Abstract:
Apparatuses and methods can include write schemes for a thyristor memory cell in which an access pulse applied to the gate of the thyristor memory cell is adjusted relative to the data pulse to write data into the thyristor memory cell. Some of the write schemes may substantially reduce or eliminate an unselected data line disturb. In various embodiments, the thyristor memory cell can be structured with two control nodes and its cathode or anode coupled to a reference voltage node common to all thyristor memory cells in a memory array. Additional apparatuses and methods are disclosed.
Abstract:
Arrays of memory cells having a common gate terminal and methods of operating and forming the same are described herein. As an example, an array of memory cells may include a group of memory cells each having a resistive storage element coupled to a select device. Each select device includes a first terminal, a second terminal, and a gate terminal, where the gate terminal is common to each memory cell of the group.
Abstract:
A method of fabricating a thyristor-based memory may include forming different opposite conductivity-type regions in silicon for defining a thyristor and an access device in series relationship. An activation anneal may activate dopants previously implanted for the different regions. A damaging implant of germanium or xenon or argon may be directed into select regions of the silicon including at least one p-n junction region for the access device and the thyristor. A re-crystallization anneal may then be performed to re-crystallize at least some of the damaged lattice structure resulting from the damaging implant. The re-crystallization anneal may use a temperature less than that of the previous activation anneal.
Abstract:
Arrays of memory cells having a common gate terminal and methods of operating and forming the same are described herein. As an example, an array of memory cells may include a group of memory cells each having a resistive storage element coupled to a select device. Each select device includes a first terminal, a second terminal, and a gate terminal, where the gate terminal is common to each memory cell of the group.
Abstract:
Apparatuses and methods can include write schemes for a thyristor memory cell in which an access pulse applied to the gate of the thyristor memory cell is adjusted relative to the data pulse to write data into the thyristor memory cell. Some of the write schemes may substantially reduce or eliminate an unselected data line disturb. In various embodiments, the thyristor memory cell can be structured with two control nodes and its cathode or anode coupled to a reference voltage node common to all thyristor memory cells in a memory array. Additional apparatuses and methods are disclosed.
Abstract:
Embodiments of integrated circuits for mitigating against electrostatic coupling are described. In an embodiment, first gate dielectrics are respectively located over first active regions. First isolation regions are respectively located between the first active regions. Second gate dielectrics are respectively located over second active regions. Second isolation regions are respectively located between the second active regions. In an embodiment, the first active regions are approximately 20 to 80 percent shorter in height/thickness than the second active regions. In another embodiment, the first isolation regions extend above an uppermost surface of the first gate dielectrics while providing gaps between the first isolation regions and sidewalls of the first active regions for receipt of material used in formation of conductive lines. In yet another embodiment, active area stripes are narrower in width at p-base regions and n-base regions than at cathode regions and anode regions respectively thereof.
Abstract:
An integrated circuit having memory, including thyristor-based memory cells, is described, where each of the thyristor-based memory cells includes a thyristor-based storage element and an access transistor. Where the thyristor-based storage element includes an anode region and a cathode region, a pair of the thyristor-based memory cells are commonly coupled via a bitline associated with the access transistor or via a reference voltage line coupled to the anode region. Bitline or anode regions are separated from one another by an isolation region. In another configuration, a bitline region has a locally implant-damaged region to inhibit charge transfer between the pair. In yet another configuration, a storage node contact or contacts respectively can extend over or are coupled to a storage node line extending over an isolation region. In this latter configuration, a source/drain region and the cathode region are separated from one another by an isolation region.
Abstract:
A complementary Field Effect Transistor includes a first transistor and a second transistor stacked on the first transistor. The angle between the source/drain pair for the first transistor and the source/drain pair for the second transistor is nonzero and other than 180 degrees (e.g., 90 degrees). In one embodiment, each transistor has its own gate, and the active regions for the transistors are separated and situated between the gates. In another embodiment, the active regions for the transistors share a single channel region. In still another embodiment, the transistors share a single gate. In yet another embodiment, the transistors share both a channel region and a gate.
Abstract:
Some embodiments include gated bipolar junction transistors. The transistors may include a base region between a collector region and an emitter region; with a B-C junction being at an interface of the base region and the collector region, and with a B-E junction being at an interface of the base region and the emitter region. The transistors may include material having a bandgap of at least 1.2 eV within one or more of the base, emitter and collector regions. The gated transistors may include a gate along the base region and spaced from the base region by dielectric material, with the gate not overlapping either the B-C junction or the B-E junction. Some embodiments include memory arrays containing gated bipolar junction transistors. Some embodiments include methods of forming gated bipolar junction transistors.
Abstract:
Some embodiments include thyristors having first and second electrode regions, first and second base regions, and material having a bandgap of at least 1.2 eV in at least one of the regions. The first base region is between the first electrode region and the second base region, and the second base region is between the second electrode region and the first base region. The first base region interfaces with the first electrode region at a first junction, and interfaces with the second base region at a second junction. The second base region interfaces with the second electrode region at a third junction. A gate is along the first base region, and in some embodiments does not overlap either of the first and second junctions. Some embodiments include methods of programming thyristors, and some embodiments include methods of forming thyristors.