公开(公告)号：US20080128905A1

公开(公告)日：2008-06-05

申请号：US11950251

申请日：2007-12-04

申请人： In-Young LEE ,  Dong-Ho LEE ,  Nam-Seog KIM ,  Hyun-Soo CHUNG ,  Ho-Jin LEE ,  Myeong-Soo PARK

发明人： In-Young LEE ,  Dong-Ho LEE ,  Nam-Seog KIM ,  Hyun-Soo CHUNG ,  Ho-Jin LEE ,  Myeong-Soo PARK

IPC分类号： H01L23/488 ,  H01L21/44

CPC分类号： H01L23/525 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： Provided are a wafer level chip scale package in which a redistribution process is applied at a wafer level, a manufacturing method thereof, and a semiconductor chip module including the wafer level chip scale package. The wafer level chip scale package includes a semiconductor chip having a bonding pad, a first insulating layer disposed on the semiconductor chip so as to expose the bonding pad, a redistribution line disposed on the exposed bonding pad and the first insulating layer, a sacrificial layer disposed below a redistribution pad of the redistribution line, a second insulating layer disposed on the redistribution line so as to expose the redistribution pad and including a crack inducement hole disposed beside the sacrificial layer, and an external connection terminal attached to the redistribution pad.

摘要翻译： 提供了其中在晶片级应用再分配处理的晶片级芯片级封装，其制造方法以及包括晶片级芯片级封装的半导体芯片模块。 晶片级芯片级封装包括具有接合焊盘的半导体芯片，设置在半导体芯片上以暴露焊盘的第一绝缘层，设置在暴露的焊盘和第一绝缘层上的再分配线，牺牲层 设置在所述再分配线的再分配衬垫的下方，设置在所述再分配线上的第二绝缘层，以暴露所述再分配衬垫并且包括设置在所述牺牲层旁边的裂纹诱导孔，以及附接到所述再分布衬垫的外部连接端子。

公开(公告)号：US06887702B2

公开(公告)日：2005-05-03

申请号：US10258440

申请日：2001-03-30

申请人： Geun-Eog Ji ,  Myeong-Soo Park ,  Yun-Hee Kang ,  Jung-Min Seo

发明人： Geun-Eog Ji ,  Myeong-Soo Park ,  Yun-Hee Kang ,  Jung-Min Seo

IPC分类号： C12N15/09 ,  C12N1/21 ,  C12N15/70 ,  C12N15/74

CPC分类号： C12N15/70 ,  C12N15/746

摘要： The present invention relates to a new plasmid originated from (Bifidobacterium) a recombinant expression vector and transformation method using the same. More particularly, the present invention relates to a plasmid pMG1 having nucleotide sequence represented by SEQ.ID.NO.1; (Bifidobacterium longum) MG1 including the plasmid pMG1; and a shuttle vector which can be replicated in both (Bifidobacterium) and (E. coli), and comprises (Mob) gene having nucleotide sequence represented by SEQ.ID.NO.2. (Rep) gene having nucleotide sequence represented by SEQ.ID.NO.3 and a selection marker. The shuttle vector and the promoter of the present invention can be used for expressing target gene without additional purification process. The protein expressed from the target gene in (Bifidobacterium) can be added to food, therefore, the protein can be used for preparing food additives or oral vaccine, Furthermore, the potential and the possibilty of probiotics using (Bifidobacterium) can promoted through the development of the shuttle vector.

摘要翻译： 本发明涉及来自（双歧杆菌）的重组表达载体的新质粒和使用其的转化方法。 更具体地，本发明涉及具有由SEQ.ID.NO.1表示的核苷酸序列的质粒pMG1; （双歧杆菌）MG1，包含质粒pMG1; 和可以在（双歧杆菌）和（大肠杆菌）中复制的穿梭载体，并且包含具有由SEQ.ID.NO.2表示的核苷酸序列的（Mob）基因。 （Rep）基因，其具有由SEQ.ID.NO.3表示的核苷酸序列和选择标记。 本发明的穿梭载体和启动子可用于表达靶基因而无需额外的纯化过程。 从双歧杆菌中的目标基因表达的蛋白质可以添加到食品中，因此蛋白质可用于制备食品添加剂或口服疫苗。此外，使用（双歧杆菌）的益生菌的潜力和可能性可以通过开发来促进 的穿梭载体。

公开(公告)号：US07830017B2

公开(公告)日：2010-11-09

申请号：US11950251

申请日：2007-12-04

申请人： In-Young Lee ,  Dong-Ho Lee ,  Nam-Seog Kim ,  Hyun-Soo Chung ,  Ho-Jin Lee ,  Myeong-Soo Park

发明人： In-Young Lee ,  Dong-Ho Lee ,  Nam-Seog Kim ,  Hyun-Soo Chung ,  Ho-Jin Lee ,  Myeong-Soo Park

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/525 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： Provided are a wafer level chip scale package in which a redistribution process is applied at a wafer level, a manufacturing method thereof, and a semiconductor chip module including the wafer level chip scale package. The wafer level chip scale package includes a semiconductor chip having a bonding pad, a first insulating layer disposed on the semiconductor chip so as to expose the bonding pad, a redistribution line disposed on the exposed bonding pad and the first insulating layer, a sacrificial layer disposed below a redistribution pad of the redistribution line, a second insulating layer disposed on the redistribution line so as to expose the redistribution pad and including a crack inducement hole disposed beside the sacrificial layer, and an external connection terminal attached to the redistribution pad.

摘要翻译： 提供了其中在晶片级应用再分配处理的晶片级芯片级封装，其制造方法以及包括晶片级芯片级封装的半导体芯片模块。 晶片级芯片级封装包括具有接合焊盘的半导体芯片，设置在半导体芯片上以暴露焊盘的第一绝缘层，设置在暴露的焊盘和第一绝缘层上的再分配线，牺牲层 设置在所述再分配线的再分配衬垫的下方，设置在所述再分配线上的第二绝缘层，以暴露所述再分配衬垫并且包括设置在所述牺牲层旁边的裂纹诱导孔，以及附接到所述再分布衬垫的外部连接端子。