摘要:
A cutting state quantity caused by processing, in which a cutting tool is rotated, is measured, cutting force components containing a fundamental and harmonics are extracted from a measured signal, a threshold for abnormality determination is calculated on the basis of harmonic ratios that are ratios between the fundamental and harmonics of the cutting force components, a cutting force is calculated from the extracted cutting force components, and an abnormality is determined on the basis of the calculated cutting force and the calculated threshold.
摘要:
A region surrounded by two gate wiring and two drain wiring includes pixels and when there is a defect of short-circuit in adjacent pixel electrodes, the short-circuited portion is removed by irradiating a laser via a mask having a transmission pattern, which corresponds to a pattern of the gate wiring, drain wiring and pixel electrodes in the short-circuited portion. The above short-circuited portion is identified and removed in comparison to a normal pattern, by use of information from an inspection apparatus, and the pattern defect formed on the substrate is automatically repaired. By applying the above method to a manufacturing process of display apparatus, in particular, to a resist pattern forming process, a display apparatus having a highly qualified display property may be achieved.
摘要:
An object of the present invention is to provide a method for repairing a display device according to which a wide variety of regions can be repaired in various ways using various materials, as well as an apparatus for the same. The present invention provides a repairing apparatus for repairing a pattern defect on a surface of a substrate in a display device where an electronic circuit pattern having the above described pattern defect is formed, characterized by having a plasma irradiation means for repairing the above described pattern defect through local irradiation of a region including the above described pattern defect with plasma.
摘要:
A method for manufacturing an electronic circuit board which contains an electronic circuit on a main surface of a glass substrate according to the invention sequentially performs a step of electrically inspecting the main surface of the glass substrate on which the electronic circuit is formed, a step of specifying positions and defect types of defects on the main surface of the glass substrate, a step of calculating reference point coordinates on the main surface of the glass substrate and correcting the coordinates, a step of extracting respective defects from an image around the defects and specifying a defect to be corrected in the extracted defects by referring to a defect existing range registered in advance for each defect type, and a step of cutting the specified defect. By this method, a foreign material adhering to the glass substrate is not erroneously judged as short-circuit defect causing short-circuit on the electronic circuit, and only defect actually requiring correction can be removed.
摘要:
The present invention is directed to connection technology for providing a sufficient connection strength in bonding a wire material and a twisted wire each having a large diameter when directly bonding the wire material, which is used for a stator of an electric motor and a generator, and the twisted wire serving as a lead wire by ultrasonic bonding. A twisted wire having a plurality of core wires is hardened by ultrasonic vibration using a pressurized vibration tool when the twisted wire is connected to a wire material. After that, the twisted wire is reversed such that the hardened surface thereof faces the wire material and then comes into contact with the wire material. In this state, ultrasonic waves are applied to the hardened surface from the opposite side using the vibration tool, thereby connecting the hardened surface of the twisted wire and the wire material.
摘要:
Provided are a device and a method which determine a threshold value for detecting abnormality in a working path in which the cutting condition changes momentarily to thereby enable abnormality determination. Cutting force that becomes an abnormality determination value and threshold value information are previously calculated by cutting simulation, and a threshold value with which a comparison is to be made is determined from the position coordinates of a working machine which have been acquired during cutting and the measurement result of cutting force to thereby enable abnormality determination.
摘要:
Provided is a defect correcting device for an electronic circuit pattern, which is capable of making a defect seed obvious, and normalizing a pixel or forming a pixel into a semi-black spot. A defect correcting device for an electronic circuit pattern includes: an imaging unit for irradiating a defective portion of the electronic circuit pattern with irradiation light having a wavelength of a visible light region and a wavelength of an infrared light region, and receiving reflected light having the wavelength of the visible light region and the wavelength of the infrared light region from the electronic circuit pattern; a signal processing unit for extracting the defective portion from a picked-up image, and determining a correcting method; a laser irradiating unit for irradiating the defective portion with laser light; and a correction determining unit for determining success or failure of defect correction before and after laser irradiation.
摘要:
An object of the present invention is to provide a method for repairing a display device according to which a wide variety of regions can be repaired in various ways using various materials, as well as an apparatus for the same. The present invention provides a repairing apparatus for repairing a pattern defect on a surface of a substrate in a display device where an electronic circuit pattern having the above described pattern defect is formed, characterized by having a plasma irradiation means for repairing the above described pattern defect through local irradiation of a region including the above described pattern defect with plasma.
摘要:
The pattern defect repairing apparatus comprises an application head, a waste ejection board, a waste ejection vessel, a waste ejection board moving stage, a head lifting stage, and an application unit base. The application head comprises an ink-jet head and a head holder. An ink jet head has an ejection nozzle, and is attached to the head holder and able to be moved up and down by the head lifting stage. The waste ejection vessel is provided to the waste ejection board and able to be moved between a waste ejection position and a retreated position by the waste ejection board moving stage. Repairing material is ejected for waste onto the waste ejection board set in the vicinity of the nozzle immediately before application to repair the defect. The tip end of the nozzle is prevented from being dried.
摘要:
A region surrounded by two gate wiring and two drain wiring includes pixels and when there is a defect of short-circuit in adjacent pixel electrodes, the short-circuited portion is removed by irradiating a laser via a mask having a transmission pattern, which corresponds to a pattern of the gate wiring, drain wiring and pixel electrodes in the short-circuited portion. The above short-circuited portion is identified and removed in comparison to a normal pattern, by use of information from an inspection apparatus, and the pattern defect formed on the substrate is automatically repaired. By applying the above method to a manufacturing process of display apparatus, in particular, to a resist pattern forming process, a display apparatus having a highly qualified display property may be achieved.