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公开(公告)号：US20130043137A1
公开(公告)日：2013-02-21
申请号：US13695508
申请日：2010-04-30
申请人： Hiroki Yasuda , Ryoichi Kimizuka , Tatsuji Takasu , Takuro Sato , Hiroshi Ishizuka , Yasuhiro Ogo , Yuto Oyama , Yu Tonooka , Mikiko Kosaka , Aya Shimomura , Yumiko Shimizu
发明人： Hiroki Yasuda , Ryoichi Kimizuka , Tatsuji Takasu , Takuro Sato , Hiroshi Ishizuka , Yasuhiro Ogo , Yuto Oyama , Yu Tonooka , Mikiko Kosaka , Aya Shimomura , Yumiko Shimizu
IPC分类号： C25D3/38 , C07D401/14 , C07D403/14
CPC分类号： C07D295/08 , C07D295/088 , C25D3/38 , H01L21/2885 , H01L21/76898 , H05K3/421 , H05K3/423 , H05K3/4644 , H05K2201/09509 , H05K2201/09563
摘要： Provided is a copper plating technique that enables the filling of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates or ceramic substrates. The disclosed technique involves a tertiary amine compound, which is obtained by reacting a heterocyclic compound with the epoxy group of a glycidyl ether group of a compound that has three or more glycidyl ether groups, and a quaternary amine compound thereof, as well as a copper plating additive, a copper plating bath, and a copper plating method employing the compounds.
摘要翻译： 提供一种铜电镀技术，其能够填充诸如硅衬底，有机材料衬底或陶瓷衬底的半导体衬底中的高纵横比通孔和通孔。 所公开的技术涉及通过使杂环化合物与具有三个或更多个缩水甘油醚基团的化合物的缩水甘油醚基团的环氧基及其季胺化合物反应而获得的叔胺化合物，以及铜 电镀添加剂，铜电镀浴和使用该化合物的镀铜方法。
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公开(公告)号：US09321741B2
公开(公告)日：2016-04-26
申请号：US13695508
申请日：2010-04-30
申请人： Hiroki Yasuda , Ryoichi Kimizuka , Tatsuji Takasu , Takuro Sato , Hiroshi Ishizuka , Yasuhiro Ogo , Yuto Oyama , Yu Tonooka , Mikiko Kosaka , Aya Shimomura , Yumiko Shimizu
发明人： Hiroki Yasuda , Ryoichi Kimizuka , Tatsuji Takasu , Takuro Sato , Hiroshi Ishizuka , Yasuhiro Ogo , Yuto Oyama , Yu Tonooka , Mikiko Kosaka , Aya Shimomura , Yumiko Shimizu
IPC分类号： C25D3/38 , C07D295/08 , C07D295/088 , H01L21/768 , H01L21/288 , H05K3/42 , H05K3/46
CPC分类号： C07D295/08 , C07D295/088 , C25D3/38 , H01L21/2885 , H01L21/76898 , H05K3/421 , H05K3/423 , H05K3/4644 , H05K2201/09509 , H05K2201/09563
摘要： Provided is a copper plating technique that enables the filling of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates or ceramic substrates. The disclosed technique involves a tertiary amine compound, which is obtained by reacting a heterocyclic compound with the epoxy group of a glycidyl ether group of a compound that has three or more glycidyl ether groups, and a quaternary amine compound thereof, as well as a copper plating additive, a copper plating bath, and a copper plating method employing the compounds.
摘要翻译： 提供一种铜电镀技术，其能够填充诸如硅衬底，有机材料衬底或陶瓷衬底的半导体衬底中的高纵横比通孔和通孔。 所公开的技术涉及通过使杂环化合物与具有三个或更多个缩水甘油醚基团的化合物的缩水甘油醚基团的环氧基及其季胺化合物反应而获得的叔胺化合物，以及铜 电镀添加剂，铜电镀浴和使用该化合物的镀铜方法。
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公开(公告)号：US20130126234A1
公开(公告)日：2013-05-23
申请号：US13813392
申请日：2011-08-03
申请人： Junichi Ono , Eiji Saijo , Hiroki Hirai , Takuji Otsuka , Hiroki Shimoda , Hajime Kawase , Takuya Inoue , Masaaki Tabata , Takehiro Nakata , Satoshi Morikawa , Mikiko Kosaka
发明人： Junichi Ono , Eiji Saijo , Hiroki Hirai , Takuji Otsuka , Hiroki Shimoda , Hajime Kawase , Takuya Inoue , Masaaki Tabata , Takehiro Nakata , Satoshi Morikawa , Mikiko Kosaka
IPC分类号： H02G15/08
摘要： An electric wire with terminal includes an electric wire covering an outer periphery of a core wire with an insulating coating and a female terminal. The female terminal includes: a wire barrel having a bottom plate on which the core wire is placed and crimped onto the core wire; a groove portion extending from the bottom plate in a direction in which the core wire extends and whose surface on the side where the core wire is placed is bent into a concave shape. The groove portion has a water blocking wall molded by synthetic resin. The water blocking wall is provided to fill the inside of the groove portion. A region extending from the water blocking wall to the end of the insulating coating is covered with a water blocking coating, and the inner surface of the water blocking coating is in close contact with the water blocking wall.
摘要翻译： 具有端子的电线包括覆盖具有绝缘涂层和阴端子的芯线的外周的电线。 阴端子包括：具有底板的线筒，芯线放置在该底板上并压接在芯线上; 在芯线延伸的方向上从底板延伸的槽部，将芯线放置一侧的表面弯曲成凹状。 槽部具有由合成树脂成型的防水壁。 设置防水壁以填充槽部的内部。 从防水壁延伸到绝缘涂层的端部的区域被防水涂层覆盖，并且防水涂层的内表面与防水壁紧密接触。
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公开(公告)号：US09209615B2
公开(公告)日：2015-12-08
申请号：US13813392
申请日：2011-08-03
申请人： Junichi Ono , Eiji Saijo , Hiroki Hirai , Takuji Otsuka , Hiroki Shimoda , Hajime Kawase , Takuya Inoue , Masaaki Tabata , Takehiro Nakata , Satoshi Morikawa , Mikiko Kosaka
发明人： Junichi Ono , Eiji Saijo , Hiroki Hirai , Takuji Otsuka , Hiroki Shimoda , Hajime Kawase , Takuya Inoue , Masaaki Tabata , Takehiro Nakata , Satoshi Morikawa , Mikiko Kosaka
摘要： An electric wire with terminal includes an electric wire covering an outer periphery of a core wire with an insulating coating and a female terminal. The female terminal includes: a wire barrel having a bottom plate on which the core wire is placed and crimped onto the core wire; a groove portion extending from the bottom plate in a direction in which the core wire extends and whose surface on the side where the core wire is placed is bent into a concave shape. The groove portion has a water blocking wall molded by synthetic resin. The water blocking wall is provided to fill the inside of the groove portion. A region extending from the water blocking wall to the end of the insulating coating is covered with a water blocking coating, and the inner surface of the water blocking coating is in close contact with the water blocking wall.
摘要翻译： 具有端子的电线包括覆盖具有绝缘涂层和阴端子的芯线的外周的电线。 阴端子包括：具有底板的线筒，芯线放置在该底板上并压接在芯线上; 在芯线延伸的方向上从底板延伸的槽部，将芯线放置一侧的表面弯曲成凹状。 槽部具有由合成树脂成型的防水壁。 设置防水壁以填充槽部的内部。 从防水壁延伸到绝缘涂层的端部的区域被防水涂层覆盖，并且防水涂层的内表面与防水壁紧密接触。
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