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公开(公告)号:US08035203B2
公开(公告)日:2011-10-11
申请号:US12367932
申请日:2009-02-09
IPC分类号: H01L23/495 , H01L21/66
CPC分类号: H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4911 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1423 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要: An over-molded leadframe (e.g., a Quad Flat No-lead (QFN)) package capable of operating at frequencies in the range of about five gigahertz (GHz) to about 300 GHz and a method of making the over-molded leadframe package are disclosed. The over-molded leadframe package includes a capacitance lead configured to substantially reduce and/or offset the inductance created by one or more wirebonds used to connect an integrated circuit (IC) chip on the package to an input/output (I/O) lead. The IC chip is connected to the capacitance lead via one or more wirebonds, and the capacitance lead is then connected to the I/O lead via at least a second wirebond. Thus, inductance created by the one or more wirebonds on the package is substantially reduced and/or offset by the capacitance lead prior to a signal being output by the package and/or received by the IC chip.
摘要翻译: 能够在大约5千兆赫(GHz)至大约300GHz的频率范围内工作的过模制引线框架(例如,四方扁平无引线(QFN))封装以及制造超模制引线框封装的方法是 披露 包覆成型引线框封装包括电容引线,其被配置为基本上减少和/或偏移由用于将封装上的集成电路(IC)芯片连接到输入/输出(I / O)引线的一个或多个引线 。 IC芯片经由一个或多个引线键连接到电容引线,然后电容引线经由至少第二引线键连接到I / O引线。 因此,由封装输出信号和/或由IC芯片接收的信号之前,由封装上的一个或多个引线引起的电感被电容引线基本上减小和/或偏移。
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公开(公告)号:US08384498B2
公开(公告)日:2013-02-26
申请号:US12613724
申请日:2009-11-06
CPC分类号: H01P1/20381 , H01P7/082
摘要: In an exemplary embodiment, a spurline filter comprises a capacitive element connected to a spur and either a through-line of the spurline filter or ground. In another embodiment, multiple capacitive elements are connected to the spur. In an exemplary embodiment, the capacitively loaded spurline filter provides a band rejection frequency response similar to the band rejection frequency response of a similar spurline filter that does not comprise at least one capacitive element but the capacitively loaded spurline filter has half the layout area or less. In an exemplary embodiment, the spurline filter comprises capacitive elements, where the capacitive elements are configured to reduce the resonant frequency of the filter.
摘要翻译: 在示例性实施例中,支线滤波器包括连接到支线和支线滤波器或地的直线的电容元件。 在另一个实施例中,多个电容元件连接到支线。 在示例性实施例中,电容加载的线阵滤波器提供类似于不包括至少一个电容元件的类似线阵滤波器的频带阻抗频率响应的带阻频率响应,但是电容加载的线阵滤波器具有一半的布局面积或更小 。 在示例性实施例中,支线滤波器包括电容元件,其中电容元件被配置为降低滤波器的谐振频率。
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公开(公告)号:US20120051000A1
公开(公告)日:2012-03-01
申请号:US13221693
申请日:2011-08-30
申请人: David R. Laidig , Kenneth V. Buer , Michael R. Lyons , Noel Lopez
发明人: David R. Laidig , Kenneth V. Buer , Michael R. Lyons , Noel Lopez
CPC分类号: H05K7/20409 , H01L23/047 , H01L23/315 , H01L23/495 , H01L23/49541 , H01L23/49568 , H01L23/66 , H01L2223/6627 , H01L2223/6683 , H01L2224/48091 , H01Q23/00 , H05K7/02 , H01L2924/00014
摘要: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.
摘要翻译: 公开了一种MMIC封装,包括:基于引线框的包覆成型封装,位于所述包覆成型封装内的管芯; 和部分波导接口,其中部分波导接口与包覆成型的封装集成,促进了低成本和可靠的组装。 还公开了一种包覆成型的封装,其中管芯位于暴露在封装底部的金属部分上,并且封装构造成用于附接到收发器的底架,使得来自模具的热量容易地以直接热量散发到底架 路径。 本公开有助于MMIC封装的并行组装以及使用拾取和放置/表面安装技术将MMIC封装连接到收发器的底盘。 这有助于可靠和低成本的收发器。
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公开(公告)号:US20100117766A1
公开(公告)日:2010-05-13
申请号:US12613724
申请日:2009-11-06
IPC分类号: H01P1/203
CPC分类号: H01P1/20381 , H01P7/082
摘要: In an exemplary embodiment, a spurline filter comprises a capacitive element connected to a spur and either a through-line of the spurline filter or ground. In another embodiment, multiple capacitive elements are connected to the spur. In an exemplary embodiment, the capacitively loaded spurline filter provides a band rejection frequency response similar to the band rejection frequency response of a similar spurline filter that does not comprise at least one capacitive element but the capacitively loaded spurline filter has half the layout area or less. In an exemplary embodiment, the spurline filter comprises capacitive elements, where the capacitive elements are configured to reduce the resonant frequency of the filter.
摘要翻译: 在示例性实施例中,支线滤波器包括连接到支线和支线滤波器或地的直线的电容元件。 在另一个实施例中,多个电容元件连接到支线。 在示例性实施例中,电容加载的线阵滤波器提供类似于不包括至少一个电容元件的类似线阵滤波器的频带阻抗频率响应的带阻频率响应,但是电容加载的线阵滤波器具有一半的布局面积或更小 。 在示例性实施例中,支线滤波器包括电容元件,其中电容元件被配置为降低滤波器的谐振频率。
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公开(公告)号:US20090206473A1
公开(公告)日:2009-08-20
申请号:US12031236
申请日:2008-02-14
申请人: Noel A. Lopez , Michael R. Lyons , Dave Laidig , Kenneth V. Buer
发明人: Noel A. Lopez , Michael R. Lyons , Dave Laidig , Kenneth V. Buer
CPC分类号: H05K1/0243 , H01L23/13 , H01L23/4006 , H01L23/66 , H01L24/28 , H01L24/48 , H01L24/49 , H01L24/85 , H01L24/97 , H01L2223/6633 , H01L2224/2919 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/85 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/1517 , H01L2924/1616 , H01L2924/19039 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H05K1/0203 , H05K3/0061 , H05K2201/09845 , H05K2201/10189 , H01L2924/0665 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques.
摘要翻译: 毫米波系统或封装可以包括至少一个印刷线路板(PWB),至少一个集成波导接口和至少一个单片微波集成电路(MMIC)。 包装可以以并入的制造技术的面板形式组装。
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公开(公告)号:US4964270A
公开(公告)日:1990-10-23
申请号:US352953
申请日:1989-05-17
申请人: David H. Taylor , Michael R. Lyons
发明人: David H. Taylor , Michael R. Lyons
CPC分类号: F02C7/232 , F05D2260/602
摘要: A gas turbine engine fuel system comprises a main fuel manifold and starter fuel manifold which direct fuel into the combustion apparatus of a gas turbine engine. During normal engine operation, fuel flow to the starter manifold is prevented by a solenoid valve. Air from within the combustion apparatus then flows back through the starter manifold and into a fuel drains system of the engine to purge the starter manifold of fuel. This purging of fuel in the starter manifold engine operation prevents the undesirable leakage of fuel into the combustion apparatus from the starter manifold.
摘要翻译: 燃气涡轮发动机燃料系统包括主燃料歧管和将燃料引入燃气涡轮发动机的燃烧装置的起动器燃料歧管。 在正常的发动机操作期间,通过电磁阀防止了通向起动器歧管的燃料流。 然后,来自燃烧装置内的空气然后通过起动歧管回流到发动机的燃料排放系统中,以清除燃料的起动器歧管。 在起动器歧管发动机操作中的这种清除燃料防止燃料从起动器歧管不期望地泄漏到燃烧装置中。
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公开(公告)号:US08592960B2
公开(公告)日:2013-11-26
申请号:US13221693
申请日:2011-08-30
申请人: David R. Laidig , Kenneth V. Buer , Michael R. Lyons , Noel Lopez
发明人: David R. Laidig , Kenneth V. Buer , Michael R. Lyons , Noel Lopez
IPC分类号: H01L23/04
CPC分类号: H05K7/20409 , H01L23/047 , H01L23/315 , H01L23/495 , H01L23/49541 , H01L23/49568 , H01L23/66 , H01L2223/6627 , H01L2223/6683 , H01L2224/48091 , H01Q23/00 , H05K7/02 , H01L2924/00014
摘要: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.
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公开(公告)号:US08072065B2
公开(公告)日:2011-12-06
申请号:US12031236
申请日:2008-02-14
申请人: Noel A. Lopez , Michael R. Lyons , Dave Laidig , Kenneth V. Buer
发明人: Noel A. Lopez , Michael R. Lyons , Dave Laidig , Kenneth V. Buer
IPC分类号: H01L23/34
CPC分类号: H05K1/0243 , H01L23/13 , H01L23/4006 , H01L23/66 , H01L24/28 , H01L24/48 , H01L24/49 , H01L24/85 , H01L24/97 , H01L2223/6633 , H01L2224/2919 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/85 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/1517 , H01L2924/1616 , H01L2924/19039 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H05K1/0203 , H05K3/0061 , H05K2201/09845 , H05K2201/10189 , H01L2924/0665 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques.
摘要翻译: 毫米波系统或封装可以包括至少一个印刷线路板(PWB),至少一个集成波导接口和至少一个单片微波集成电路(MMIC)。 包装可以以并入的制造技术的面板形式组装。
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公开(公告)号:US06542035B2
公开(公告)日:2003-04-01
申请号:US09750927
申请日:2000-12-28
IPC分类号: H03F360
CPC分类号: H03F3/602
摘要: A modular high power solid state amplifier and method of assembly, manufacture and use are herein disclosed. The high power amplifier includes a number of amplifiers, a DC board having flexible interconnects, a RF cover including an interlocking RF input, a RF board, a chassis, and a top cover; thereby providing an encased stand-alone solid state amplifier. The solid state components, angled designs, and piggyback topology of the invention provide a compact, efficient, integrated high power amplifier device.
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公开(公告)号:US06388528B1
公开(公告)日:2002-05-14
申请号:US09961599
申请日:2001-09-24
IPC分类号: H03F368
CPC分类号: H03F3/604 , H01L27/0207 , H01L29/41758 , H01L29/42316
摘要: A MMIC power amplifier having a smaller die size and higher power output are realized with the improved amplifier and transistor geometry herein provided. In particular, transistors, such as FETs (field effect transistors) are displaced from a conventional FET geometry with alternating FETs being rotated in opposite directions. The inputs (gate pads) and outputs (drain pads) of two adjacent FETs may be “shared.” In a shared input configuration, a compensation network may be coupled to the input. The improved FET configuration reduces the number of splitting and combining networks by up to 50% over the prior art and the die area for a typical 4 watt power amplifier is reduced by 48-72% over the prior art. The improved amplifier configuration provides a multi-sectional configuration wherein one section may be the mirrored image of another. In a two section amplifier, the amplifier appears to be “folded.”
摘要翻译: 具有较小管芯尺寸和较高功率输出的MMIC功率放大器通过本文提供的改进的放大器和晶体管几何结构来实现。 特别地,诸如FET(场效应晶体管)的晶体管从传统的FET几何形状中移位,交变的FET沿相反方向旋转。 两个相邻FET的输入(栅极焊盘)和输出(漏极焊盘)可以“共享”。 在共享输入配置中,补偿网络可以耦合到输入。 改进的FET配置将分离和组合网络的数量减少了高达现有技术的50%,并且典型的4瓦功率放大器的管芯面积比现有技术减少了48-72%。 改进的放大器配置提供多截面配置,其中一个部分可以是另一部分的镜像。 在两段放大器中,放大器似乎是“折叠的”。
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