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公开(公告)号：US20090183903A1
公开(公告)日：2009-07-23
申请号：US12382560
申请日：2009-03-18
Applicant: Choon-Keun Lee , Myeong-Ho Hong , Senug-Hyun Ra
Inventor： Choon-Keun Lee , Myeong-Ho Hong , Senug-Hyun Ra
IPC: H05K1/09
CPC classification number: H05K3/1258 , H05K3/0014 , H05K3/005 , H05K3/107 , H05K3/125 , H05K2201/09036 , H05K2203/0108 , H05K2203/013 , H05K2203/1189 , Y10T29/49128 , Y10T29/49131 , Y10T29/49135 , Y10T29/49155
Abstract: A printed circuit board print (PCB) having an insulation layer; an intaglio pattern formed by depressing a part of the insulation layer corresponding to a location where a circuit pattern is to be formed; and conductive ink forming the circuit pattern by filling the intaglio pattern. A method of manufacturing the PCB includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal. Also, the circuit pattern CAD data used in the manufacturing of an imprinting stamper can be utilized again in the ink-jet printing process.
Abstract translation: 具有绝缘层的印刷电路板印刷（PCB） 通过按压与要形成电路图案的位置相对应的绝缘层的一部分而形成的凹版图案; 以及通过填充凹版图案形成电路图案的导电油墨。 一种制造PCB的方法包括：使用电路图案数据，使印模压模与电路图形数据相对应地形成一个减压图案，通过将压印模压在绝缘层上形成与减压图案对应的凹版图案，并形成 通过使用电路图案数据的喷墨法将导电油墨印刷在凹版图案中的电路图案允许通过在通过压印方法处理的凹槽中注入导电油墨而将电路图案形成所需厚度，并且防止 在含金属的导电油墨的固化过程中油墨的扩散和图案形状的变形。 此外，在喷墨打印过程中可以再次使用用于制造压印压模的电路图案CAD数据。
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公开(公告)号：US20080054518A1
公开(公告)日：2008-03-06
申请号：US11896103
申请日：2007-08-29
Applicant: Seung-Hyun RA , Myeong-Ho HONG , Hyuk-Soo LEE , Jung-Woo LEE , Jeong-Bok KWAK
Inventor： Seung-Hyun RA , Myeong-Ho HONG , Hyuk-Soo LEE , Jung-Woo LEE , Jeong-Bok KWAK
IPC: B29C33/38
CPC classification number: B29C33/3878 , H05K3/0014 , H05K2203/0108
Abstract: A method of manufacturing a stamper is disclosed. By using a method that includes: manufacturing a small stamper, in which a first relievo is formed; repeatedly imprinting the small stamper on a large master mold to form a first intaglio corresponding to the first relievo; and molding such that a second relievo is formed, which is in correspondence with the first intaglio, a broad stamper having identical repeated patterns may be manufactured.
Abstract translation: 公开了制造压模的方法。 通过使用包括：制造其中形成有第一缓冲器的小型压模的方法; 将小压模重复地压印在大型模具上以形成对应于第一减压器的第一凹版; 并且成型为形成与第一凹版对应的第二缓冲器，可以制造具有相同重复图案的宽压模。
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公开(公告)号：US20080008824A1
公开(公告)日：2008-01-10
申请号：US11819720
申请日：2007-06-28
Applicant: Jae-Choon Cho , Myeong-Ho Hong , Senug-Hyun Ra , Hyuk-Soo Lee , Jeong-Bok Kwak , Jung-Woo Lee , Choon-Keun Lee , Sang-Moon Lee
Inventor： Jae-Choon Cho , Myeong-Ho Hong , Senug-Hyun Ra , Hyuk-Soo Lee , Jeong-Bok Kwak , Jung-Woo Lee , Choon-Keun Lee , Sang-Moon Lee
IPC: H05K3/46
CPC classification number: H05K1/09 , H05K3/0014 , H05K3/107 , H05K2201/0329 , H05K2203/0108 , H05K2203/0796
Abstract: The present invention relates to a method for manufacturing a printed circuit board, more particularly to a method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board according to certain aspects of the invention as set forth above, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by a new technique of forming conductive polymer wiring using imprinting.
Abstract translation: 本发明涉及一种印刷电路板的制造方法，更具体地说，涉及一种印刷电路板的制造方法，其中使用压印法在基板上选择性地标记导电聚合物聚合的氧化剂，并且导电的单体 聚合物以选定的图案填充并聚合，以提供导电聚合物布线图案。 根据如上所述的根据本发明的某些方面的印刷电路板的制造方法，印刷电路板可以被给予更细的布线宽度，以允许高度集成的高效印刷电路板。 因此，可以通过使用压印形成导电聚合物布线的新技术，制造适用于工业，文书和家用电子电子产品的印刷电路板（PCB）或柔性印刷电路板（FPCB）。
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公开(公告)号：US08216503B2
公开(公告)日：2012-07-10
申请号：US11819720
申请日：2007-06-28
Applicant: Jae-Choon Cho , Myeong-Ho Hong , Senug-Hyun Ra , Hyuk-Soo Lee , Jeong-Bok Kwak , Jung-Woo Lee , Choon-Keun Lee , Sang-Moon Lee
Inventor： Jae-Choon Cho , Myeong-Ho Hong , Senug-Hyun Ra , Hyuk-Soo Lee , Jeong-Bok Kwak , Jung-Woo Lee , Choon-Keun Lee , Sang-Moon Lee
CPC classification number: H05K1/09 , H05K3/0014 , H05K3/107 , H05K2201/0329 , H05K2203/0108 , H05K2203/0796
Abstract: A method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by forming conductive polymer wiring using imprinting.
Abstract translation: 一种印刷电路板的制造方法，其中使用压印法在基板上选择性地标记可聚合导电聚合物的氧化剂，并且将导电聚合物的单体填充到所选择的图案中并聚合，以提供导电聚合物布线图案 。 通过制造印刷电路板的方法，可以使印刷电路板具有更好的布线宽度，以允许高度集成的高效印刷电路板。 因此，通过使用压印形成导电聚合物布线，可以制造适用于工业，文书和家用电子产品的印刷电路板（PCB）或柔性印刷电路板（FPCB）。
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公开(公告)号：US08187518B2
公开(公告)日：2012-05-29
申请号：US11713608
申请日：2007-03-05
Applicant: Choon-Keun Lee , Myeong-Ho Hong , Seung-Heon Han , Senug-Hyun Ra
Inventor： Choon-Keun Lee , Myeong-Ho Hong , Seung-Heon Han , Senug-Hyun Ra
CPC classification number: H05K3/045 , H05K3/107 , H05K3/108 , H05K3/386 , H05K2203/0108 , Y10S977/887 , Y10T428/24917
Abstract: While releasing property between a resin layer and an imprinting mold is given by using a metal thin film layer, a method for manufacturing a substrate advantageous for forming a conductive layer by plating and a substrate manufactured by the method are provided. According to one aspect of the present invention, a method for manufacturing a substrate by imprinting, the method comprising: laminating a metal thin film layer on top of a resin layer; pressurizing the resin layer and the metal thin film layer by an imprinting mold which comprises a side having a pattern in correspondence with a wiring pattern; curing a resin which forms the resin layer; and removing the imprinting mold from the resin layer and the metal thin film layer, may be presented.
Abstract translation: 通过使用金属薄膜层来赋予树脂层和压印模具之间的剥离性，提供了有利于通过电镀形成导电层的基板的制造方法以及通过该方法制造的基板。 根据本发明的一个方面，一种通过压印制造衬底的方法，所述方法包括：在树脂层的顶部层叠金属薄膜层; 通过压印模具对树脂层和金属薄膜层加压，所述压印模具包括具有与布线图形对应的图案的一侧; 固化形成树脂层的树脂; 并且可以呈现从树脂层和金属薄膜层去除压印模具。
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Patent Agency Ranking
公开(公告)号：US20120111728A1
公开(公告)日：2012-05-10
申请号：US13283329
申请日：2011-10-27
Applicant: Suk Hyeon Cho , Myeong Ho Hong
Inventor： Suk Hyeon Cho , Myeong Ho Hong
IPC: C25D1/00
CPC classification number: H05K3/4007 , H01L21/4857 , H01L23/49822 , H01L2924/0002 , H05K3/205 , H05K2201/09745 , H05K2203/0338 , H01L2924/00
Abstract: Disclosed herein is a method of manufacturing a circuit board. The method of manufacturing a circuit board according to a preferred embodiment of the present invention is configured to include (A) forming a cavity 115 for a bump on one surface 111 of a carrier 110, (B) forming a bump 130 in the cavity 115 for the bump through an electroplating process, (C) laminating an insulating layer 140 on one surface 111 of the carrier 110 so as to apply the bump 130, (D) forming a circuit layer 150 including a via 155 connected with the bump 130 on the insulating layer 140, and (E) removing the carrier 110, whereby the process of forming separate solder balls is removed by forming the cavities 111 for the bumps in the carriers 110 to form the bumps, thereby simplifying the process of manufacturing a circuit board and reducing the lead time.
Abstract translation: 这里公开了一种制造电路板的方法。 根据本发明的优选实施例的制造电路板的方法被配置为包括（A）在载体110的一个表面111上形成用于凸块的空腔115，（B）在空腔115中形成凸块130 对于通过电镀工艺的凸块，（C）在载体110的一个表面111上层叠绝缘层140以施加凸起130，（D）形成包括与凸起130连接的通孔155的电路层150 绝缘层140和（E）去除载体110，由此通过形成用于载体110中的凸点的空腔111来形成分离的焊球的过程以形成凸起，从而简化了制造电路板的过程 并缩短交货时间。
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公开(公告)号：US20080016686A1
公开(公告)日：2008-01-24
申请号：US11785096
申请日：2007-04-13
Applicant: Choon-Keun Lee , Myeong-Ho Hong , Senug-Hyun Ra
Inventor： Choon-Keun Lee , Myeong-Ho Hong , Senug-Hyun Ra
IPC: H05K3/12
CPC classification number: H05K3/1258 , H05K3/0014 , H05K3/005 , H05K3/107 , H05K3/125 , H05K2201/09036 , H05K2203/0108 , H05K2203/013 , H05K2203/1189 , Y10T29/49128 , Y10T29/49131 , Y10T29/49135 , Y10T29/49155
Abstract: A manufacturing method of printed circuit board print is disclosed. A method of manufacturing a PCB which includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal Also, the circuit pattern CAD data used in the manufacturing of an imprinting stamper can be utilized again in the ink-jet printing process.
Abstract translation: 公开了印刷电路板印刷的制造方法。 一种制造PCB的方法，其包括使用所述电路图案数据向压印模具提供与电路图案数据相对应形成的缓冲图案，通过在所述绝缘层上压印所述压印模具来形成与所述释放图案相对应的凹版图案，以及 通过使用电路图案数据的喷墨法将导电油墨印刷在凹版图案中形成电路图案，允许通过在通过压印方法处理的凹槽中注入导电油墨而将电路图形形成所需厚度，并且防止 在用于导电油墨的金属的固化过程中油墨的扩展和图案形状的变形。此外，在喷墨打印过程中可以再次使用用于制造压印模具的电路图案CAD数据。
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公开(公告)号：US20080012168A1
公开(公告)日：2008-01-17
申请号：US11826007
申请日：2007-07-11
Applicant: Senug-Hyun Ra , Myeong-Ho Hong , Hyuk-Soo Lee , Choon-Keun Lee , Sang-Moon Lee , Jae-Choon Cho , Jung-Woo Lee , Jeong-Bok Kwak
Inventor： Senug-Hyun Ra , Myeong-Ho Hong , Hyuk-Soo Lee , Choon-Keun Lee , Sang-Moon Lee , Jae-Choon Cho , Jung-Woo Lee , Jeong-Bok Kwak
IPC: B29C43/20
CPC classification number: B29C43/021 , B29C33/303 , B29C2043/025 , H05K3/0014 , H05K3/005 , H05K3/107 , H05K2203/0108 , H05K2203/167
Abstract: A method for manufacturing printed circuit board is disclosed. With a method for manufacturing a printed circuit board which includes: (a) stacking an insulation substrate, in which a first align hole is perforated, onto a support plate, to one side of which a guide pin is joined, such that the guide pin is inserted into the first align hole, where the first align hole is formed in correspondence with the guide pin, (b) stacking an imprinting mold, in which a second align hole is perforated, onto the support plate, such that the guide pin is inserted into the second hole formed in correspondence with the guide pin, and (c) stacking and pressing a pressing plate onto the support plate, and compressing the insulation substrate and the imprinting mold together, where an intaglio pattern is formed in a surface of the insulation substrate facing the imprinting mold, in correspondence with a circuit pattern, and a raised pattern is formed in a surface of the imprinting mold facing the insulation substrate, in correspondence with the circuit pattern, the installation of expensive aligning equipment is unnecessary in aligning an imprinting mold and an insulation substrate, and it is possible to form the intaglio patterns by imprinting on several insulation substrates at the same time by collectively stacking the several imprinting molds and the insulation substrates and compressing, and to prevent defects caused by the expansion and contraction of the insulation substrate which occur during the forming of the intaglio patterns.
Abstract translation: 公开了印刷电路板的制造方法。 一种用于制造印刷电路板的方法，包括：（a）将其中穿过第一对准孔的绝缘基板堆叠在支撑板上，导向销的一侧被连接到导向销 插入到第一对准孔中，其中第一对准孔对应于引导销形成，（b）将其中穿过第二对准孔的压印模具堆叠到支撑板上，使得引导销 插入到与引导销对应形成的第二孔中，（c）将压板堆叠并按压到支撑板上，并将绝缘基板和压印模压在一起，在该表面上形成凹版图案 绝缘基板面对压印模具，与电路图形对应，并且凸起图案形成在压印模具的面对绝缘基板的表面中，与电路图案对应， 在对准压印模具和绝缘基板时不需要安装昂贵的对准设备，并且可以通过将多个压印模具和绝缘基板共同堆叠同时压印在几个绝缘基板上来形成凹版图案， 并且防止在形成凹版图案期间发生的绝缘基板的膨胀和收缩引起的缺陷。
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公开(公告)号：US20120324723A1
公开(公告)日：2012-12-27
申请号：US13448869
申请日：2012-04-17
Applicant: Myeong Ho Hong , Byung Moon Kim , Hyun Hee Ku , Soon Oh Jung , Jae Joon Lee
Inventor： Myeong Ho Hong , Byung Moon Kim , Hyun Hee Ku , Soon Oh Jung , Jae Joon Lee
IPC: H05K3/00
CPC classification number: H05K3/0097 , H05K3/4682 , H05K2203/308 , Y10T29/49124
Abstract: The present invention has been made in an effort to provide a method of manufacturing a coreless substrate that forms an opening by patterning a dry film for forming the opening onto one surface of a carrier, separating the carrier from the substrate, and removing only the dry film for forming the opening. In the present invention, since the pad can be exposed by removing only the dry film for forming the opening, a process time for forming the opening can be reduced and since a process is simple, a cost is saved.
Abstract translation: 本发明的目的在于提供一种制造无芯基板的方法，该无芯基板通过在载体的一个表面上形成开口的干膜图案化而形成开口，将载体与基板分离，并且仅去除干燥的 用于形成开口的胶片。 在本发明中，由于仅通过除去用于形成开口的干膜来露出垫，所以可以减少形成开口的处理时间，并且由于处理简单，因此节约了成本。
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公开(公告)号：US20070207297A1
公开(公告)日：2007-09-06
申请号：US11713608
申请日：2007-03-05
Applicant: Choon-Keun Lee , Myeong-Ho Hong , Seung-Heon Han , Senug-Hyun Ra
Inventor： Choon-Keun Lee , Myeong-Ho Hong , Seung-Heon Han , Senug-Hyun Ra
IPC: B32B3/00
CPC classification number: H05K3/045 , H05K3/107 , H05K3/108 , H05K3/386 , H05K2203/0108 , Y10S977/887 , Y10T428/24917
Abstract: While releasing property between a resin layer and an imprinting mold is given by using a metal thin film layer, a method for manufacturing a substrate advantageous for forming a conductive layer by plating and a substrate manufactured by the method are provided. According to one aspect of the present invention, a method for manufacturing a substrate by imprinting, the method comprising: laminating a metal thin film layer on top of a resin layer; pressurizing the resin layer and the metal thin film layer by an imprinting mold which comprises a side having a pattern in correspondence with a wiring pattern; curing a resin which forms the resin layer; and removing the imprinting mold from the resin layer and the metal thin film layer, may be presented.
Abstract translation: 通过使用金属薄膜层来赋予树脂层和压印模具之间的剥离特性，提供了有利于通过电镀形成导电层的基板的制造方法以及通过该方法制造的基板。 根据本发明的一个方面，一种通过压印制造衬底的方法，所述方法包括：在树脂层的顶部层叠金属薄膜层; 通过压印模具对树脂层和金属薄膜层加压，所述压印模具包括具有与布线图形对应的图案的一侧; 固化形成树脂层的树脂; 并且可以呈现从树脂层和金属薄膜层去除压印模具。
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