弯曲的柔性臂和堵塞的中间部分产生对导热板的压力。

公开(公告)号：US20120255771A1

公开(公告)日：2012-10-11

申请号：US13441199

申请日：2012-04-06

Applicant: Wen-Hung Hu ,  Chao-Meng Cheng ,  Yu-Hsiang Huang ,  Ya-Ping Chiou

Inventor： Wen-Hung Hu ,  Chao-Meng Cheng ,  Yu-Hsiang Huang ,  Ya-Ping Chiou

IPC: H05K1/11 ,  H05K3/02

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K3/403 ,  H05K3/427 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2201/09827 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: A packaging substrate includes a core board having a first surface and an opposite second surface; at least a conic through hole formed in the core board and penetrating the first and second surfaces; a plurality of conductive paths formed on a wall of the conic through hole, free from being electrically connected to one another in the conic through hole; and a plurality of first circuits and second circuits disposed on the first and second surfaces of the core board, respectively, and being in contact with peripheries of two ends of the conic through hole, wherein each of the first circuits is electrically connected through each of the conductive paths to each of the second circuits. Compared to the prior art, the packaging substrate has a reduced number of through holes or vias and an increased overall layout density.

Abstract translation: 包装基板包括具有第一表面和相对的第二表面的芯板; 至少形成在所述芯板中并穿透所述第一表面和第二表面的锥形通孔; 形成在锥形通孔的壁上的多个导电路径，在锥形通孔中彼此不相互电连接; 以及多个第一电路和第二电路，分别设置在芯板的第一表面和第二表面上，并且与圆锥通孔的两端的周边接触，其中每个第一电路通过 到每个第二电路的导电路径。 与现有技术相比，封装基板具有减少的通孔或通孔数量和增加的总布局密度。

公开(公告)号：US20080222890A1

公开(公告)日：2008-09-18

申请号：US11685830

申请日：2007-03-14

Applicant: Tony Wang ,  Meng-Cheng Huang

Inventor： Tony Wang ,  Meng-Cheng Huang

IPC: B23P6/00

CPC classification number: F28D15/0283 ,  Y10T29/49353

Abstract: An anti-breaking structure of an end closure of a heat pipe is formed at a tapered end of the heat pipe, and a soldering joint is formed at an upper end of the anti-breaking structure. The anti-breaking structure includes an uneven rib coupled longitudinally between the tapered end and the soldering joint, and two wing portions extended outward from the left and right outer sides of the uneven rib, and one surface of the uneven rib is convex and another backside surface of the uneven rib is concave, and both uneven rib and wing portions are formed by pressing the heat pipe to constitute the anti-breaking structure.

Abstract translation: 在热管的锥形端部形成有热管的端盖的防破坏结构，在防破坏结构的上端形成有焊接接头。 防破坏结构包括在锥形端和焊接接头之间纵向耦合的不平坦肋，以及从不平坦肋的左右外侧向外延伸的两个翼部，并且不平坦肋的一个表面是凸的，另一个背面 不平坦肋的表面是凹形的，并且通过按压热管来形成不均匀的肋和翼部，以构成抗断裂结构。

公开(公告)号：US20070253202A1

公开(公告)日：2007-11-01

申请号：US11413089

申请日：2006-04-28

Applicant: Chung Wu ,  Meng-Cheng Huang ,  Zu-Chao Hsu

Inventor： Chung Wu ,  Meng-Cheng Huang ,  Zu-Chao Hsu

IPC: F21V29/00

CPC classification number: F21V29/83 ,  F21K9/233 ,  F21V29/51 ,  F21V29/71 ,  F21V29/767 ,  F21V29/773 ,  F21V29/89 ,  F21Y2115/10 ,  F28D15/0275

Abstract: The present invention is directed to a LED lamp and the heat-dissipating structure thereof. The heat-dissipating structure is used to dissipate the heat generated by the LED and comprises a first heat-dissipating body and a second heat-dissipating body. The first heat-dissipating body has a casing with an opening formed thereon. The second heat-dissipating body is connected on the first heat-dissipating body and comprises at least one heat pipe and a plurality of heat-dissipating fins connected to the heat pipe. With this arrangement, the LED continuously operates under a suitable working temperature and the life of the LED can thus be prolonged.

Abstract translation: 本发明涉及一种LED灯及其散热结构。 散热结构用于消散由LED产生的热量，并且包括第一散热体和第二散热体。 第一散热体具有形成在其上的开口的壳体。 第二散热体连接在第一散热体上，并且包括至少一个热管和连接到热管的多个散热翅片。 通过这种布置，LED在适当的工作温度下连续工作，因此可延长LED的使用寿命。

公开(公告)号：US06979772B2

公开(公告)日：2005-12-27

申请号：US10437008

申请日：2003-05-14

Applicant: Huang Meng-Cheng ,  Lin Ming-Yang

Inventor： Huang Meng-Cheng ,  Lin Ming-Yang

IPC: G06F1/18 ,  G06F1/20 ,  H05K5/00 ,  H05K7/20

CPC classification number: G06F1/181 ,  G06F1/20 ,  H05K7/20418

Abstract: An integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cooling cover. The frame is used to carry various internal components or peripherals of a computer. The cooling cover has a plurality of fins spaced from each other by a space. The fins are connected together by a thermal conductive pipe to form an integrated heat dissipating enclosure.

公开(公告)号：US20050180110A1

公开(公告)日：2005-08-18

申请号：US10779700

申请日：2004-02-18

Applicant: Lin I-Yung ,  Huang Meng-Cheng

Inventor： Lin I-Yung ,  Huang Meng-Cheng

IPC: H01L23/427 ,  H05K7/20

CPC classification number: H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation structure includes a heat sink installed over a heat generating electronic device and a plurality of heat pipes. Proximal ends of the heat pipes are located on the heat sink, and distal ends of the heat pipes extend outside of the heat sink and are connected to a set of fins. The structure is characterized in a plurality of conductor blocks formed on the heat sink at two sides of each heat pipe to aid heat absorption of the heat pipe. Therefore, the lifetime of the heat pipes are prolonged, and the heat dissipation performance is enhanced.

Abstract translation: 散热结构包括安装在发热电子设备和多个热管上的散热器。 热管的近端位于散热器上，热管的远端延伸到散热器的外部并连接到一组散热片。 该结构的特征在于在每个热管的两侧形成在散热器上的多个导体块，以帮助热管的热吸收。 因此，热管的寿命延长，散热性能提高。

公开(公告)号：US06421239B1

公开(公告)日：2002-07-16

申请号：US09588323

申请日：2000-06-06

Applicant: Meng-Cheng Huang

Inventor： Meng-Cheng Huang

IPC: H01L23427

CPC classification number: H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integral heat dissipating device includes a radiating plate, a fan blade and a cover. The radiating plate has a heat dissipating channel. A fan blade receiving chamber is communicated with the heat dissipating channel and a heat conductive plate is connected to the bottom of the outer wall of the heat dissipating channel. The bottom of the fan blade receiving chamber is installed with an axial hole which serves to be installed with a fan blade. The axial hole can be installed with a fan blade with power. An inclined surface is formed at the upper side of the fan blade receiving chamber. A plate shape heat tube is welded between the heat conductive plate and the bottom of the heat dissipating channel. A plurality of screw retaining posts capable of being screwedly fixed to a circuit board being suspended from the lateral side of the heat conductive plate. The cover is a thin plate with a hole for sealing the upper side of the heat dissipating channel and the fan blade receiving chamber. The hole is placed above the fan blade receiving chamber for being formed as a tilt wind opening. In the present invention, the radiating plate is made integrally and can be directly connected to the fan. The shape of the heat conductive plate may include with a heat dissipating element as required. The heat conductive glue adheres to a heat conductive medium for achieving the object of high heat dissipation and low cost.

Abstract translation: 整体散热装置包括散热板，风扇叶片和盖板。 散热板具有散热通道。 风扇叶片容纳室与散热通道连通，导热板连接到散热通道外壁的底部。 风扇叶片容纳室的底部安装有用于安装风扇叶片的轴向孔。 轴向孔可以安装有带电源的风扇叶片。 倾斜表面形成在风扇叶片接收室的上侧。 板状热管焊接在导热板和散热通道的底部之间。 多个能够被螺纹固定到电路板上的螺钉固定柱从导热板的侧面悬挂。 盖是具有用于密封散热通道和风扇叶片容纳室的上侧的孔的薄板。 孔被放置在风扇叶片容纳室的上方，以形成为倾斜风开口。 在本发明中，散热板一体制成，并可与风扇直接连接。 根据需要，导热板的形状可以包括散热元件。 导热胶粘附到导热介质上，以实现高散热和低成本的目的。

公开(公告)号：US09057900B2

公开(公告)日：2015-06-16

申请号：US13590280

申请日：2012-08-21

Applicant: Chih-Shun Fan ,  Meng-Cheng Chu ,  Su Lo

Inventor： Chih-Shun Fan ,  Meng-Cheng Chu ,  Su Lo

IPC: G02F1/1333 ,  F21V8/00

CPC classification number: G02F1/133308 ,  G02B6/0088 ,  G02F2001/133317

Abstract: A display module, which includes a display panel, a backlight unit and a bezel. The backlight unit is disposed opposite to the display panel. The bezel includes a bottom, a plurality of sidewalls and a plurality of extension structures. The bottom is configured to support the backlight unit. These sidewalls are configured to corporately enclose the display panel and the backlight unit, and each sidewall has a first end and a second end opposite to each other; wherein the first end is connected to the bottom. The extension structures each extend from the second end of the respective sidewall and include a supporting portion, disposed between the backlight unit and the display panel and opposite to the bottom, configured to support the display panel.

Abstract translation: 一种显示模块，包括显示面板，背光单元和表圈。 背光单元布置成与显示面板相对。 边框包括底部，多个侧壁和多个延伸结构。 底部配置为支持背光单元。 这些侧壁构造成公平地包围显示面板和背光单元，并且每个侧壁具有彼此相对的第一端和第二端; 其中第一端连接到底部。 延伸结构各自从相应侧壁的第二端延伸并且包括布置在背光单元和显示面板之间并与底部相对的支撑部分，被配置为支撑显示面板。

公开(公告)号：US20130300973A1

公开(公告)日：2013-11-14

申请号：US13590280

申请日：2012-08-21

Applicant: Chih-Shun Fan ,  Meng-Cheng Chu ,  Su Lo

Inventor： Chih-Shun Fan ,  Meng-Cheng Chu ,  Su Lo

IPC: G02F1/1333 ,  G02F1/13357

CPC classification number: G02F1/133308 ,  G02B6/0088 ,  G02F2001/133317

Abstract: A display module, which includes a display panel, a backlight unit and a bezel. The backlight unit is disposed opposite to the display panel. The bezel includes a bottom, a plurality of sidewalls and a plurality of extension structures. The bottom is configured to support the backlight unit. These sidewalls are configured to corporately enclose the display panel and the backlight unit, and each sidewall has a first end and a second end opposite to each other; wherein the first end is connected to the bottom. The extension structures each extend from the second end of the respective sidewall and include a supporting portion, disposed between the backlight unit and the display panel and opposite to the bottom, configured to support the display panel.

Abstract translation: 显示模块，其包括显示面板，背光单元和表圈。 背光单元布置成与显示面板相对。 边框包括底部，多个侧壁和多个延伸结构。 底部配置为支持背光单元。 这些侧壁构造成公平地包围显示面板和背光单元，并且每个侧壁具有彼此相对的第一端和第二端; 其中第一端连接到底部。 延伸结构各自从相应侧壁的第二端延伸并且包括布置在背光单元和显示面板之间并与底部相对的支撑部分，被配置为支撑显示面板。

公开(公告)号：US07841386B2

公开(公告)日：2010-11-30

申请号：US11685830

申请日：2007-03-14

Applicant: Tony Wang ,  Meng-Cheng Huang

Inventor： Tony Wang ,  Meng-Cheng Huang

IPC: B23P6/00 ,  F28D15/00

CPC classification number: F28D15/0283 ,  Y10T29/49353

Abstract: An anti-breaking structure of an end closure of a heat pipe is formed at a tapered end of the heat pipe, and a soldering joint is formed at an upper end of the anti-breaking structure. The anti-breaking structure includes an uneven rib coupled longitudinally between the tapered end and the soldering joint, and two wing portions extended outward from the left and right outer sides of the uneven rib, and one surface of the uneven rib is convex and another backside surface of the uneven rib is concave, and both uneven rib and wing portions are formed by pressing the heat pipe to constitute the anti-breaking structure.

Abstract translation: 在热管的锥形端部形成有热管的端盖的防破坏结构，在防破坏结构的上端形成有焊接接头。 防破坏结构包括在锥形端和焊接接头之间纵向耦合的不平坦肋，以及从不平坦肋的左右外侧向外延伸的两个翼部，并且不平坦肋的一个表面是凸的，另一个背面 不平坦肋的表面是凹形的，并且通过按压热管来形成不均匀的肋和翼部，以构成抗断裂结构。