公开(公告)号：US20010023829A1

公开(公告)日：2001-09-27

申请号：US09795124

申请日：2001-03-01

申请人： Obducat AB

发明人： Lennart Olsson ,  Babak Heidari

IPC分类号： C23F001/00 ,  C25F003/00 ,  C25F003/04 ,  C25F003/12 ,  C25D005/18 ,  C25D017/00 ,  C25F007/00 ,  B23H003/00 ,  B23H005/00

CPC分类号： C23F1/02 ,  C25F3/02 ,  H05K3/07

摘要： A method for plating an electrically conductive substance, which includes the steps of contacting the electrically conductive substance with a plating agent in dilute solution, in which the plating agent is present in a concentration of 200 mM at most, and subjecting the plating agent adjacent to the electrically conducive substance to an electric field.

摘要翻译： 一种电镀导电物质的方法，包括使导电物质与稀释溶液中的电镀剂接触的步骤，其中电镀剂最多以200mM的浓度存在，并将电镀物质与 对电场有利的物质。

公开(公告)号：US20240165870A1

公开(公告)日：2024-05-23

申请号：US18549312

申请日：2022-03-05

申请人： OBDUCAT AB

发明人： Prasanna Venkatesh KRISHNAN

IPC分类号： B29C59/00 ,  B29C59/02 ,  B29K23/00 ,  B29K25/00 ,  B29K67/00 ,  B29K69/00 ,  B29K105/00 ,  G03F7/00

CPC分类号： B29C59/002 ,  B29C59/026 ,  G03F7/0002 ,  B29K2023/38 ,  B29K2025/06 ,  B29K2067/003 ,  B29K2069/00 ,  B29K2105/0085 ,  B29K2995/0012 ,  B29K2995/0077

摘要： A method for facilitating demolding of a substrate from an imprint template, the method comprising: providing (S510) the template and the substrate in a sandwich arrangement with a structured surface of the template in contact with a target surface of the substrate; applying heat (S520) to soften a molding layer on the target surface, wherein said molding layer is a thermoplastic material having a minimum glass transition temperature, Tg>50° C. and Young's modulus>1000 MPa, and wherein the molding layer is heated above Tg; pressing (S530) the sandwich arrangement together to imprint a pattern of the structured surface into the heated molding layer; submerging (S550) the sandwich arrangement in a cooling liquid to harden the molding layer; and separating (S560) the template from the patterned substrate.

公开(公告)号：US10737412B2

公开(公告)日：2020-08-11

申请号：US15526587

申请日：2015-11-18

申请人： Obducat AB

发明人： Babak Heidari ,  Göran Larsson

IPC分类号： B29C37/00 ,  B29C59/04 ,  G03F7/00 ,  B29C59/02

摘要： A demolding device for use in an imprint machine, in which a foil is intermittently passed in a feed direction over a press region where a stamp is pressed against the foil for imprinting a surface pattern. The demolding device includes a carrier, a pressing roller mounted in the carrier, and a demolding roller mounted parallel to the pressing roller in the carrier, wherein the carrier is configured to slide over the press region against the feed direction while rolling the foil under the pressing roller and over the demolding roller for detaching the foil from the stamp after imprinting of the pattern.

公开(公告)号：US20180036761A1

公开(公告)日：2018-02-08

申请号：US15562006

申请日：2016-03-23

申请人： OBDUCAT AB

发明人： Pirmin MUFFLER

IPC分类号： B05C13/00 ,  B05C11/08 ,  B05D1/00 ,  H01L21/683 ,  H01L21/687

CPC分类号： B05C13/00 ,  B05C11/08 ,  B05D1/005 ,  H01L21/6838 ,  H01L21/68742

摘要： A rotary plate for holding a substrate for a coating device, which rotary plate comprises a plurality of suction points, is intended to be characterized by an annular elevation, wherein a diameter of the annular elevation substantially corresponds to a diameter of the substrate.

公开(公告)号：US10919071B2

公开(公告)日：2021-02-16

申请号：US15562006

申请日：2016-03-23

申请人： OBDUCAT AB

发明人： Pirmin Muffler

IPC分类号： B05D3/12 ,  B05C13/00 ,  H01L21/683 ,  H01L21/687 ,  B05C11/08 ,  B05D1/00 ,  H01L21/67

摘要： A rotary plate for holding a substrate for a coating device, which rotary plate comprises a plurality of suction points, is intended to be characterized by an annular elevation, wherein a diameter of the annular elevation substantially corresponds to a diameter of the substrate.

公开(公告)号：US20170320244A1

公开(公告)日：2017-11-09

申请号：US15526587

申请日：2015-11-18

申请人： Obducat AB

发明人： Babak HEIDARI ,  Göran LARSSON

IPC分类号： B29C37/00 ,  G03F7/00 ,  B29C59/04

摘要： A demolding device for use in an imprint machine, in which machine a foil is intermittently passed in a feed direction over a press region where a stamp is pressed against the foil for imprinting a surface pattern. The demolding device includes a carrier, a pressing roller mounted in the carrier, and a demolding roller mounted parallel to the pressing roller in the carrier, wherein the carrier is configured to slide over the press region against the feed direction while rolling the foil under the pressing roller and over the demolding roller for detaching the foil from the stamp after imprinting of the pattern.