Methods of manufacturing semiconductor devices having contact plugs in insulation layers
    2.
    发明授权
    Methods of manufacturing semiconductor devices having contact plugs in insulation layers 有权
    制造在绝缘层中具有接触插塞的半导体器件的方法

    公开(公告)号:US08101515B2

    公开(公告)日:2012-01-24

    申请号:US12766137

    申请日:2010-04-23

    摘要: Methods of manufacturing semiconductor devices are provided in which a first contact plug is formed on a first active region in a substrate and a second contact plug is formed on a second active region in the substrate. A height of an upper surface of the second contact plug from the substrate is greater than a height of an upper surface of the first contact plug from the substrate. A third contact plug is formed on the second contact plug. A first spacer is formed on a side surface of the third contact plug. A third interlayer insulation layer is formed that covers the third contact plug. The third interlayer insulation layer is patterned to form a third opening that exposes the first contact plug. A fourth contact plug is formed in the third opening that is electrically connected to the first contact plug.

    摘要翻译: 提供制造半导体器件的方法,其中第一接触插塞形成在衬底中的第一有源区上,并且第二接触插塞形成在衬底中的第二有源区上。 第二接触塞从基板的上表面的高度大于第一接触塞从基板的上表面的高度。 在第二接触插塞上形成第三接触插塞。 第一间隔件形成在第三接触插塞的侧表面上。 形成覆盖第三接触插塞的第三层间绝缘层。 图案化第三层间绝缘层以形成暴露第一接触插塞的第三开口。 第四接触插塞形成在电连接到第一接触插塞的第三开口中。

    Methods of Manufacturing Semiconductor Devices Having Contact Plugs in Insulation Layers
    4.
    发明申请
    Methods of Manufacturing Semiconductor Devices Having Contact Plugs in Insulation Layers 有权
    制造具有接触插头在绝缘层中的半导体器件的方法

    公开(公告)号:US20100210087A1

    公开(公告)日:2010-08-19

    申请号:US12766137

    申请日:2010-04-23

    IPC分类号: H01L21/768 H01L21/02

    摘要: Methods of manufacturing semiconductor devices are provided in which a first contact plug is formed on a first active region in a substrate and a second contact plug is formed on a second active region in the substrate. A height of an upper surface of the second contact plug from the substrate is greater than a height of an upper surface of the first contact plug from the substrate. A third contact plug is formed on the second contact plug. A first spacer is formed on a side surface of the third contact plug. A third interlayer insulation layer is formed that covers the third contact plug. The third interlayer insulation layer is patterned to form a third opening that exposes the first contact plug. A fourth contact plug is formed in the third opening that is electrically connected to the first contact plug.

    摘要翻译: 提供制造半导体器件的方法,其中第一接触插塞形成在衬底中的第一有源区上,并且第二接触插塞形成在衬底中的第二有源区上。 第二接触塞从基板的上表面的高度大于第一接触塞从基板的上表面的高度。 在第二接触插塞上形成第三接触插塞。 第一间隔件形成在第三接触插塞的侧表面上。 形成覆盖第三接触插塞的第三层间绝缘层。 图案化第三层间绝缘层以形成暴露第一接触插塞的第三开口。 第四接触插塞形成在电连接到第一接触插塞的第三开口中。

    Fabricating method for flat display device
    5.
    发明授权
    Fabricating method for flat display device 有权
    平面显示装置的制造方法

    公开(公告)号:US07732318B2

    公开(公告)日:2010-06-08

    申请号:US11315153

    申请日:2005-12-23

    IPC分类号: H01L21/00

    摘要: A fabricating method of a flat panel display device can reduce manufacturing costs of the flat panel display device. A fabricating method of a flat panel display device includes providing a conductive nanopowder thin film material having a first conductive nanopowder and a second conductive nanopowder, spreading the conductive nanopowder thin film material over a substrate, forming a conductive thin film pattern by patterning the conductive nanopowder thin film material, and forming a conductive thin film by baking the conductive thin film pattern, wherein the first conductive nanopowder is located in a middle of the conductive thin film and the second conductive nanopowder is located in an outer part of the conductive thin film.

    摘要翻译: 平板显示装置的制造方法可以降低平板显示装置的制造成本。 平板显示装置的制造方法包括提供具有第一导电纳米粉末和第二导电纳米粉末的导电纳米粉末薄膜材料,将导电纳米粉末薄膜材料铺展在基板上,通过图案化导电纳米粉末形成导电薄膜图案 薄膜材料,并通过烘烤导电薄膜图案形成导电薄膜,其中第一导电纳米粉末位于导电薄膜的中间,第二导电纳米粉末位于导电薄膜的外部。

    METHOD OF FABRICATING AN APPARATUS OF FABRICATING AN FLAT PANEL DISPLAY DEVICE AND METHOD FOR FABRICATING FLAT PANEL DISPLAY DEVICE
    8.
    发明申请
    METHOD OF FABRICATING AN APPARATUS OF FABRICATING AN FLAT PANEL DISPLAY DEVICE AND METHOD FOR FABRICATING FLAT PANEL DISPLAY DEVICE 有权
    制造平板显示装置的装置的方法和用于制作平板显示装置的方法

    公开(公告)号:US20090139960A1

    公开(公告)日:2009-06-04

    申请号:US11950215

    申请日:2007-12-04

    摘要: A method of fabricating an apparatus of fabricating a flat panel display device and method of fabricating flat panel display device is disclosed, which enables simplification of process by performing a patterning process without a photo process, the method for fabricating an apparatus of fabricating flat panel display device comprising, preparing a master mold including a thin film pattern, coating a liquid-type molding material including oligomer on the master mold, forming a soft mold including a groove provided with a pattern in a shape corresponding to the thin film pattern of the master mold and adhering the soft mold to a mold support plate, wherein the soft mold is adhered to the mold support plate by a covalent bonding in the interface between the oligomer and the mold support plate.

    摘要翻译: 公开了一种制造平板显示装置的制造方法以及制造平板显示装置的方法,其通过在不进行光刻处理的情况下执行图案化处理来简化工艺,制造平板显示装置的方法 装置,包括:制备包括薄膜图案的母模,在所述母模上涂覆包含低聚物的液态成型材料,形成软模,所述软模包括设置有与所述母模的薄膜图案相对应的图案的凹槽 模具并将软模粘合到模具支撑板上,其中软模具通过在低聚物和模具支撑板之间的界面中的共价键合而附着到模具支撑板上。

    Methods of Manufacturing Semiconductor Devices Having Contact Plugs in Insulation Layers
    9.
    发明申请
    Methods of Manufacturing Semiconductor Devices Having Contact Plugs in Insulation Layers 有权
    制造具有接触插头在绝缘层中的半导体器件的方法

    公开(公告)号:US20090104749A1

    公开(公告)日:2009-04-23

    申请号:US12108012

    申请日:2008-04-23

    IPC分类号: H01L21/02 H01L21/4763

    摘要: Methods of manufacturing semiconductor devices are provided in which a first contact plug is formed on a first active region in a substrate and a second contact plug is formed on a second active region in the substrate. A height of an upper surface of the second contact plug from the substrate is greater than a height of an upper surface of the first contact plug from the substrate. A third contact plug is formed on the second contact plug. A first spacer is formed on a side surface of the third contact plug. A third interlayer insulation layer is formed that covers the third contact plug. The third interlayer insulation layer is patterned to form a third opening that exposes the first contact plug. A fourth contact plug is formed in the third opening that is electrically connected to the first contact plug.

    摘要翻译: 提供制造半导体器件的方法,其中第一接触插塞形成在衬底中的第一有源区上,并且第二接触插塞形成在衬底中的第二有源区上。 第二接触塞从基板的上表面的高度大于第一接触塞从基板的上表面的高度。 在第二接触插塞上形成第三接触插塞。 第一间隔件形成在第三接触插塞的侧表面上。 形成覆盖第三接触插塞的第三层间绝缘层。 图案化第三层间绝缘层以形成暴露第一接触插塞的第三开口。 第四接触插塞形成在电连接到第一接触插塞的第三开口中。