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    Method of optimizing land grid array geometry
    1.
    发明授权
    Method of optimizing land grid array geometry 有权
    优化土地网格阵列几何的方法

    公开(公告)号：US07841078B2

    公开(公告)日：2010-11-30

    申请号：US11970346

    申请日：2008-01-07

    Applicant: Roger Lam ,  Wai Mon Ma ,  Arch F. Nuttall

    Inventor： Roger Lam ,  Wai Mon Ma ,  Arch F. Nuttall

    IPC: H05K3/30 ,  H01L23/495

    CPC classification number: H05K3/0014 ,  H05K1/0271 ,  H05K3/0058 ,  H05K2201/09036 ,  H05K2201/10719 ,  H05K2201/2009 ,  H05K2203/0278 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49213 ,  Y10T29/49218

    Abstract: Disclosed is a method, system, and computer program storage product for optimizing land grid array site geometry on an electronic assembly mounting. A first member including at least one convex region is aligned with a first portion of an electronic assembly mounting. A second member is aligned with a second portion of the electronic assembly mounting. The second portion includes at least one concave region corresponding to the convex region of the first portion. The second member includes a dome-shaped region having a predefined geometry. Heat is applied to at least one of the electronic assembly mounting, the first member, and the second member. Pressure is applied to at least one of the first member and the second member to reshape the convex region into a substantially flat surface. Applying pressure also reshapes the concave region into a geometry corresponding to the predefined geometry of the dome-shaped region.

    Abstract translation: 公开了一种用于在电子组件安装件上优化陆地网格阵列位置几何的方法，系统和计算机程序存储产品。 包括至少一个凸起区域的第一构件与电子组件安装件的第一部分对准。 第二构件与电子组件安装件的第二部分对准。 第二部分包括对应于第一部分的凸起区域的至少一个凹入区域。 第二构件包括具有预定几何形状的圆顶形区域。 热量被施加到电子组件安装件，第一构件和第二构件中的至少一个。 将压力施加到第一构件和第二构件中的至少一个，以将凸区域重新形成为基本平坦的表面。 施加压力还将凹区重新形成对应于圆顶形区域的预定几何形状的几何形状。

    Method and structure for repairing or modifying surface connections on circuit boards
    2.
    发明授权
    Method and structure for repairing or modifying surface connections on circuit boards 失效
    修理或修改电路板表面连接的方法和结构

    公开(公告)号：US06912780B2

    公开(公告)日：2005-07-05

    申请号：US10860427

    申请日：2004-06-03

    Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

    Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

    IPC: H01R12/00 ,  H05K1/11 ,  H05K3/22 ,  H05K3/40 ,  H05K3/42 ,  H01K3/10

    CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

    Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

    Adapter for plated through hole mounting of surface mount component
    4.
    发明授权
    Adapter for plated through hole mounting of surface mount component 有权
    表面安装元件的电镀通孔安装适配器

    公开(公告)号：US08902605B2

    公开(公告)日：2014-12-02

    申请号：US13495671

    申请日：2012-06-13

    Applicant: Daniel J. Buschel ,  Wai Mon Ma ,  James E. Tersigni ,  Raymond D. Birchall

    Inventor： Daniel J. Buschel ,  Wai Mon Ma ,  James E. Tersigni ,  Raymond D. Birchall

    IPC: H01R9/00

    CPC classification number: H01R12/58 ,  H01R12/718 ,  H05K1/141 ,  H05K3/325 ,  H05K2201/049 ,  H05K2201/1059 ,  H05K2201/10946

    Abstract: A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.

    Abstract translation: 用于将表面安装部件附接到印刷电路板的表面安装部件适配器，组件和相关方法。 表面安装部件适配器包括衬底，衬底上的表面安装部件保持器和柔性引线，每个柔性引线都具有附接到表面安装部件保持器的基端，以及被配置为接合电路板上的电镀通孔的自由端。 表面安装部件保持器构造成接合表面安装部件的电触点。 表面贴装组件将表面安装适配器与表面贴装组件相结合。 在表面安装部件方法中，形成表面安装组件，并且柔性引线的自由端附接到电路板上相应数量的电镀通孔。

    Structure for repairing or modifying surface connections on circuit boards
    5.
    发明授权
    Structure for repairing or modifying surface connections on circuit boards 有权
    修理或修改电路板表面连接的结构

    公开(公告)号：US07199309B2

    公开(公告)日：2007-04-03

    申请号：US11167662

    申请日：2005-06-27

    Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

    Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

    IPC: H01R12/04 ,  H05K1/11

    CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

    Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

    Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board site
    6.
    发明授权
    Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board site 失效
    将BGA模块上的浮动信号终止于球栅阵列（BGA）电路板位置的接地平面

    公开(公告)号：US06511347B2

    公开(公告)日：2003-01-28

    申请号：US09894496

    申请日：2001-06-28

    Applicant: Brian D. Chapman ,  Wai Mon Ma

    Inventor： Brian D. Chapman ,  Wai Mon Ma

    IPC: H01R1373

    CPC classification number: H05K3/4046 ,  H01L2224/45147 ,  H01L2224/48235 ,  H01L2224/4899 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19107 ,  H05K1/0298 ,  H05K1/114 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/09472 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00014

    Abstract: This invention relates to electrically connecting a first electronic component to a second electronic component wherein at least one of the electronic components must undergo modifications or repair when, for example, there is a floating signal generated from the first electronic component which can cause problems in operation of the electronic component assembly. For this type assembly an opening is provided in the second electronic component proximate the site or sites to be electrically connected to the first electronic component, which opening extends to an internal plane of the second electronic component desired to be connected to the first electronic component. A wire having a melting point higher than the solder used to make the assembly is used to connect the internal plane of the second electronic component to the pad of the second electronic component which second electronic component is to be electrically connected to the first electronic component thereby avoiding a floating signal in the electronic component assembly.

    Abstract translation: 本发明涉及将第一电子部件电连接到第二电子部件，其中当例如从第一电子部件产生的浮动信号可能导致操作问题时，电子部件中的至少一个必须进行修改或修理 的电子部件组件。 对于这种类型的组件，在第二电子部件中靠近电气连接到第一电子部件的部位设置开口，该开口延伸到期望连接到第一电子部件的第二电子部件的内部平面。 使用熔点高于用于制造组件的焊料的焊丝将第二电子部件的内平面连接到第二电子部件的电连接到第一电子部件的第二电子部件的焊盘，由此 避免电子部件组件中的浮动信号。

    High melting point solder ball coated with a low melting point solder
    9.
    发明授权
    High melting point solder ball coated with a low melting point solder 失效
    涂有低熔点焊料的高熔点焊球

    公开(公告)号：US5872400A

    公开(公告)日：1999-02-16

    申请号：US882461

    申请日：1997-06-25

    Applicant: Brian D. Chapman ,  James J. Petrone ,  Wai Mon Ma

    Inventor： Brian D. Chapman ,  James J. Petrone ,  Wai Mon Ma

    IPC: H01L23/498 ,  H05K3/34 ,  H06K1/14 ,  H01L21/60

    CPC classification number: H01L23/49816 ,  H05K3/3436 ,  H01L2224/11334 ,  H01L2924/00013 ,  H01L2924/01322 ,  H05K2201/10992 ,  H05K2201/2081 ,  H05K2203/041 ,  Y02P70/613

    Abstract: A solder ball structure having a first object and least one solder ball, each solder ball having an outer surface, top and a bottom and comprising a non-eutectic admixture of solder. The solder ball structure also having at least one BLM, each BLM having a top and a bottom and the top of each BLM in contact with the bottom of one of the at least one solder ball, each BLM containing a solder having a melting point sufficiently lower than the melting point of the corresponding solder ball such that each BLM can reflow without a significant portion of the corresponding solder ball reflowing, the bottom of each at least one BLM in electrical communication with the first object. The solder ball structure further having at least one solder ball coating, each coating in contact with one of the at least one solder ball over at least the portion of the solder ball surface not in contact with the corresponding BLM; each coating having a melting point sufficiently lower than the melting point of the corresponding solder ball such that each coating can reflow without a significant portion of the corresponding solder ball reflowing.

    Abstract translation: 一种焊球结构，其具有第一物体和至少一个焊球，每个焊球具有外表面，顶部和底部，并且包括焊料的非共晶混合物。 焊球结构还具有至少一个BLM，每个BLM具有顶部和底部，并且每个BLM的顶部与至少一个焊球之一的底部接触，每个BLM包含足够熔点的焊料 低于对应的焊球的熔点，使得每个BLM可以回流焊接相对应的焊球的相当大的部分，每个至少一个BLM的底部与第一个物体电连通。 所述焊球结构进一步具有至少一个焊球涂层，每个涂层与所述焊球表面的至少一部分接触的所述至少一个焊球之一不与相应的BLM接触; 每个涂层具有足够低于相应焊球的熔点的熔点，使得每个涂层可以回流，而相应的焊球回流的相当大的部分。

    Adapter For Plated Through Hole Mounting Of Surface Mount Component
    10.
    发明申请
    Adapter For Plated Through Hole Mounting Of Surface Mount Component 有权
    适用于电镀通孔安装表面贴装元件

    公开(公告)号：US20130337697A1

    公开(公告)日：2013-12-19

    申请号：US13495671

    申请日：2012-06-13

    Applicant: Daniel J. Buschel ,  Wai Mon Ma ,  James E. Tersigni ,  Raymond D. Birchall

    Inventor： Daniel J. Buschel ,  Wai Mon Ma ,  James E. Tersigni ,  Raymond D. Birchall

    IPC: H01R24/20

    CPC classification number: H01R12/58 ,  H01R12/718 ,  H05K1/141 ,  H05K3/325 ,  H05K2201/049 ,  H05K2201/1059 ,  H05K2201/10946

    Abstract: A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.

    Abstract translation: 用于将表面安装部件附接到印刷电路板的表面安装部件适配器，组件和相关方法。 表面安装部件适配器包括衬底，衬底上的表面安装部件保持器和柔性引线，每个柔性引线都具有附接到表面安装部件保持器的基端，以及被配置为接合电路板上的电镀通孔的自由端。 表面安装部件保持器构造成接合表面安装部件的电触点。 表面贴装组件将表面安装适配器与表面贴装组件相结合。 在表面安装部件方法中，形成表面安装组件，并且柔性引线的自由端附接到电路板上相应数量的电镀通孔。

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