公开(公告)号：US09063356B2

公开(公告)日：2015-06-23

申请号：US12507826

申请日：2009-07-23

申请人： Takeshi Arai ,  Nobuaki Nakasu ,  Tadao Edamura ,  Noriyuki Oroku

发明人： Takeshi Arai ,  Nobuaki Nakasu ,  Tadao Edamura ,  Noriyuki Oroku

IPC分类号： C23C16/44 ,  C23C16/00 ,  C23C16/52 ,  G02F1/13

CPC分类号： G02F1/1309

摘要： An object of the present invention is to provide a method for repairing a display device according to which a wide variety of regions can be repaired in various ways using various materials, as well as an apparatus for the same. The present invention provides a repairing apparatus for repairing a pattern defect on a surface of a substrate in a display device where an electronic circuit pattern having the above described pattern defect is formed, characterized by having a plasma irradiation means for repairing the above described pattern defect through local irradiation of a region including the above described pattern defect with plasma.

摘要翻译： 本发明的目的是提供一种维修显示装置的方法，根据该方法可以使用各种材料以各种方式修复各种各样的区域，以及用于其的装置。 本发明提供一种在具有上述图案缺陷的电子电路图案形成的显示装置中修复基板表面上的图形缺陷的修理装置，其特征在于具有用于修复上述图案缺陷的等离子体照射装置 通过用等离子体局部照射包括上述图案缺陷的区域。

公开(公告)号：US20080024051A1

公开(公告)日：2008-01-31

申请号：US11829989

申请日：2007-07-30

申请人： Hiroyuki Tachihara ,  Akira Hatori ,  Noriyuki Oroku

发明人： Hiroyuki Tachihara ,  Akira Hatori ,  Noriyuki Oroku

IPC分类号： H01J63/04

CPC分类号： H01J31/123 ,  H01J29/862 ,  H01J2329/862

摘要： An image display device includes a vacuum envelope which is constituted of a rectangular back substrate which arranges electron sources in the vicinity of intersecting portions of image signal electrodes and scanning signal electrodes, a rectangular face substrate which includes phosphor layers and anodes, and a frame body which is connected to peripheral regions of the respective substrates. A frame width size of a frame body is set such that the long-side frame width is larger than the short-side frame width thus realizing the miniaturization and the reduction of weight of the image display device.

摘要翻译： 图像显示装置包括：真空外壳，其由在图像信号电极和扫描信号电极的交叉部附近排列电子源的矩形背面基板，包括荧光体层和阳极的矩形面基板和框体 其连接到各个基板的周边区域。 框体的框架宽度尺寸被设定为使得长边框宽度大于短边框宽度，从而实现图像显示装置的小型化和重量的减轻。

公开(公告)号：US06402014B1

公开(公告)日：2002-06-11

申请号：US09689804

申请日：2000-10-13

申请人： Kosuke Inoue ,  Asao Nishimura ,  Takamichi Suzuki ,  Teru Fujii ,  Masayuki Morishima ,  Yasuyuki Nakajima ,  Noriyuki Oroku

发明人： Kosuke Inoue ,  Asao Nishimura ,  Takamichi Suzuki ,  Teru Fujii ,  Masayuki Morishima ,  Yasuyuki Nakajima ,  Noriyuki Oroku

IPC分类号： B23K3512

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2203/0278 ,  H05K2203/0292 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

摘要翻译： 在可以应用于需要大量凸块的半导体器件的常规凸点形成方法中，对于形成凸块的材料，足够的立方体积的凸块和小的散射存在各种限制 的凸起高度。 根据本发明，使用焊球和具有多个通孔的工具，并且在工具的通孔与半导体器件的焊盘对准的条件下，将焊球充入 通孔被按压固定在垫上，然后回流以形成凸块。

公开(公告)号：US20090090784A1

公开(公告)日：2009-04-09

申请号：US12185993

申请日：2008-08-05

申请人： Noriyuki Oroku ,  Hidehiko Kando

发明人： Noriyuki Oroku ,  Hidehiko Kando

IPC分类号： G06K19/067

CPC分类号： G06K19/07749 ,  G06K19/07718

摘要： The present invention provides a sheet-shaped material containing an RFID thread. The RFID thread comprises a strip-shaped film onto one side of which a semiconductor chip containing plural bits of memory and provided with an antenna wire is bonded. The strip-shaped film has plural openings formed therethrough except where the semiconductor chip is bonded. Since intertwining occurs between paper fibers via the openings, the RFID thread is strongly fixed in the paper.

摘要翻译： 本发明提供一种包含RFID线的片状材料。 RFID线包括在其一侧上包含多个存储器并且设置有天线线的半导体芯片的条形膜。 带状膜具有形成在其中的多个开口，除了半导体芯片被接合之外。 由于通过开口在纸纤维之间发生缠结，所以RFID线牢固地固定在纸中。

公开(公告)号：US20060061256A1

公开(公告)日：2006-03-23

申请号：US11216063

申请日：2005-09-01

申请人： Noriyuki Oroku ,  Takashi Naito ,  Yuichi Sawai ,  Tetsu Ohishi

发明人： Noriyuki Oroku ,  Takashi Naito ,  Yuichi Sawai ,  Tetsu Ohishi

IPC分类号： H01J1/62

CPC分类号： H01J9/242 ,  H01J29/864 ,  H01J2329/8625

摘要： In order to obtain an image display device with ease and high reliability in which a space between a display panel and a rear panel opposite thereto is sealed with a frame spacer, in the present invention, a step is formed by partially cutting at least one inner wall of ends connected to each other of a plurality of glass members constituting the frame spacer, or the glass members are connected through a metal fitting which is inserted between ends connected to each other of the glass members.

摘要翻译： 为了获得图像显示装置，其容易且高可靠性，其中显示面板和与其相对的显示面板与后面板之间的空间用框架间隔件密封，在本发明中，通过部分地切割至少一个内部 构成框架间隔件的多个玻璃构件彼此连接的端壁，或玻璃构件通过插入在彼此连接的玻璃构件的端部之间的金属配件连接。

公开(公告)号：US07015071B2

公开(公告)日：2006-03-21

申请号：US10812869

申请日：2004-03-31

申请人： Takashi Wada ,  Noriyuki Oroku ,  Hiroshi Maki

发明人： Takashi Wada ,  Noriyuki Oroku ,  Hiroshi Maki

IPC分类号： H01L21/48

CPC分类号： H01L21/48 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/78 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00

摘要： A method of manufacture of a semiconductor device can speedily peel extremely thin chips which are laminated to an adhesive tape without generating cracks or chippings. In this regard, the head of a vibrator is brought into contact with a back surface of an adhesive tape to which a plurality of semiconductor chips are laminated. By applying longitudinal vibrations having a frequency of 1 kHz to 100 kHz and an amplitude of 1 μm to 50 μm, the chip is peeled from the adhesive tape. In applying the longitudinal vibrations to the adhesive tape, a tension in a horizontal direction is applied to the adhesive tape.

摘要翻译： 半导体器件的制造方法可以快速剥离层叠到粘合带上的极薄的芯片，而不产生裂纹或碎屑。 在这方面，使振动器的头与多个半导体芯片层叠的胶带的背面接触。 通过施加频率为1kHz至100kHz和振幅为1m至50um的纵向振动，将芯片从胶带剥离。 在向纵向振动施加纵向振动时，向胶带施加水平方向的张力。

公开(公告)号：US06770547B1

公开(公告)日：2004-08-03

申请号：US09698186

申请日：2000-10-30

申请人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

发明人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

IPC分类号： H01L2120

CPC分类号： H01L23/3157 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3114 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06102 ,  H01L2224/1403 ,  H01L2224/14515 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/01033 ,  H01L2924/01034

摘要： A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device.

摘要翻译： 一种半导体装置，其中可以在没有任何底部填充的情况下进行倒装芯片接合，并且其包括半导体器件，通过掩模印刷含有颗粒的电绝缘材料在半导体器件上形成的电绝缘层，以及形成在电学上的外部连接端子 绝缘层并与半导体器件的电极电连接。

公开(公告)号：US20100062182A1

公开(公告)日：2010-03-11

申请号：US12507826

申请日：2009-07-23

申请人： Takeshi ARAI ,  Nobuaki NAKASU ,  Tadao EDAMURA ,  Noriyuki OROKU

发明人： Takeshi ARAI ,  Nobuaki NAKASU ,  Tadao EDAMURA ,  Noriyuki OROKU

IPC分类号： C23C16/44 ,  C23C16/00 ,  C23C16/52

CPC分类号： G02F1/1309

摘要： An object of the present invention is to provide a method for repairing a display device according to which a wide variety of regions can be repaired in various ways using various materials, as well as an apparatus for the same. The present invention provides a repairing apparatus for repairing a pattern defect on a surface of a substrate in a display device where an electronic circuit pattern having the above described pattern defect is formed, characterized by having a plasma irradiation means for repairing the above described pattern defect through local irradiation of a region including the above described pattern defect with plasma.

摘要翻译： 本发明的目的是提供一种维修显示装置的方法，根据该方法可以使用各种材料以各种方式修复各种各样的区域，以及用于其的装置。 本发明提供一种在具有上述图案缺陷的电子电路图案形成的显示装置中修复基板表面上的图形缺陷的修理装置，其特征在于具有用于修复上述图案缺陷的等离子体照射装置 通过用等离子体局部照射包括上述图案缺陷的区域。

公开(公告)号：US20090096583A1

公开(公告)日：2009-04-16

申请号：US12211150

申请日：2008-09-16

申请人： Naoya Kanda ,  Noriyuki Oroku

发明人： Naoya Kanda ,  Noriyuki Oroku

IPC分类号： H04Q5/22

CPC分类号： G06K19/07749 ,  G06K19/07775 ,  G06K19/07779 ,  G06K19/07798

摘要： For protecting information stored in an RFID chip and ensuring its genuineness, radio communication between the RFID chip and an external terminal is positively intercepted when a seal type RFID tag including the RFID chip is peeled from an adherend, while ensuring solidity when the RFID tag is put on the adherend. In the seal type RFID tag which includes the RFID chip fixed on a mounting surface of a base member having an adhesive layer applied thereto and which is put on the adherend by using the adhesive layer, an antenna formed on a main surface of the RFID chip is embedded in adhesive layers together with the RFID chip and an adhesive bonding strength between the antenna and the adhesive layer is made greater than a joining strength between the antenna and the RFID chip.

摘要翻译： 为了保护存储在RFID芯片中的信息并确保其真实性，当包括RFID芯片的密封型RFID标签从被粘物剥离时，RFID芯片和外部端子之间的无线电通信被确实地拦截，同时当RFID标签为 戴上被粘物。 在包括RFID芯片的密封型RFID标签中，RFID芯片固定在具有粘合剂层的基底构件的安装面上，并且通过使用粘合剂层被放置在被粘物上，形成在RFID芯片的主表面上的天线 与RFID芯片一起嵌入粘合剂层中，并且天线和粘合剂层之间的粘合剂粘合强度大于天线和RFID芯片之间的接合强度。

公开(公告)号：US20090079574A1

公开(公告)日：2009-03-26

申请号：US12233900

申请日：2008-09-19

申请人： Noriyuki Oroku ,  Naoya Kanda ,  Hidehiko Kando ,  Kouichi Uesaka

发明人： Noriyuki Oroku ,  Naoya Kanda ,  Hidehiko Kando ,  Kouichi Uesaka

IPC分类号： G08B13/14

CPC分类号： G06K19/07749

摘要： A circuit chip having a loop-shaped antenna coil on a main surface and a tag sheet having an antenna pattern on a main surface are prepared, and the circuit chip is mounted on the main surface of the tag sheet so as not to place over the antenna pattern. The circuit chip is placed closely to the antenna pattern, and at least the half of the main surface is desirably faced against the antenna pattern. Thus, signals and/or power can be securely exchanged between the circuit chip (or antenna coil) and the antenna pattern. Therefore, a high-performance and rigid RFID tag can be obtained by roughly aligning the circuit chip and the tag sheet.

摘要翻译： 制备在主表面上具有环形天线线圈的电路芯片和在主表面上具有天线图案的标签片，并且将电路芯片安装在标签片的主表面上，以便不会放置在 天线方向图。 电路芯片靠近天线图案放置，并且至少主表面的一半期望面对天线图案。 因此，可以在电路芯片（或天线线圈）和天线图案之间可靠地交换信号和/或功率。 因此，通过粗略地对准电路芯片和标签片，可以获得高性能和刚性的RFID标签。