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公开(公告)号：US08872333B2
公开(公告)日：2014-10-28
申请号：US13311235
申请日：2011-12-05
申请人： Noel A Lopez , Michael R Lyons , Dave Laidig , Kenneth V Buer
发明人： Noel A Lopez , Michael R Lyons , Dave Laidig , Kenneth V Buer
CPC分类号： H01L23/13 , H01L23/4006 , H01L23/66 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2223/6633 , H01L2223/6683 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/1517 , H01L2924/1616 , H01L2924/19039 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H05K1/0203 , H05K1/0243 , H05K3/0061 , H05K2201/09845 , H05K2201/10189 , H01L2224/85 , H01L2924/0665 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W.
摘要翻译： 毫米波集成波导接口封装器件可以包括：（1）包括印刷线路板（PWB）和单片微波积分电路（MMIC）的封装，其中MMIC与PWB通信; 和（2）与封装集成的波导接口。 封装可以适于在高频和高功率下工作，其中高频率包括大于约5GHz的频率，并且高功率包括大于约0.5W的功率。
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公开(公告)号：US20090278762A1
公开(公告)日：2009-11-12
申请号：US12274994
申请日：2008-11-20
申请人： Noel Lopez , George A. Hamilton , John Filreis , Dave Laidig
发明人： Noel Lopez , George A. Hamilton , John Filreis , Dave Laidig
CPC分类号： H01Q19/10 , H01Q21/0025 , H01Q21/065 , H01Q21/10 , Y10T29/49144 , Y10T29/49222
摘要： In accordance with various aspects of the present invention, a method and system for an antenna modular sub-array super component is presented. The modular sub-array super component allows for multiple antenna product designs to utilize a common low cost aperture element assembly block, quantities of which may be scaled up or down to suit the physical, performance, and power requirements of a specific antenna system. More specifically, a method and system for connecting various components of an antenna modular sub-array using a bar with leads connector is discussed. The bar with leads may connect antenna subcomponents or subassemblies.
摘要翻译： 根据本发明的各个方面，提出了一种用于天线模块化子阵列超级组件的方法和系统。 模块化子阵列超级组件允许多个天线产品设计利用普通的低成本孔径元件组合块，其数量可以按比例放大或缩小以适应特定天线系统的物理，性能和功率需求。 更具体地，讨论了使用具有引线连接器的条将天线模块化子阵列的各种部件连接的方法和系统。 带引线的条可以连接天线子部件或子部件。
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公开(公告)号：US20120139099A1
公开(公告)日：2012-06-07
申请号：US13311235
申请日：2011-12-05
申请人： Noel A. Lopez , Michael R. Lyons , Dave Laidig , Kenneth V. Buer
发明人： Noel A. Lopez , Michael R. Lyons , Dave Laidig , Kenneth V. Buer
IPC分类号： H01L23/34
CPC分类号： H01L23/13 , H01L23/4006 , H01L23/66 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2223/6633 , H01L2223/6683 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/1517 , H01L2924/1616 , H01L2924/19039 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H05K1/0203 , H05K1/0243 , H05K3/0061 , H05K2201/09845 , H05K2201/10189 , H01L2224/85 , H01L2924/0665 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W.
摘要翻译： 毫米波集成波导接口封装器件可以包括：（1）包括印刷线路板（PWB）和单片微波积分电路（MMIC）的封装，其中MMIC与PWB通信; 和（2）与封装集成的波导接口。 封装可以适于在高频和高功率下工作，其中高频率包括大于约5GHz的频率，并且高功率包括大于约0.5W的功率。
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公开(公告)号：US20100285758A1
公开(公告)日：2010-11-11
申请号：US12268840
申请日：2008-11-11
申请人： Dave Laidig , Kenneth V. Buer , Friedhelm Wachter
发明人： Dave Laidig , Kenneth V. Buer , Friedhelm Wachter
摘要： A method and system for an integrated transceiver is presented. The integrated transceiver includes a transceiver housing, where a waveguide is formed inside the transceiver housing using a housing base and a sub-floor component. Neither the housing base nor the sub-floor component alone is configured to operate as a waveguide. In an exemplary embodiment, a portion of the waveguide is cast into the housing base and is part of the transceiver housing. Furthermore, in an exemplary embodiment, an antenna system includes a feed horn, a polarizer, the integrated transceiver, and a transceiver circuit that communicates with the waveguide to transmit and receive radio frequency signals. The integrated transceiver, in the exemplary embodiment, includes a transceiver housing base that forms a portion of an integrated waveguide assembly, and another portion of the integrated waveguide assembly aligns with the transceiver housing base to form the integrated waveguide assembly.
摘要翻译： 提出了一种集成收发器的方法和系统。 集成收发器包括收发器壳体，其中使用壳体底座和副底板部件在收发器壳体内部形成波导。 壳体基座和底板部件单独都不配置为作为波导进行操作。 在示例性实施例中，波导的一部分被铸造到壳体基座中并且是收发器壳体的一部分。 此外，在示例性实施例中，天线系统包括馈电喇叭，偏振器，集成收发器和与波导通信以发送和接收射频信号的收发器电路。 在示例性实施例中，集成收发器包括形成集成波导组件的一部分的收发机壳体基座，并且集成波导组件的另一部分与收发机壳体基座对准以形成集成波导组件。
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公开(公告)号：US08254851B2
公开(公告)日：2012-08-28
申请号：US12268840
申请日：2008-11-11
申请人： Dave Laidig , Kenneth V. Buer , Friedhelm Wachter
发明人： Dave Laidig , Kenneth V. Buer , Friedhelm Wachter
IPC分类号： H04B1/38
摘要： A method and system for an integrated transceiver is presented. The integrated transceiver includes a transceiver housing, where a waveguide is formed inside the transceiver housing using a housing base and a sub-floor component. Neither the housing base nor the sub-floor component alone is configured to operate as a waveguide. In an exemplary embodiment, a portion of the waveguide is cast into the housing base and is part of the transceiver housing. Furthermore, in an exemplary embodiment, an antenna system includes a feed horn, a polarizer, the integrated transceiver, and a transceiver circuit that communicates with the waveguide to transmit and receive radio frequency signals. The integrated transceiver, in the exemplary embodiment, includes a transceiver housing base that forms a portion of an integrated waveguide assembly, and another portion of the integrated waveguide assembly aligns with the transceiver housing base to form the integrated waveguide assembly.
摘要翻译： 提出了一种集成收发器的方法和系统。 集成收发器包括收发器壳体，其中使用壳体底座和副底板部件在收发器壳体内部形成波导。 壳体基座和底板部件单独都不配置为作为波导进行操作。 在示例性实施例中，波导的一部分被铸造到壳体基座中并且是收发器壳体的一部分。 此外，在示例性实施例中，天线系统包括馈电喇叭，偏振器，集成收发器和与波导通信以发送和接收射频信号的收发器电路。 在示例性实施例中，集成收发器包括形成集成波导组件的一部分的收发机壳体基座，并且集成波导组件的另一部分与收发机壳体基座对准以形成集成波导组件。
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公开(公告)号：US08072065B2
公开(公告)日：2011-12-06
申请号：US12031236
申请日：2008-02-14
申请人： Noel A. Lopez , Michael R. Lyons , Dave Laidig , Kenneth V. Buer
发明人： Noel A. Lopez , Michael R. Lyons , Dave Laidig , Kenneth V. Buer
IPC分类号： H01L23/34
CPC分类号： H05K1/0243 , H01L23/13 , H01L23/4006 , H01L23/66 , H01L24/28 , H01L24/48 , H01L24/49 , H01L24/85 , H01L24/97 , H01L2223/6633 , H01L2224/2919 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/85 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/1517 , H01L2924/1616 , H01L2924/19039 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H05K1/0203 , H05K3/0061 , H05K2201/09845 , H05K2201/10189 , H01L2924/0665 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques.
摘要翻译： 毫米波系统或封装可以包括至少一个印刷线路板（PWB），至少一个集成波导接口和至少一个单片微波集成电路（MMIC）。 包装可以以并入的制造技术的面板形式组装。
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公开(公告)号：US20090206473A1
公开(公告)日：2009-08-20
申请号：US12031236
申请日：2008-02-14
申请人： Noel A. Lopez , Michael R. Lyons , Dave Laidig , Kenneth V. Buer
发明人： Noel A. Lopez , Michael R. Lyons , Dave Laidig , Kenneth V. Buer
CPC分类号： H05K1/0243 , H01L23/13 , H01L23/4006 , H01L23/66 , H01L24/28 , H01L24/48 , H01L24/49 , H01L24/85 , H01L24/97 , H01L2223/6633 , H01L2224/2919 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/85 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/1517 , H01L2924/1616 , H01L2924/19039 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H05K1/0203 , H05K3/0061 , H05K2201/09845 , H05K2201/10189 , H01L2924/0665 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques.
摘要翻译： 毫米波系统或封装可以包括至少一个印刷线路板（PWB），至少一个集成波导接口和至少一个单片微波集成电路（MMIC）。 包装可以以并入的制造技术的面板形式组装。
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