公开(公告)号：US08609445B2

公开(公告)日：2013-12-17

申请号：US13112584

申请日：2011-05-20

申请人： Mitsunori Kanemoto ,  Tarou Kaneko

发明人： Mitsunori Kanemoto ,  Tarou Kaneko

IPC分类号： H01L21/58 ,  H01S5/022

CPC分类号： H04B10/40 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/424 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4257 ,  G02B6/4271 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/50

摘要： [Problems] To accommodate a plurality of optical semiconductor elements in one package with their optical axes aligned highly precisely. [Means for Solving the Problems]An optical transmission module includes an optical transmission unit, a carrier to become a base, a semiconductor optical amplification element mounted on the carrier through a first sub-carrier, first and second lenses fixed on the carrier through first and second lens holders, an element supporting member and an optical isolator fixed on the carrier, a third lens holder supported by the element supporting member, a third lens and a small carrier individually fixed in the third lens holder, and a semiconductor laser element mounted on the small carrier through a second sub-carrier.

摘要翻译： [问题]为了容纳多个光学半导体元件在一个封装中，其光轴高精度地对准。 解决问题的手段光传输模块包括光传输单元，成为基座的载体，通过第一副载体安装在载体上的半导体光放大元件，第一和第二透镜，其通过第一 和第二透镜保持器，固定在载体上的元件支撑构件和光隔离器，由元件支撑构件支撑的第三透镜保持器，第三透镜​​和单独固定在第三透镜保持器中的小载体，以及安装 在小载体上通过第二副载波。

公开(公告)号：US20100178012A1

公开(公告)日：2010-07-15

申请号：US12303906

申请日：2007-05-30

申请人： Mitsunori Kanemoto ,  Taro Kaneko ,  Mitsuru Kurihara

发明人： Mitsunori Kanemoto ,  Taro Kaneko ,  Mitsuru Kurihara

IPC分类号： G02B6/36 ,  B29C65/00

CPC分类号： G02B6/4204 ,  G02B6/4239 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02438 ,  Y10T156/10

摘要： An optical transmission module is provided which has excellent long-term reliability, high manufacturing efficiency and a smaller optical output loss and which facilitate its downsizing, weight saving and high integration. The optical transmission module is provided with a first optical device 118 placed on an output side, a second optical device 122 placed on the first optical device 118 aligned with an optical axis of the first optical device 118, a package 111 including the first and second optical devices 118 and 122, and an optical fiber 115 configured to guide light emitted from the first optical device 118 to the outside of the package 111. The first optical device 118 and the second optical device 122 are in close contact with each other on the surface perpendicular to the optical axis.

摘要翻译： 提供了一种光传输模块，其具有优异的长期可靠性，高制造效率和较小的光输出损耗，并且便于其小型化，减轻重量并且高集成度。 光传输模块设置有放置在输出侧的第一光学装置118，放置在与第一光学装置118的光轴对准的第一光学装置118上的第二光学装置122，包括第一和第二光学装置118的封装111 光学器件118和122以及被配置为将从第一光学器件118发射的光引导到封装111的外部的光纤115.第一光学器件118和第二光学器件122彼此紧密接触 垂直于光轴的表面。

公开(公告)号：US20070003189A1

公开(公告)日：2007-01-04

申请号：US11423172

申请日：2006-06-09

申请人： Taro Kaneko ,  Mitsunori Kanemoto

发明人： Taro Kaneko ,  Mitsunori Kanemoto

IPC分类号： G02B6/26

CPC分类号： G02B6/4204 ,  G02B6/422

摘要： An optical communication module is fabricated to include a refraction plate made of an inorganic material whose refractive index varies little with temperature. The refraction plate is inserted in the optical path to perform optical axis compensation in a single lens system with long focal length.

摘要翻译： 光通信模块被制造成包括由折射率随温度变化很小的无机材料制成的折射板。 折射板被插入到光路中以在具有长焦距的单个透镜系统中执行光轴补偿。

公开(公告)号：US07977127B2

公开(公告)日：2011-07-12

申请号：US12063555

申请日：2006-08-21

申请人： Mitsunori Kanemoto ,  Tarou Kaneko

发明人： Mitsunori Kanemoto ,  Tarou Kaneko

IPC分类号： H01L25/075 ,  H01L21/77

CPC分类号： H04B10/40 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/424 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4257 ,  G02B6/4271 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/50

摘要： To accommodate a plurality of optical semiconductor elements in one package with their optical axes aligned highly precisely.An optical transmission module includes an optical transmission unit, a carrier to become a base, a semiconductor optical amplification element mounted on the carrier through a first sub-carrier, first and second lenses fixed on the carrier through first and second lens holders, an element supporting member and an optical isolator fixed on the carrier, a third lens holder supported by the element supporting member, a third lens and a small carrier individually fixed in the third lens holder, and a semiconductor laser element mounted on the small carrier through a second sub-carrier.

摘要翻译： 为了在一个封装中容纳多个光学半导体元件，其光轴高精度地对准。 光传输模块包括光传输单元，成为基座的载体，通过第一副载体安装在载体上的半导体光放大元件，通过第一和第二透镜保持器固定在载体上的第一和第二透镜，元件 支撑构件和固定在载体上的光隔离器，由元件支撑构件支撑的第三透镜架，分别固定在第三透镜保持器中的第三透镜和小载体，以及通过第二透镜保持器安装在小载体上的半导体激光元件 子载体

公开(公告)号：US20090153949A1

公开(公告)日：2009-06-18

申请号：US12063555

申请日：2006-08-21

申请人： Mitsunori Kanemoto ,  Tarou Kaneko

发明人： Mitsunori Kanemoto ,  Tarou Kaneko

IPC分类号： H01S5/50 ,  G02B7/02 ,  B23K28/00

CPC分类号： H04B10/40 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/424 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4257 ,  G02B6/4271 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/50

摘要： [Problems] To accommodate a plurality of optical semiconductor elements in one package with their optical axes aligned highly precisely.[Means for Solving the Problems] An optical transmission module includes an optical transmission unit, a carrier to become a base, a semiconductor optical amplification element mounted on the carrier through a first sub-carrier, first and second lenses fixed on the carrier through first and second lens holders, an element supporting member and an optical isolator fixed on the carrier, a third lens holder supported by the element supporting member, a third lens and a small carrier individually fixed in the third lens holder, and a semiconductor laser element mounted on the small carrier through a second sub-carrier.

摘要翻译： [问题]为了容纳多个光学半导体元件在一个封装中，其光轴高精度地对准。 解决问题的手段光传输模块包括光传输单元，成为基座的载体，通过第一副载体安装在载体上的半导体光放大元件，第一和第二透镜，其通过第一 和第二透镜保持器，固定在载体上的元件支撑构件和光隔离器，由元件支撑构件支撑的第三透镜保持器，第三透镜​​和单独固定在第三透镜保持器中的小载体，以及安装 在小载体上通过第二副载波。

公开(公告)号：US08192093B2

公开(公告)日：2012-06-05

申请号：US12303906

申请日：2007-05-30

申请人： Mitsunori Kanemoto ,  Taro Kaneko ,  Mitsuru Kurihara

发明人： Mitsunori Kanemoto ,  Taro Kaneko ,  Mitsuru Kurihara

IPC分类号： G02B6/36

CPC分类号： G02B6/4204 ,  G02B6/4239 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02438 ,  Y10T156/10

摘要： An optical transmission module is provided which has excellent long-term reliability, high manufacturing efficiency and a smaller optical output loss and which facilitate its downsizing, weight saving and high integration. The optical transmission module is provided with a first optical device 118 placed on an output side, a second optical device 122 placed on the first optical device 118 aligned with an optical axis of the first optical device 118, a package 111 including the first and second optical devices 118 and 122, and an optical fiber 115 configured to guide light emitted from the first optical device 118 to the outside of the package 111. The first optical device 118 and the second optical device 122 are in close contact with each other on the surface perpendicular to the optical axis.

摘要翻译： 提供了一种光传输模块，其具有优异的长期可靠性，高制造效率和较小的光输出损耗，并且便于其小型化，减轻重量和高集成度。 光传输模块设置有放置在输出侧的第一光学装置118，放置在与第一光学装置118的光轴对准的第一光学装置118上的第二光学装置122，包括第一和第二光学装置118的封装111 光学器件118和122以及被配置为将从第一光学器件118发射的光引导到封装111的外部的光纤115.第一光学器件118和第二光学器件122彼此紧密接触 垂直于光轴的表面。

公开(公告)号：US06962281B2

公开(公告)日：2005-11-08

申请号：US10436088

申请日：2003-05-13

申请人： Mitsunori Kanemoto ,  Hiromi Sueda ,  Keiji Takamura

发明人： Mitsunori Kanemoto ,  Hiromi Sueda ,  Keiji Takamura

IPC分类号： H01L21/607 ,  B23K20/00 ,  B23K20/10 ,  H01L21/52 ,  H01L21/60 ,  B23K1/06 ,  B23K5/20 ,  B23K31/12 ,  B23K37/00

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K20/10 ,  B23K20/106 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

摘要： In a bonding apparatus having an ultrasonic horn 3 coupled to an ultrasonic vibrator 5 and a bonding tool 4 coupled to the ultrasonic horn 3, and applying ultrasonic bonding to a work 11, by providing an ultrasonic detector 7 and an indicator 8 for displaying an output signal from the ultrasonic detector 7, there is obtained a bonding method that can easily make a good or bad judgment on the bonding state based on the output signal of the ultrasonic detector. With this arrangement, ultrasonic vibration of the bonding tool in the bonding apparatus using ultrasonic waves is constantly monitored, thereby reducing occurrence of bonding failure and making definite the time for replacing the bonding tool.

摘要翻译： 在具有耦合到超声波振动器5的超声波喇叭3和耦合到超声波喇叭3的接合工具4的接合装置中，并且通过提供超声波检测器7和用于显示输出的指示器8对工件11施加超声波接合 来自超声波检测器7的信号，获得了可以根据超声波检测器的输出信号容易地对接合状态判断良好的接合方法。 通过这种布置，不断地监测使用超声波的接合装置中的接合工具的超声波振动，从而减少接合失败的发生，并确定更换接合工具的时间。

公开(公告)号：US07641401B2

公开(公告)日：2010-01-05

申请号：US10877685

申请日：2004-06-25

申请人： Masahiko Namiwaka ,  Mitsunori Kanemoto

发明人： Masahiko Namiwaka ,  Mitsunori Kanemoto

IPC分类号： G02B6/36

CPC分类号： G02B6/4237

摘要： Disclosed are an optical element holder and an optical communication module. The optical element holder comprises a pedestal having a pair of fixing sections, a pair of holding sections and a stress-suppressing section. The fixing sections are formed in opposing end portions of the pedestal for being welded to a carrier. The holding sections are formed to face the pedestal in an inner position than positions where the fixing sections are formed so as to hold the optical element by pinching it therebetween. The stress-suppressing section prevents a welding stress, which is generated when the fixing sections are welded to the carrier, from affecting the holding sections.

摘要翻译： 公开了一种光学元件支架和光通信模块。 光学元件保持器包括具有一对固定部，一对保持部和应力抑制部的基座。 固定部形成在基座的相对的端部，用于焊接到托架上。 保持部形成为在比固定部形成的位置处于内侧的位置上面对基座，以便通过在其间夹持光学元件来保持光学元件。 应力抑制部防止了当固定部分焊接到承载件时产生的焊接应力对保持部分的影响。

公开(公告)号：US6084310A

公开(公告)日：2000-07-04

申请号：US63055

申请日：1998-04-21

申请人： Hideki Mizuno ,  Mitsunori Kanemoto

发明人： Hideki Mizuno ,  Mitsunori Kanemoto

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48

CPC分类号： H01L23/49562 ,  H01L21/565 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079

摘要： In a semiconductor device, each of a plurality of leads has a chip mounting portion electrically connected to the semiconductor chip through a bump and a lead main body supporting the chip mounting portion. A lead path from the distal end of the lead main body to the bump is bent in X, Y, and Z directions so that the distal end portion of the lead main body and the chip mounting portion are arranged on different levels when viewed from a side surface. The lead main body and the chip mounting portion substantially make a right angle to form an L shape when viewed from an upper side. The semiconductor chip is connected, through bumps, to upper surfaces of distal end portions of the chip mounting portions of the leads on a plane. A molded body seals constituent elements except a part separated from a connection portion between the lead main body and the chip mounting portion, and incorporates a bent portion of the lead main body. Each lead is arranged such that the chip mounting portions are arranged on both sides of a centerline of the semiconductor device in a longitudinal direction to be parallel to the centerline. The L-shaped leads are arranged on one side such that the chip mounting portions oppose each other on a plane. A lead frame and lead bonding are also disclosed.

摘要翻译： 在半导体器件中，多个引线中的每一个具有通过凸块电连接到半导体芯片的芯片安装部分和支撑芯片安装部分的引线主体。 从引线主体的远端到凸块的引导路径在X，Y和Z方向上弯曲，使得当从主体的主体和芯片安装部分的前端部分 侧面。 当从上侧观察时，引线主体和芯片安装部分基本上成直角形成L形。 半导体芯片通过凸块连接到平面上引线的芯片安装部分的远端部分的上表面。 成型体密封构成元件，除了与引线主体和芯片安装部分之间的连接部分分离的部分，并且包括引线主体的弯曲部分。 每个引线被布置成使得芯片安装部分在纵向方向上布置在半导体器件的中心线的两侧以平行于中心线。 L形引线布置在一侧，使得芯片安装部分在平面上彼此相对。 还公开了引线框架和引线接合。

公开(公告)号：US20110217798A1

公开(公告)日：2011-09-08

申请号：US13112584

申请日：2011-05-20

申请人： Mitsunori KANEMOTO ,  Tarou KANEKO

发明人： Mitsunori KANEMOTO ,  Tarou KANEKO

IPC分类号： H01L21/50

CPC分类号： H04B10/40 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/424 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4257 ,  G02B6/4271 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/50

摘要： [Problems] To accommodate a plurality of optical semiconductor elements in one package with their optical axes aligned highly precisely.[Means for Solving the Problems] An optical transmission module includes an optical transmission unit, a carrier to become a base, a semiconductor optical amplification element mounted on the carrier through a first sub-carrier, first and second lenses fixed on the carrier through first and second lens holders, an element supporting member and an optical isolator fixed on the carrier, a third lens holder supported by the element supporting member, a third lens and a small carrier individually fixed in the third lens holder, and a semiconductor laser element mounted on the small carrier through a second sub-carrier.

摘要翻译： [问题]为了容纳多个光学半导体元件在一个封装中，其光轴高精度地对准。 解决问题的手段光传输模块包括光传输单元，成为基座的载体，通过第一副载体安装在载体上的半导体光放大元件，第一和第二透镜，其通过第一 和第二透镜保持器，固定在载体上的元件支撑构件和光隔离器，由元件支撑构件支撑的第三透镜保持器，第三透镜​​和单独固定在第三透镜保持器中的小载体，以及安装 在小载体上通过第二副载波。