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公开(公告)号：US20210259741A1
公开(公告)日：2021-08-26
申请号：US17315445
申请日：2021-05-10
摘要： Embodiments systems and methods for a platform that is configured to hold a medical device. In embodiments, a physician, nurse, medical practitioner, etc. may perform actions to change the positioning and orientation of the medical device while the medical device is secured to the platform. In further embodiments, the platform may include robotic components configured to change the positioning and orientation of the medical device.
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公开(公告)号：US10765840B2
公开(公告)日：2020-09-08
申请号：US15245447
申请日：2016-08-24
摘要： A content inflation and delivery system including a container including a fluid inlet in fluid communication with a fluid outlet; wherein the fluid outlet is positioned between the fluid inlet and a second end of the container. The system also includes an inflatable content being configured for inflation and delivery from the second end of the container.
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公开(公告)号：US10398423B2
公开(公告)日：2019-09-03
申请号：US15709615
申请日：2017-09-20
摘要： A medical device of the present invention includes one or more anchors and an elongated member. Advantageously, the elongated member may be coupled to the anchors. The elongated member and anchors are configured to generate a force on a mesentery. The force is sufficient to retract a bowel of the patient into an upper portion of an abdominal cavity of the patient. When the patient is in a slightly angled position, the weight of the medical device pulls the mesentery into the upper abdomen. Since the bowel is connected to the mesentery, the device also indirectly pulls up the bowel. In some implementations of the device, a slight angle may be unnecessary. In others, the device may also inversely retract the mesentery and attached organs into the lower abdomen to facilitate surgical access to the upper abdomen. In some implementations of the device, a slight angle may be unnecessary.
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公开(公告)号：US20180161054A1
公开(公告)日：2018-06-14
申请号：US15879546
申请日：2018-01-25
CPC分类号： A61B17/32002 , A61B2017/00398 , A61B2017/00818 , A61B2017/320024 , A61B2017/320064 , A61B2090/08021 , A61B2217/005
摘要： Embodiments described a shield for a surgical morcellator. Specifically, embodiments disclose a denticulate shield for the distal tip of a surgical morcellator with notches, wherein the notches are configured to catch loose morcellated tissue and prevent the loose morcellated tissue from being falling or remaining into the patient.
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公开(公告)号：US09926623B2
公开(公告)日：2018-03-27
申请号：US15061566
申请日：2016-03-04
申请人： Brad Lemon , Joseph Hirt , Timothy Welling , James G. Daily, III , David Meendering , Gary Rozak , Jerome O'Grady , Prabhat Kumar , Steven A. Miller , Rong-chein Richard Wu , David G. Schwartz
发明人： Brad Lemon , Joseph Hirt , Timothy Welling , James G. Daily, III , David Meendering , Gary Rozak , Jerome O'Grady , Prabhat Kumar , Steven A. Miller , Rong-chein Richard Wu , David G. Schwartz
IPC分类号： C23C14/34 , B22F3/16 , C22C1/04 , C22C27/04 , C23C14/35 , C23C14/46 , B22F1/00 , B22F5/00 , C21D8/02 , C22F1/18 , C23C14/14 , B22F3/24
CPC分类号： C23C14/3414 , B22F1/0003 , B22F3/16 , B22F3/162 , B22F3/24 , B22F5/006 , B22F2003/248 , B22F2301/20 , B22F2998/00 , B22F2998/10 , C21D8/0221 , C21D8/0247 , C22C1/045 , C22C27/04 , C22F1/18 , C23C14/14 , C23C14/3478 , C23C14/3485 , C23C14/35 , C23C14/46 , B22F3/172 , B22F3/20 , B22F3/04 , B22F3/10
摘要： In various embodiments, sputtering targets are formed by introducing molybdenum powder into a sheet bar mold, pressing the powder to form a sheet bar, sintering the sheet bar to form an ingot having a density of at least 90% of a theoretical density, preheating the ingot, rolling the ingot to form a plate, and heat treating the plate.
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公开(公告)号：US20170319759A1
公开(公告)日：2017-11-09
申请号：US15659703
申请日：2017-07-26
IPC分类号： A61M1/00
CPC分类号： A61M1/008 , A61M1/0035 , A61M1/0039 , A61M1/0045 , A61M1/0064 , A61M1/0084
摘要： An embodiment includes a suction device handle for use with a vacuum supply conduit to suction a fluid or tissue, the handle comprising: a hand-grippable body defining a chamber; the hand-grippable body comprising a distal end configured to support a suction tip; the suction tip including a distal end of a vacuum supply conduit extending within an outer cannula, the vacuum supply conduit being offset from a distal end of the outer cannula by a predetermined distance; wherein the distal end of the hand grippable body is connected to a proximal end of the outer cannula and the chamber is connected in fluid communication with the suction pressure or vacuum generated at the distal end of the vacuum supply conduit. Additional embodiments are described herein.
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公开(公告)号：US09639696B1
公开(公告)日：2017-05-02
申请号：US11541159
申请日：2006-09-29
CPC分类号： G06F21/56 , G06F8/60 , G06F21/50 , G06F21/55 , G06Q2220/16 , G06Q2220/18
摘要： A method and apparatus for analyzing end user license agreements and taking action based on the analysis outcome. In one embodiment, the method includes sensing initialization of an installable software program installation, extracting a EULA from the installable during installation, pausing presentation of the EULA to a user, providing a database of suspect terms, analyzing whether a suspect term exists in the EULA, and presenting at least one of the EULA or a suspect term to the user.
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公开(公告)号：US20170000932A9
公开(公告)日：2017-01-05
申请号：US14572843
申请日：2014-12-17
IPC分类号： A61M1/00
CPC分类号： A61M1/008 , A61M1/0035 , A61M1/0039 , A61M1/0045 , A61M1/0064 , A61M1/0084
摘要： An embodiment includes a suction device handle for use with a vacuum supply conduit to suction a fluid or tissue, the handle comprising: a hand-grippable body defining a chamber; the hand-grippable body comprising a distal end configured to support a suction tip; the suction tip including a distal end of a vacuum supply conduit extending within an outer cannula, the vacuum supply conduit being offset from a distal end of the outer cannula by a predetermined distance; wherein the distal end of the hand grippable body is connected to a proximal end of the outer cannula and the chamber is connected in fluid communication with the suction pressure or vacuum generated at the distal end of the vacuum supply conduit. Additional embodiments are described herein.
摘要翻译： 一个实施例包括用于与真空供应导管一起用于抽吸流体或组织的抽吸装置手柄，所述手柄包括：限定腔室的可手握主体; 所述可手握的主体包括构造成支撑吸嘴的远端; 所述吸嘴包括在外插管内延伸的真空供应管道的远端，所述真空供应管道从所述外套管的远端偏移预定距离; 其中手可抓握主体的远端连接到外套管的近端，并且腔室与在真空供应管道的远端处产生的吸入压力或真空流体连通地连接。 本文描述了另外的实施例。
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9.发明申请UV-CURE PRE-TREATMENT OF CARRIER FILM FOR WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH 有权使用混合激光扫描和等离子体蚀刻方法进行波长涂覆的载体膜的UV固化预处理公开(公告)号：US20160315009A1
公开(公告)日：2016-10-27
申请号：US14697391
申请日：2015-04-27
申请人： Wei-Sheng Lei , Brad Eaton , Jungrae Park , Ajay Kumar , James S. Papanu , Prabhat Kumar
发明人： Wei-Sheng Lei , Brad Eaton , Jungrae Park , Ajay Kumar , James S. Papanu , Prabhat Kumar
IPC分类号： H01L21/78 , H01L21/683 , H01L21/268 , H01L21/67 , H01L21/308 , H01L21/3065
CPC分类号： H01L21/78 , H01L21/268 , H01L21/3065 , H01L21/3086 , H01L21/67069 , H01L21/67207 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381
摘要： Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits on a front side of the semiconductor wafer includes adhering a back side the semiconductor wafer on the dicing tape of a substrate carrier. Subsequent to adhering the semiconductor wafer on a dicing tape, the dicing tape is treated with a UV-cure process. Subsequent to treating the dicing tape with the UV-cure process, a dicing mask is formed on the front side of the semiconductor wafer, the dicing mask covering and protecting the integrated circuits. The dicing mask is patterned with a laser scribing process to provide gaps in the dicing mask, the gaps exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is plasma etched through the gaps in the dicing mask layer to singulate the integrated circuits.
摘要翻译： 对具有多个集成电路的每个晶片进行切割的半导体晶片的方法进行了说明。 在一个示例中，在半导体晶片的正面上切割具有多个集成电路的半导体晶片的方法包括将半导体晶片的背面粘附在基板载体的切割带上。 在将半导体晶片粘附在切割带上之后，用UV固化工艺处理切割带。 在通过UV固化处理处理切割带之后，在半导体晶片的前侧形成切割掩模，该切割掩模覆盖并保护集成电路。 用激光刻划工艺对切割掩模进行图案化，以在切割掩模之间提供间隙，在半导体晶片的间隙暴露在集成电路之间。 通过切割掩模层中的间隙对半导体晶片进行等离子体蚀刻，以对集成电路进行分离。
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公开(公告)号：US20160175496A1
公开(公告)日：2016-06-23
申请号：US14572843
申请日：2014-12-17
IPC分类号： A61M1/00
CPC分类号： A61M1/008 , A61M1/0035 , A61M1/0039 , A61M1/0045 , A61M1/0064 , A61M1/0084
摘要： An embodiment includes a suction device handle for use with a vacuum supply conduit to suction a fluid or tissue, the handle comprising: a hand-grippable body defining a chamber; the hand-grippable body comprising a distal end configured to support a suction tip; the suction tip including a distal end of a vacuum supply conduit extending within an outer cannula, the vacuum supply conduit being offset from a distal end of the outer cannula by a predetermined distance; wherein the distal end of the hand grippable body is connected to a proximal end of the outer cannula and the chamber is connected in fluid communication with the suction pressure or vacuum generated at the distal end of the vacuum supply conduit. Additional embodiments are described herein.
摘要翻译： 一个实施例包括用于与真空供应导管一起用于抽吸流体或组织的抽吸装置手柄，所述手柄包括：限定腔室的可手握主体; 所述可手握的主体包括构造成支撑吸嘴的远端; 所述吸嘴包括在外插管内延伸的真空供应管道的远端，所述真空供应管道从所述外套管的远端偏移预定距离; 其中手可抓握主体的远端连接到外套管的近端，并且腔室与在真空供应管道的远端处产生的吸入压力或真空流体连通地连接。 本文描述了另外的实施例。
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